公开(公告)号：US20170303418A1

公开(公告)日：2017-10-19

申请号：US15641223

申请日：2017-07-04

Applicant: Misako TAWARAYAMA

Inventor： Misako TAWARAYAMA

IPC: H05K7/02 ,  H05K7/14 ,  H05K5/02

CPC classification number: H05K7/023 ,  H05K1/0284 ,  H05K1/0286 ,  H05K1/14 ,  H05K5/0247 ,  H05K7/14 ,  H05K2201/09963

Abstract: The present invention provides a three-dimensional substrate having a different shape than the conventional circuit substrate when a plurality of components are combined to form an electronic circuit. In addition, an electronic device is provided from the three-dimensional substrate. The three-dimensional substrate forms a component forming the three-dimensional structure by three-dimensionally forming the electronic circuit. The component includes at least one electronic component and an electric connection structure for electrically connecting the electronic component with the outside the component. When a plurality of components are combined, the electronic device having the three-dimensional shape having a different shape than the component is formed. The present invention provides the three-dimensional substrate capable of being designed by the shape of the substrate itself.