公开(公告)号：US20240153062A1

公开(公告)日：2024-05-09

申请号：US18406485

申请日：2024-01-08

Applicant: Micron Technology, Inc.

Inventor： Amitava Majumdar ,  Qianlan Liu ,  Pradeep Ramachandran ,  Shawn D. Lyonsmith ,  Steve K. McCandless ,  Ted L. Taylor ,  Ahmed N. Noemaun ,  Gordon A. Haller

IPC: G06T7/00 ,  G01B1/00 ,  G01B11/00 ,  G01N21/21 ,  G01N21/47 ,  G06F30/367 ,  G06N20/00

CPC classification number: G06T7/0004 ,  G01B1/00 ,  G01B11/00 ,  G01N21/211 ,  G01N21/4738 ,  G06F30/367 ,  G06N20/00 ,  G01B2210/56 ,  G06T2207/10024 ,  G06T2207/10152 ,  G06T2207/20081 ,  G06T2207/30148

Abstract: A method of predicting virtual metrology data for a wafer lot that includes receiving first image data from an imager system, the first image data relating to at least one first wafer lot, receiving measured metrology data from metrology equipment relating to the at least one first wafer lot, applying one or more machine learning techniques to the first image data and the measured metrology data to generate at least one predictive model for predicting at least one of virtual metrology data or virtual cell metrics data of wafer lots, and utilizing the at least one generated predictive model to generate at least one of first virtual metrology data or first virtual cell metrics data for the first wafer lot.

公开(公告)号：US11869178B2

公开(公告)日：2024-01-09

申请号：US17117222

申请日：2020-12-10

Applicant: Micron Technology, Inc.

Inventor： Amitava Majumdar ,  Qianlan Liu ,  Pradeep Ramachandran ,  Shawn D. Lyonsmith ,  Steve K. McCandless ,  Ted L. Taylor ,  Ahmed N. Noemaun ,  Gordon A. Haller

IPC: G06T7/00 ,  G01N21/47 ,  G01N21/21 ,  G01B1/00 ,  G06N20/00 ,  G06F30/367

CPC classification number: G06T7/0004 ,  G01B1/00 ,  G01N21/211 ,  G01N21/4738 ,  G06F30/367 ,  G06N20/00 ,  G01B2210/56 ,  G06T2207/10024 ,  G06T2207/10152 ,  G06T2207/20081 ,  G06T2207/30148

Abstract: A method of predicting virtual metrology data for a wafer lot that includes receiving first image data from an imager system, the first image data relating to at least one first wafer lot, receiving measured metrology data from metrology equipment relating to the at least one first wafer lot, applying one or more machine learning techniques to the first image data and the measured metrology data to generate at least one predictive model for predicting at least one of virtual metrology data or virtual cell metrics data of wafer lots, and utilizing the at least one generated predictive model to generate at least one of first virtual metrology data or first virtual cell metrics data for the first wafer lot.

公开(公告)号：US20200051235A1

公开(公告)日：2020-02-13

申请号：US16100729

申请日：2018-08-10

Applicant: Micron Technology, Inc.

Inventor： Amitava Majumdar ,  Qianlan Liu ,  Pradeep Ramachandran ,  Shawn D. Lyonsmith ,  Steve K. McCandless ,  Ted L. Taylor ,  Ahmed N. Noemaun ,  Gordon A. Haller

IPC: G06T7/00 ,  G06N99/00 ,  G06F17/50 ,  G01N21/47 ,  G01N21/21 ,  G01B11/00

Abstract: A method of predicting virtual metrology data for a wafer lot that includes receiving first image data from an imager system, the first image data relating to at least one first wafer lot, receiving measured metrology data from metrology equipment relating to the at least one first wafer lot, applying one or more machine learning techniques to the first image data and the measured metrology data to generate at least one predictive model for predicting at least one of virtual metrology data or virtual cell metrics data of wafer lots, and utilizing the at least one generated predictive model to generate at least one of first virtual metrology data or first virtual cell metrics data for the first wafer lot.

公开(公告)号：US20210090246A1

公开(公告)日：2021-03-25

申请号：US17117222

申请日：2020-12-10

Applicant: Micron Technology, Inc.

Inventor： Amitava Majumdar ,  Qianlan Liu ,  Pradeep Ramachandran ,  Shawn D. Lyonsmith ,  Steve K. McCandless ,  Ted L. Taylor ,  Ahmed N. Noemaun ,  Gordon A. Haller

IPC: G06T7/00 ,  G01N21/47 ,  G01N21/21 ,  G01B11/00 ,  G06N20/00 ,  G06F30/367

Abstract: A method of predicting virtual metrology data for a wafer lot that includes receiving first image data from an imager system, the first image data relating to at least one first wafer lot, receiving measured metrology data from metrology equipment relating to the at least one first wafer lot, applying one or more machine learning techniques to the first image data and the measured metrology data to generate at least one predictive model for predicting at least one of virtual metrology data or virtual cell metrics data of wafer lots, and utilizing the at least one generated predictive model to generate at least one of first virtual metrology data or first virtual cell metrics data for the first wafer lot.