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公开(公告)号：US20230371401A1
公开(公告)日：2023-11-16
申请号：US18351797
申请日：2023-07-13
Applicant: Melexis Technologies SA
Inventor： Arnaud LAVILLE , Eric LAHAYE , Jian CHEN
IPC: H10N52/80 , G01R33/07 , H01L23/495 , H01L25/065 , H10N52/00
CPC classification number: H10N52/80 , G01R33/07 , H01L23/49541 , H01L23/49575 , H01L25/0657 , H10N52/101
Abstract: A sensor device comprising: a lead frame; a first/second semiconductor die having a first/second sensor structure at a first/second sensor location, and a plurality of first/second bond pads electrically connected to the lead frame; the semiconductor dies having a square or rectangular shape with a geometric center; the sensor locations are offset from the geometrical centers; the second die is stacked on top of the first die, and is rotated by a non-zero angle and optionally also offset or shifted with respect to the first die, such that a perpendicular projection of the first and second sensor location coincide.
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公开(公告)号：US20220365147A1
公开(公告)日：2022-11-17
申请号：US17876953
申请日：2022-07-29
Applicant: Melexis Technologies SA
Inventor： Gael CLOSE , Arnaud LAVILLE , Stefan RIGERT , Samuel HUBER LINDENBERGER
Abstract: The present invention relates to a field-sensor device comprising a reference field sensor providing a reference sensor signal in response to a field, a calibrated field sensor providing a calibrated sensor signal in response to the field, a reference circuit connected to the reference field sensor and adapted to receive a reference signal, and an adjustable circuit connected to the calibrated field sensor and adapted to receive a calibrated signal. When the adjustable circuit is adjusted with the calibrated signal, said calibrated signal being different from the reference signal, the calibrated field sensor provides a calibrated sensor signal substantially equal to the reference sensor signal. The field sensor device is arranged to be exposed, when in a calibration mode, to a uniform calibration field and, when in operational mode, to an operational field being a field gradient.
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公开(公告)号：US20210018574A1
公开(公告)日：2021-01-21
申请号：US17030900
申请日：2020-09-24
Applicant: Melexis Technologies SA
Inventor： Jian CHEN , Matthijs PARDOEN , Arnaud LAVILLE , Orlin GUEORGUIEV SARADJOV
Abstract: A sensor comprises a housing; and a lead frame comprising at least three elongated leads having an exterior portion extending from the housing; and a magnetic sensor circuit disposed in the housing and connected to the lead frame. The housing comprising at least two recesses or at least two lateral protrusions arranged on two opposite sides of the housing, for allowing the sensor to be mounted to the support. A component assembly comprising said sensor mounted on a support, the support comprising a plurality of first and second posts and a plurality of electrical contacts. A method of producing said component assembly, comprising the step of arranging said sensor with its elongated leads adjacent the first posts, and arranging its lateral protrusions and/or lateral recesses adjacent the second posts, and connecting the elongated leads to the electrical contacts.
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Patent Agency Ranking
公开(公告)号：US20210111335A1
公开(公告)日：2021-04-15
申请号：US17065004
申请日：2020-10-07
Applicant: Melexis Technologies SA
Inventor： Arnaud LAVILLE , Eric LAHAYE , Jian CHEN
IPC: H01L43/04 , H01L25/065 , H01L23/495 , G01R33/07 , H01L43/06
Abstract: A sensor device comprising: a lead frame; a first/second semiconductor die having a first/second sensor structure at a first/second sensor location, and a plurality of first/second bond pads electrically connected to the lead frame; the semiconductor dies having a square or rectangular shape with a geometric center; the sensor locations are offset from the geometrical centers; the second die is stacked on top of the first die, and is rotated by a non-zero angle and optionally also offset or shifted with respect to the first die, such that a perpendicular projection of the first and second sensor location coincide.
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公开(公告)号：US20190079142A1
公开(公告)日：2019-03-14
申请号：US16118638
申请日：2018-08-31
Applicant: Melexis Technologies SA
Inventor： Gael CLOSE , Arnaud LAVILLE , Stefan RIGERT , Samuel HUBER LINDENBERGER
Abstract: A field-sensor device comprises a reference field sensor biased with a reference current. The reference field sensor provides a reference sensor signal in response to a field, and a calibrated field sensor biased with an individually adjustable current and providing a calibrated sensor signal in response to the field. A control circuit controls the adjustable current bias of the calibrated field sensor at a calibrated current different from the reference current so that the calibrated field sensor provides a calibrated sensor signal substantially equal to the reference sensor signal in response to a common field. The field sensor device is arranged to be exposed, when in a calibration mode, to a uniform calibration field and, when in operational mode, to an operational field being a field gradient.
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公开(公告)号：US20240151593A1
公开(公告)日：2024-05-09
申请号：US18499782
申请日：2023-11-01
Applicant: Melexis Technologies SA
Inventor： Titouan MATHERET , Carlos VELASQUEZ , Arnaud LAVILLE , Bertrand COULON
IPC: G01K7/34
CPC classification number: G01K7/34 , G01K2219/00
Abstract: A temperature sensor comprising at least one temperature sensing circuit. Each temperature sensing circuit comprise a series connection of a first connecting node, a first capacitor connected to a first reset transistor for biasing the first capacitor to a first bias voltage, a bias transistor for distributing charges between the first and second capacitor after biasing the first and second capacitor, a second capacitor connected to a second reset transistor for biasing the second capacitor to a second bias voltage, a second connecting node. Each temperature sensing circuit comprises at least one voltage readout node between the first capacitor and the second capacitor.
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公开(公告)号：US20230341479A1
公开(公告)日：2023-10-26
申请号：US18334225
申请日：2023-06-13
Applicant: Melexis Technologies SA
Inventor： Gael CLOSE , Arnaud LAVILLE , Stefan RIGERT , Samuel HUBER LINDENBERGER
CPC classification number: G01R33/0017 , G01D5/142 , G01D18/00 , G01R33/0041 , G01R33/07 , G01R35/00
Abstract: The present invention relates to a field-sensor device comprising a reference field sensor providing a reference sensor signal in response to a field, a calibrated field sensor providing a calibrated sensor signal in response to the field, a reference circuit connected to the reference field sensor and adapted to receive a reference signal, and an adjustable circuit connected to the calibrated field sensor and adapted to receive a calibrated signal. When the adjustable circuit is adjusted with the calibrated signal, said calibrated signal being different from the reference signal, the calibrated field sensor provides a calibrated sensor signal substantially equal to the reference sensor signal. The field sensor device is arranged to be exposed, when in a calibration mode, to a uniform calibration field and, when in operational mode, to an operational field being a field gradient.
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公开(公告)号：US20230240153A1
公开(公告)日：2023-07-27
申请号：US18194766
申请日：2023-04-03
Applicant: Melexis Technologies SA
Inventor： Arnaud LAVILLE , Eric LAHAYE , Jian CHEN
IPC: H10N52/80 , G01R33/07 , H01L23/495 , H01L25/065 , H10N52/00
CPC classification number: H10N52/80 , G01R33/07 , H01L23/49541 , H01L23/49575 , H01L25/0657 , H10N52/101
Abstract: A sensor device comprising: a lead frame; a first/second semiconductor die having a first/second sensor structure at a first/second sensor location, and a plurality of first/second bond pads electrically connected to the lead frame; the semiconductor dies having a square or rectangular shape with a geometric center; the sensor locations are offset from the geometrical centers; the second die is stacked on top of the first die, and is rotated by a non-zero angle and optionally also offset or shifted with respect to the first die, such that a perpendicular projection of the first and second sensor location coincide.
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