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公开(公告)号：US12082354B2
公开(公告)日：2024-09-03
申请号：US17574362
申请日：2022-01-12
Applicant: Medtronic, Inc.
Inventor： David A. Ruben , Andrew J. Ries , Pankti N. Shah , Jason D. Hamack
CPC classification number: H05K5/0095 , A61N1/3787 , H02J50/10 , H05K1/181 , H05K5/0052 , H05K2201/10015
Abstract: Various embodiments of an electronic package and implantable medical device are disclosed. The electronic package includes a nonconductive substrate having a first major surface, a second major surface, and an opening disposed through the substrate between the first major surface and the second major surface. The package also includes a conductive layer hermetically sealed to the first major surface of the substrate and over the opening; a conductor block disposed in the opening and extending beyond the second major surface of the substrate, where the conductor block is electrically connected to the conductive layer; and an electronic device disposed adjacent to the first major surface of the substrate and electrically connected to the conductive layer. The package also includes a nonconductive cover disposed over the electronic device and the nonconductive substrate and hermetically sealed to the substrate, where the electronic device is disposed within a cavity of the cover.
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公开(公告)号：US20230053875A1
公开(公告)日：2023-02-23
申请号：US17813281
申请日：2022-07-18
Applicant: Medtronic, Inc.
Inventor： Kaileigh E. Rock , Michael D. Eggen , Jason D. Hamack
Abstract: In some examples, an implantable medical device (IMD) includes a housing defined in part by a longitudinal axis, a header at a distal end of the housing, the header defining a header plane, the header plane disposed at an angle relative to a reference plane, where the reference plane is perpendicular to the longitudinal axis, a fixation mechanism extending from the header, the fixation mechanism configured to be advanced into tissue of a heart of a patient to fix at least a portion of the IMD to the heart, one or more electrodes that extend from the header and are configured to engage with the septum, and circuitry within the housing, wherein the circuitry is configured to deliver cardiac pacing to the heart via the one or more electrodes.
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Patent Agency Ranking
公开(公告)号：US20220248545A1
公开(公告)日：2022-08-04
申请号：US17574362
申请日：2022-01-12
Applicant: Medtronic, Inc.
Inventor： David A. Ruben , Andrew J. Ries , Pankti N. Shah , Jason D. Hamack
Abstract: Various embodiments of an electronic package and implantable medical device are disclosed. The electronic package includes a nonconductive substrate having a first major surface, a second major surface, and an opening disposed through the substrate between the first major surface and the second major surface. The package also includes a conductive layer hermetically sealed to the first major surface of the substrate and over the opening; a conductor block disposed in the opening and extending beyond the second major surface of the substrate, where the conductor block is electrically connected to the conductive layer; and an electronic device disposed adjacent to the first major surface of the substrate and electrically connected to the conductive layer. The package also includes a nonconductive cover disposed over the electronic device and the nonconductive substrate and hermetically sealed to the substrate, where the electronic device is disposed within a cavity of the cover.
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公开(公告)号：US20220133965A1
公开(公告)日：2022-05-05
申请号：US17086701
申请日：2020-11-02
Applicant: Medtronic, Inc.
Inventor： Pankti N. Shah , John E. Hartung , Hailiang Zhao , Jason D. Hamack , Amanda Travis
IPC: A61M1/12
Abstract: A connector block for an implanted coil of a transcutaneous energy transfer system (TETS) includes a plurality of closed slots sized and configured to receive corresponding conductors of a powerline of the implanted coil. A plurality of open slots is included. The connector block being sized and configured to be coupled to the implanted coil.
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公开(公告)号：US20220161000A1
公开(公告)日：2022-05-26
申请号：US17102807
申请日：2020-11-24
Applicant: Medtronic, Inc.
Inventor： Jason D. Hamack , Pankti N. Shah , Scott N. Tuominen
IPC: A61M25/02
Abstract: An attachment device for securing a medical device to a patient, comprising at least one layer including a flexible portion and a rigid portion. The rigid portion being connected to the flexible portion and defining at least one loop. The at least one loop including an elongate body and an anchoring element. The elongate body having a first end and a second end opposite the first end. The anchoring element being disposed circumferentially around, and connected to, the elongate body.
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公开(公告)号：US20220134092A1
公开(公告)日：2022-05-05
申请号：US17453044
申请日：2021-11-01
Applicant: Medtronic, Inc.
Inventor： Kaileigh E. Rock , Jason D. Hamack , Andrew J. Ries
Abstract: A medical system including a device head configured to be positioned in an atrium of a heart, an implantable medical device configured to be positioned within a vena cava of the heart, and a lead extending from the device head to the implantable medical device. A fixation element coupled to the device head is configured to engage tissues within the atrium. The device head includes an electrode configured to deliver therapy and/or sensing signals to tissues within the atrium using stimulation signals received from processing circuitry within the implantable medical device. The medical system may include a delivery catheter configured to allow delivery of the device head to the atrium.
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公开(公告)号：US20210170083A1
公开(公告)日：2021-06-10
申请号：US17107408
申请日：2020-11-30
Applicant: Medtronic, Inc.
Inventor： Kevin Seifert , Yong K. Cho , Michael D. Eggen , David J. Peichel , Thomas W. Radtke , Pankti Shah , Jason D. Hamack
Abstract: Various embodiments of an implantable medical device and a method of implanting such device are disclosed. The device includes a housing having a first major surface, a second major surface, a sidewall that extends between the first major surface and the second major surface, and a port disposed in the sidewall. The sidewall defines a perimeter of the housing. The device further includes an electronic component disposed within the housing, and a cable electrically connected to the electronic component disposed within the housing, where the cable extends through the port. A portion of the cable is adapted to be removably connected to the housing adjacent an outer surface of the sidewall by a fastener such that the portion of the cable extends along at least a portion of the perimeter of the housing when the portion of the cable is removably connected to the housing.
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