公开(公告)号：US12158589B2

公开(公告)日：2024-12-03

申请号：US18242990

申请日：2023-09-06

Applicant: Meta Platforms Technologies, LLC

Inventor： Michael Pope ,  Cameron Peter Jue ,  Rajat Mittal ,  Ryan Fleming ,  Boyd Drew Allin

IPC: G02B27/01 ,  G06F1/20 ,  H05K7/20

Abstract: A headset includes a thermal frame disposed within a housing. A printed circuit board (PCB) is thermally coupled to the thermal frame. Heat generated by one or more electrical components on the PCB is transmitted to the thermal frame, which distributes the heat uniformly throughout the headset. A first heat pipe is disposed on a first side of the PCB in contact with at least a portion of the thermal frame, the PCB, and/or an electrical component disposed on the PCB to draw heat from the electrical component, and a second heat pipe is disposed proximate a second side of the PCB and is configured to draw heat from second side of the PCB.

公开(公告)号：US20230408829A1

公开(公告)日：2023-12-21

申请号：US18242990

申请日：2023-09-06

Applicant: Meta Platforms Technologies, LLC

Inventor： Michael Pope ,  Cameron Peter Jue ,  Rajat Mittal ,  Ryan Fleming ,  Boyd Drew Allin

IPC: G02B27/01 ,  G06F1/20 ,  H05K7/20

CPC classification number: G02B27/0176 ,  G06F1/203 ,  G06F1/206 ,  H05K7/20963

Abstract: A headset includes a thermal frame disposed within a housing. A printed circuit board (PCB) is thermally coupled to the thermal frame. Heat generated by one or more electrical components on the PCB is transmitted to the thermal frame, which distributes the heat uniformly throughout the headset. A first heat pipe is disposed on a first side of the PCB in contact with at least a portion of the thermal frame, the PCB, and/or an electrical component disposed on the PCB to draw heat from the electrical component, and a second heat pipe is disposed proximate a second side of the PCB and is configured to draw heat from second side of the PCB.

公开(公告)号：US11782281B2

公开(公告)日：2023-10-10

申请号：US17390288

申请日：2021-07-30

Applicant: Meta Platforms Technologies, LLC

Inventor： Michael Pope ,  Cameron Peter Jue ,  Rajat Mittal ,  Ryan Fleming ,  Boyd Drew Allin

IPC: G02B27/01 ,  G06F1/20 ,  H05K7/20

CPC classification number: G02B27/0176 ,  G06F1/203 ,  G06F1/206 ,  H05K7/20963

Abstract: A headset includes a thermal frame disposed within a housing. A printed circuit board (PCB) is thermally coupled to the thermal frame. Heat generated by one or more electrical components on the PCB is transmitted to the thermal frame, which distributes the heat uniformly throughout the headset. A first heat pipe is disposed on a first side of the PCB in contact with at least a portion of the thermal frame, the PCB, and/or an electrical component disposed on the PCB to draw heat from the electrical component, and a second heat pipe is disposed proximate a second side of the PCB and is configured to draw heat from second side of the PCB.

公开(公告)号：US11698536B2

公开(公告)日：2023-07-11

申请号：US17390351

申请日：2021-07-30

Applicant: Meta Platforms Technologies, LLC

Inventor： Michael Pope ,  Cameron Peter Jue ,  Balaji Chelladurai

IPC: G02B27/01 ,  G06F1/20 ,  H05K7/20

CPC classification number: G02B27/0176 ,  G06F1/203 ,  G06F1/206 ,  H05K7/20172 ,  H05K7/20963

Abstract: A headset includes a thermal frame disposed within a housing. A printed circuit board is thermally coupled to the thermal frame. Heat generated by one or more electrical components on the PCB is transmitted to the thermal frame, which distributes the heat uniformly throughout the headset. The thermal frame provides a substantially rigid structural support to which components are coupled and is configured to transfer thermal energy away from the one or more electrical components of the headset and toward an environment located outside of the housing.

公开(公告)号：US20230030748A1

公开(公告)日：2023-02-02

申请号：US17390288

申请日：2021-07-30

Applicant: Meta Platforms Technologies, LLC

Inventor： Michael Pope ,  Cameron Peter Jue ,  Rajat Mittal ,  Ryan Fleming ,  Boyd Drew Allin

IPC: G02B27/01 ,  G06F1/20 ,  H05K7/20

Abstract: A headset includes a thermal frame disposed within a housing. A printed circuit board (PCB) is thermally coupled to the thermal frame. Heat generated by one or more electrical components on the PCB is transmitted to the thermal frame, which distributes the heat uniformly throughout the headset. A first heat pipe is disposed on a first side of the PCB in contact with at least a portion of the thermal frame, the PCB, and/or an electrical component disposed on the PCB to draw heat from the electrical component, and a second heat pipe is disposed proximate a second side of the PCB and is configured to draw heat from second side of the PCB.

公开(公告)号：US20230035571A1

公开(公告)日：2023-02-02

申请号：US17390351

申请日：2021-07-30

Applicant: Meta Platforms Technologies, LLC

Inventor： Michael Pope ,  Cameron Peter Jue ,  Balaji Chelladurai

IPC: G02B27/01 ,  G06F1/20 ,  H05K7/20

Abstract: A headset includes a thermal frame disposed within a housing. A printed circuit board is thermally coupled to the thermal frame. Heat generated by one or more electrical components on the PCB is transmitted to the thermal frame, which distributes the heat uniformly throughout the headset. The thermal frame provides a substantially rigid structural support to which components are coupled and is configured to transfer thermal energy away from the one or more electrical components of the headset and toward an environment located outside of the housing.