公开(公告)号：US20150287480A1

公开(公告)日：2015-10-08

申请号：US14246589

申请日：2014-04-07

Applicant: Micron Technology, Inc.

Inventor： Alan J. Wilson ,  Jeffrey Wright

IPC: G11C29/00 ,  G11C17/18 ,  G11C17/16 ,  G11C11/408 ,  G11C11/418

CPC classification number: G11C29/76 ,  G11C7/24 ,  G11C11/408 ,  G11C11/4087 ,  G11C11/418 ,  G11C17/16 ,  G11C17/18 ,  G11C29/04 ,  G11C29/70 ,  G11C29/789 ,  G11C29/806 ,  G11C29/838 ,  G11C2029/4402

Abstract: Apparatus and methods for soft post package repair are disclosed. One such apparatus can include memory cells in a package, volatile memory configured to store defective address data responsive to entering a soft post-package repair mode, a match logic circuit and a decoder. The match logic circuit can generate a match signal indicating whether address data corresponding to an address to be accessed matches the defective address data stored in the volatile memory. The decoder can select a first group of the memory cells to be accessed instead of a second group of the memory cells responsive to the match signal indicating that the address data corresponding to the address to be accessed matches the defective address data stored in the volatile memory. The second group of the memory cells can correspond to a replacement address associated with other defective address data stored in non-volatile memory of the apparatus.

Abstract translation: 公开了软包装修复的装置和方法。 一种这样的设备可以包括封装中的存储器单元，易失性存储器被配置为响应于进入软件后封装修复模式，匹配逻辑电路和解码器而存储有缺陷的地址数据。 匹配逻辑电路可以产生指示与要访问的地址相对应的地址数据是否与存储在易失性存储器中的缺陷地址数据相匹配的匹配信号。 解码器可以响应于匹配信号来选择要访问的存储器单元的第一组而不是第二组，所述匹配信号指示对应于要访问的地址的地址数据与存储在易失性存储器中的缺陷地址数据相匹配 。 存储器单元的第二组可对应于与存储在该装置的非易失性存储器中的其他缺陷地址数据相关联的替换地址。

公开(公告)号：US20180005710A1

公开(公告)日：2018-01-04

申请号：US15703223

申请日：2017-09-13

Applicant: Micron Technology, Inc.

Inventor： Alan J. Wilson ,  Jeffrey Wright

IPC: G11C29/00 ,  G11C11/418 ,  G11C11/408 ,  G11C17/16 ,  G11C17/18 ,  G11C29/04 ,  G11C29/44

CPC classification number: G11C29/76 ,  G11C7/24 ,  G11C11/408 ,  G11C11/4087 ,  G11C11/418 ,  G11C17/16 ,  G11C17/18 ,  G11C29/04 ,  G11C29/70 ,  G11C29/789 ,  G11C29/806 ,  G11C29/838 ,  G11C2029/4402

Abstract: Apparatus and methods for soft post package repair are disclosed. One such apparatus can include memory cells in a package, volatile memory configured to store defective address data responsive to entering a soft post-package repair mode, a match logic circuit and a decoder. The match logic circuit can generate a match signal indicating whether address data corresponding to an address to be accessed matches the defective address data stored in the volatile memory. The decoder can select a first group of the memory cells to be accessed instead of a second group of the memory cells responsive to the match signal indicating that the address data corresponding to the address to be accessed matches the defective address data stored in the volatile memory. The second group of the memory cells can correspond to a replacement address associated with other defective address data stored in non-volatile memory of the apparatus.

公开(公告)号：US09343184B2

公开(公告)日：2016-05-17

申请号：US14246589

申请日：2014-04-07

Applicant: Micron Technology, Inc.

