公开(公告)号：US20220237131A1

公开(公告)日：2022-07-28

申请号：US17717452

申请日：2022-04-11

Applicant: Micron Technology, Inc.

Inventor： Suresh Rajgopal ,  Balint Fleischer

IPC: G06F13/16 ,  G06F13/42 ,  G06F12/06 ,  G06F12/02 ,  G06F13/40

Abstract: An apparatus includes a memory component having a plurality of ball grid array (BGA) components, wherein each respective one of the BGA components includes a plurality of memory blocks and a BGA component controller and firmware adjacent the plurality of memory blocks to manage the plurality of memory blocks. The apparatus further includes a processing device, included in the memory component, to perform memory operations on the BGA components.

公开(公告)号：US11886358B2

公开(公告)日：2024-01-30

申请号：US17717452

申请日：2022-04-11

Applicant: Micron Technology, Inc.

Inventor： Suresh Rajgopal ,  Balint Fleischer

IPC: G06F13/12 ,  G06F13/16 ,  G06F13/42 ,  G06F12/06 ,  G06F12/02 ,  G06F13/40

CPC classification number: G06F13/1668 ,  G06F12/0246 ,  G06F12/063 ,  G06F13/4068 ,  G06F13/4221

Abstract: An apparatus includes a memory component having a plurality of ball grid array (BGA) components, wherein each respective one of the BGA components includes a plurality of memory blocks and a BGA component controller and firmware adjacent the plurality of memory blocks to manage the plurality of memory blocks. The apparatus further includes a processing device, included in the memory component, to perform memory operations on the BGA components.

公开(公告)号：US11301401B1

公开(公告)日：2022-04-12

申请号：US17127289

申请日：2020-12-18

Applicant: Micron Technology, Inc.

Inventor： Suresh Rajgopal ,  Balint Fleischer

IPC: G06F13/12 ,  G06F13/16 ,  G06F13/42 ,  G06F12/06 ,  G06F12/02 ,  G06F13/40

Abstract: An apparatus includes a memory component having a plurality of ball grid array (BGA) components, wherein each respective one of the BGA components includes a plurality of memory blocks and a BGA component controller and firmware adjacent the plurality of memory blocks to manage the plurality of memory blocks. The apparatus further includes a processing device, included in the memory component, to perform memory operations on the BGA components.