公开(公告)号：US20230035571A1

公开(公告)日：2023-02-02

申请号：US17390351

申请日：2021-07-30

Applicant: Meta Platforms Technologies, LLC

Inventor： Michael Pope ,  Cameron Peter Jue ,  Balaji Chelladurai

IPC: G02B27/01 ,  G06F1/20 ,  H05K7/20

Abstract: A headset includes a thermal frame disposed within a housing. A printed circuit board is thermally coupled to the thermal frame. Heat generated by one or more electrical components on the PCB is transmitted to the thermal frame, which distributes the heat uniformly throughout the headset. The thermal frame provides a substantially rigid structural support to which components are coupled and is configured to transfer thermal energy away from the one or more electrical components of the headset and toward an environment located outside of the housing.

公开(公告)号：US11698536B2

公开(公告)日：2023-07-11

申请号：US17390351

申请日：2021-07-30

Applicant: Meta Platforms Technologies, LLC

Inventor： Michael Pope ,  Cameron Peter Jue ,  Balaji Chelladurai

IPC: G02B27/01 ,  G06F1/20 ,  H05K7/20

CPC classification number: G02B27/0176 ,  G06F1/203 ,  G06F1/206 ,  H05K7/20172 ,  H05K7/20963

Abstract: A headset includes a thermal frame disposed within a housing. A printed circuit board is thermally coupled to the thermal frame. Heat generated by one or more electrical components on the PCB is transmitted to the thermal frame, which distributes the heat uniformly throughout the headset. The thermal frame provides a substantially rigid structural support to which components are coupled and is configured to transfer thermal energy away from the one or more electrical components of the headset and toward an environment located outside of the housing.