Inventor： Alan J. Wilson ,  Jeffrey Wright

IPC: G11C7/00 ,  G11C29/00 ,  G11C11/418 ,  G11C17/16 ,  G11C17/18 ,  G11C11/408 ,  G11C29/44

CPC classification number: G11C29/76 ,  G11C7/24 ,  G11C11/408 ,  G11C11/4087 ,  G11C11/418 ,  G11C17/16 ,  G11C17/18 ,  G11C29/04 ,  G11C29/70 ,  G11C29/789 ,  G11C29/806 ,  G11C29/838 ,  G11C2029/4402

Abstract: Apparatus and methods for soft post package repair are disclosed. One such apparatus can include memory cells in a package, volatile memory configured to store defective address data responsive to entering a soft post-package repair mode, a match logic circuit and a decoder. The match logic circuit can generate a match signal indicating whether address data corresponding to an address to be accessed matches the defective address data stored in the volatile memory. The decoder can select a first group of the memory cells to be accessed instead of a second group of the memory cells responsive to the match signal indicating that the address data corresponding to the address to be accessed matches the defective address data stored in the volatile memory. The second group of the memory cells can correspond to a replacement address associated with other defective address data stored in non-volatile memory of the apparatus.

Abstract translation: 公开了软包装修复的装置和方法。 一种这样的设备可以包括封装中的存储器单元，易失性存储器被配置为响应于进入软件后封装修复模式，匹配逻辑电路和解码器而存储有缺陷的地址数据。 匹配逻辑电路可以产生指示与要访问的地址相对应的地址数据是否与存储在易失性存储器中的缺陷地址数据相匹配的匹配信号。 解码器可以响应于匹配信号来选择要访问的存储器单元的第一组而不是第二组，所述匹配信号指示对应于要访问的地址的地址数据与存储在易失性存储器中的缺陷地址数据相匹配 。 存储器单元的第二组可对应于与存储在该装置的非易失性存储器中的其他缺陷地址数据相关联的替换地址。

公开(公告)号：US09202595B2

公开(公告)日：2015-12-01

申请号：US14077630

申请日：2013-11-12

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Alan J. Wilson ,  Jeffrey Wright

IPC: G06F11/10 ,  G11C29/00

CPC classification number: G11C29/76 ,  G11C8/06 ,  G11C29/789 ,  G11C29/802 ,  G11C2029/4402

Abstract: An apparatus for post package repair can include memory cells in a package. A storage element can store information responsive to a post-package repair mode being activated. The information can identify an address mapped to a portion of the memory cells to be repaired. The storage element can store the information responsive to data received from nodes of the package. A walking token circuit can interrogate the information stored in the storage element in a serial fashion responsive to the post-package repair mode being activated. A mapping circuit can remap, responsive to the interrogation, the address to be repaired to another portion of the memory cells.

Abstract translation: 用于邮包修复的装置可以包括包装中的存储器单元。 存储元件可以存储响应于被激活的封装后修复模式的信息。 信息可以标识映射到要修复的存储器单元的一部分的地址。 存储元件可以响应于从包的节点接收的数据来存储信息。 行走令牌电路可以响应于被激活的封装后修复模式，以串行方式询问存储在存储元件中的信息。 映射电路可以根据询问将要修复的地址重新映射到存储器单元的另一部分。

公开(公告)号：US09922729B2

公开(公告)日：2018-03-20

申请号：US15703223

申请日：2017-09-13

Applicant: Micron Technology, Inc.

Inventor： Alan J. Wilson ,  Jeffrey Wright

IPC: G11C7/00 ,  G11C29/00 ,  G11C29/04 ,  G11C11/408 ,  G11C11/418 ,  G11C17/18 ,  G11C17/16 ,  G11C29/44

CPC classification number: G11C29/76 ,  G11C7/24 ,  G11C11/408 ,  G11C11/4087 ,  G11C11/418 ,  G11C17/16 ,  G11C17/18 ,  G11C29/04 ,  G11C29/70 ,  G11C29/789 ,  G11C29/806 ,  G11C29/838 ,  G11C2029/4402

Abstract: Apparatus and methods for soft post package repair are disclosed. One such apparatus can include memory cells in a package, volatile memory configured to store defective address data responsive to entering a soft post-package repair mode, a match logic circuit and a decoder. The match logic circuit can generate a match signal indicating whether address data corresponding to an address to be accessed matches the defective address data stored in the volatile memory. The decoder can select a first group of the memory cells to be accessed instead of a second group of the memory cells responsive to the match signal indicating that the address data corresponding to the address to be accessed matches the defective address data stored in the volatile memory. The second group of the memory cells can correspond to a replacement address associated with other defective address data stored in non-volatile memory of the apparatus.

公开(公告)号：US09793008B2

公开(公告)日：2017-10-17

申请号：US15382394

申请日：2016-12-16

Applicant: Micron Technology, Inc.

Inventor： Alan J. Wilson ,  Jeffrey Wright

IPC: G11C7/00 ,  G11C29/00 ,  G11C11/418 ,  G11C17/16 ,  G11C17/18 ,  G11C29/04 ,  G11C11/408 ,  G11C29/44

CPC classification number: G11C29/76 ,  G11C7/24 ,  G11C11/408 ,  G11C11/4087 ,  G11C11/418 ,  G11C17/16 ,  G11C17/18 ,  G11C29/04 ,  G11C29/70 ,  G11C29/789 ,  G11C29/806 ,  G11C29/838 ,  G11C2029/4402

Abstract: Apparatus and methods for soft post package repair are disclosed. One such apparatus can include memory cells in a package, volatile memory configured to store defective address data responsive to entering a soft post-package repair mode, a match logic circuit and a decoder. The match logic circuit can generate a match signal indicating whether address data corresponding to an address to be accessed matches the detective address data stored in the volatile memory. The decoder can select a first group of the memory cells to be accessed instead of a second group of the memory cells responsive to the match signal indicating that the address data corresponding to the address to be accessed matches the defective address data stored in the volatile memory. The second group of the memory cells can correspond to a replacement address associated with other defective address data stored in non-volatile memory of the apparatus.

公开(公告)号：US20170098480A1

公开(公告)日：2017-04-06

申请号：US15382394

申请日：2016-12-16

Applicant: Micron Technology, Inc.

Inventor： Alan J. Wilson ,  Jeffrey Wright

IPC: G11C29/00

CPC classification number: G11C29/76 ,  G11C7/24 ,  G11C11/408 ,  G11C11/4087 ,  G11C11/418 ,  G11C17/16 ,  G11C17/18 ,  G11C29/04 ,  G11C29/70 ,  G11C29/789 ,  G11C29/806 ,  G11C29/838 ,  G11C2029/4402

Abstract: Apparatus and methods for soft post package repair are disclosed. One such apparatus can include memory cells in a package, volatile memory configured to store defective address data responsive to entering a soft post-package repair mode, a match logic circuit and a decoder. The match logic circuit can generate a match signal indicating whether address data corresponding to an address to be accessed matches the detective address data stored in the volatile memory. The decoder can select a first group of the memory cells to be accessed instead of a second group of the memory cells responsive to the match signal indicating that the address data corresponding to the address to be accessed matches the defective address data stored in the volatile memory. The second group of the memory cells can correspond to a replacement address associated with other defective address data stored in non-volatile memory of the apparatus.

公开(公告)号：US09558851B2

公开(公告)日：2017-01-31

申请号：US15133096

申请日：2016-04-19

Applicant: Micron Technology, Inc.

Inventor： Alan J. Wilson ,  Jeffrey Wright

IPC: G11C7/00 ,  G11C29/00 ,  G11C11/418 ,  G11C17/16 ,  G11C17/18 ,  G11C29/04 ,  G11C11/408 ,  G11C29/44

CPC classification number: G11C29/76 ,  G11C7/24 ,  G11C11/408 ,  G11C11/4087 ,  G11C11/418 ,  G11C17/16 ,  G11C17/18 ,  G11C29/04 ,  G11C29/70 ,  G11C29/789 ,  G11C29/806 ,  G11C29/838 ,  G11C2029/4402

Abstract: Apparatus and methods for soft post package repair are disclosed. One such apparatus can include memory cells in a package, volatile memory configured to store defective address data responsive to entering a soft post-package repair mode, a match logic circuit and a decoder. The match logic circuit can generate a match signal indicating whether address data corresponding to an address to be accessed matches the detective address data stored in the volatile memory. The decoder can select a first group of the memory cells to be accessed instead of a second group of the memory cells responsive to the match signal indicating that the address data corresponding to the address to be accessed matches the defective address data stored in the volatile memory. The second group of the memory cells can correspond to a replacement address associated with other defective address data stored in non-volatile memory of the apparatus.

Abstract translation: 公开了软包装修复的装置和方法。 一种这样的设备可以包括封装中的存储器单元，易失性存储器被配置为响应于进入软件后封装修复模式，匹配逻辑电路和解码器而存储有缺陷的地址数据。 匹配逻辑电路可以产生指示与要访问的地址相对应的地址数据是否与存储在易失性存储器中的检测地址数据相匹配的匹配信号。 解码器可以响应于匹配信号来选择要访问的存储器单元的第一组而不是第二组，所述匹配信号指示对应于要访问的地址的地址数据与存储在易失性存储器中的缺陷地址数据相匹配 。 存储器单元的第二组可对应于与存储在该装置的非易失性存储器中的其他缺陷地址数据相关联的替换地址。

公开(公告)号：US20160232987A1

公开(公告)日：2016-08-11

申请号：US15133096

申请日：2016-04-19

Applicant: Micron Technology, Inc.

Inventor： Alan J. Wilson ,  Jeffrey Wright

IPC: G11C29/00 ,  G11C29/04 ,  G11C11/408

CPC classification number: G11C29/76 ,  G11C7/24 ,  G11C11/408 ,  G11C11/4087 ,  G11C11/418 ,  G11C17/16 ,  G11C17/18 ,  G11C29/04 ,  G11C29/70 ,  G11C29/789 ,  G11C29/806 ,  G11C29/838 ,  G11C2029/4402

Abstract: Apparatus and methods for soft post package repair are disclosed. One such apparatus can include memory cells in a package, volatile memory configured to store defective address data responsive to entering a soft post-package repair mode, a match logic circuit and a decoder. The match logic circuit can generate a match signal indicating whether address data corresponding to an address to be accessed matches the detective address data stored in the volatile memory. The decoder can select a first group of the memory cells to be accessed instead of a second group of the memory cells responsive to the match signal indicating that the address data corresponding to the address to be accessed matches the defective address data stored in the volatile memory. The second group of the memory cells can correspond to a replacement address associated with other defective address data stored in non-volatile memory of the apparatus.

Abstract translation: 公开了软包装修复的装置和方法。 一种这样的设备可以包括封装中的存储器单元，易失性存储器被配置为响应于进入软件后封装修复模式，匹配逻辑电路和解码器而存储有缺陷的地址数据。 匹配逻辑电路可以产生指示与要访问的地址相对应的地址数据是否与存储在易失性存储器中的检测地址数据相匹配的匹配信号。 解码器可以响应于匹配信号来选择要访问的存储器单元的第一组而不是第二组，所述匹配信号指示对应于要访问的地址的地址数据与存储在易失性存储器中的缺陷地址数据相匹配 。 存储器单元的第二组可对应于与存储在该装置的非易失性存储器中的其他缺陷地址数据相关联的替换地址。

公开(公告)号：US20150135038A1

公开(公告)日：2015-05-14

申请号：US14077630

申请日：2013-11-12

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Alan J. Wilson ,  Jeffrey Wright

IPC: G11C29/00

CPC classification number: G11C29/76 ,  G11C8/06 ,  G11C29/789 ,  G11C29/802 ,  G11C2029/4402

Abstract: Apparatuses and methods for post package repair are disclosed. An apparatus can include memory cells in a package. A storage element can store information responsive to a post-package repair mode being activated. The information can identify an address mapped to a portion of the memory cells to be repaired. The storage element can store the information responsive to data received from nodes of the package. A walking token circuit can interrogate the information stored in the storage element in a serial fashion responsive to the post-package repair mode being activated. A mapping circuit can remap, responsive to the interrogation, the address to be repaired to another portion of the memory cells.

Abstract translation: 公开了用于后包装修复的装置和方法。 装置可以包括封装中的存储器单元。 存储元件可以存储响应于被激活的封装后修复模式的信息。 信息可以标识映射到要修复的存储器单元的一部分的地址。 存储元件可以响应于从包的节点接收的数据来存储信息。 行走令牌电路可以响应于被激活的封装后修复模式，以串行方式询问存储在存储元件中的信息。 映射电路可以根据询问将要修复的地址重新映射到存储器单元的另一部分。