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    THREE-DIMENSIONAL SUBSTRATE FOR PROVIDING THREE-DIMENSIONAL STRUCTURE
    1.
    发明申请
    THREE-DIMENSIONAL SUBSTRATE FOR PROVIDING THREE-DIMENSIONAL STRUCTURE 审中-公开

    公开(公告)号：US20170303418A1

    公开(公告)日：2017-10-19

    申请号：US15641223

    申请日：2017-07-04

    Applicant: Misako TAWARAYAMA

    Inventor： Misako TAWARAYAMA

    IPC: H05K7/02 ,  H05K7/14 ,  H05K5/02

    CPC classification number: H05K7/023 ,  H05K1/0284 ,  H05K1/0286 ,  H05K1/14 ,  H05K5/0247 ,  H05K7/14 ,  H05K2201/09963

    Abstract: The present invention provides a three-dimensional substrate having a different shape than the conventional circuit substrate when a plurality of components are combined to form an electronic circuit. In addition, an electronic device is provided from the three-dimensional substrate. The three-dimensional substrate forms a component forming the three-dimensional structure by three-dimensionally forming the electronic circuit. The component includes at least one electronic component and an electric connection structure for electrically connecting the electronic component with the outside the component. When a plurality of components are combined, the electronic device having the three-dimensional shape having a different shape than the component is formed. The present invention provides the three-dimensional substrate capable of being designed by the shape of the substrate itself.

    METHOD OF PRODUCING A LIGHT EMITTING DIODE ARRANGEMENT AND LIGHT EMITTING DIODE ARRANGEMENT
    3.
    发明申请
    METHOD OF PRODUCING A LIGHT EMITTING DIODE ARRANGEMENT AND LIGHT EMITTING DIODE ARRANGEMENT 有权
    生产发光二极管布置和发光二极管布置的方法

    公开(公告)号：US20150167910A1

    公开(公告)日：2015-06-18

    申请号：US14107759

    申请日：2013-12-16

    Applicant: Harald STOYAN

    Inventor： Harald STOYAN

    IPC: F21K99/00 ,  F21V23/06

    CPC classification number: F21S2/005 ,  F21K9/20 ,  F21V23/06 ,  F21Y2115/10 ,  H05K1/141 ,  H05K1/142 ,  H05K1/147 ,  H05K1/148 ,  H05K3/3442 ,  H05K3/363 ,  H05K2201/046 ,  H05K2201/09963 ,  H05K2201/10106 ,  Y10T29/41

    Abstract: A method for producing a light emitting diode arrangement. A plurality of LED modules (110, 120, 130) are provided, which in each case comprise at least one radiation emitting semiconductor component (1000) on a carrier body (1300). At least one separately fabricated connection carrier (200) is provided. The LED modules are arranged in such a way that they are adjacent to one another in pairs. A mechanically stable and electrically conductive connection between the carrier bodies of two LED modules is produced by means of the connection carrier. Furthermore, a light emitting diode arrangement is disclosed.

    Abstract translation: 一种制造发光二极管装置的方法。 提供了多个LED模块（110,120,130），其在每种情况下都包括在载体主体（1300）上的至少一个辐射发射半导体部件（1000）。 提供至少一个单独制造的连接支架（200）。 LED模块以彼此成对相邻的方式布置。 通过连接载体产生两个LED模块的载体之间的机械稳定且导电的连接。 此外，公开了一种发光二极管装置。

    Method for producing a light emitting diode arrangement, and light emitting diode arrangment
    4.
    发明授权
    Method for producing a light emitting diode arrangement, and light emitting diode arrangment 有权
    用于制造发光二极管装置的方法和发光二极管布置

    公开(公告)号：US08637882B2

    公开(公告)日：2014-01-28

    申请号：US11904170

    申请日：2007-09-26

    Applicant: Harald Stoyan

    Inventor： Harald Stoyan

    IPC: H01L33/00

    CPC classification number: H05K1/141 ,  F21S2/005 ,  F21V21/005 ,  F21V23/06 ,  F21Y2115/10 ,  H05K1/142 ,  H05K1/147 ,  H05K1/148 ,  H05K3/3442 ,  H05K3/363 ,  H05K2201/046 ,  H05K2201/09963 ,  H05K2201/10106

    Abstract: A method for producing a light emitting diode arrangement. A plurality of LED modules (110, 120, 130) are provided, which in each case comprise at least one radiation emitting semiconductor component (1000) on a carrier body (1300). At least one separately fabricated connection carrier (200) is provided. The LED modules are arranged in such a way that they are adjacent to one another in pairs. A mechanically stable and electrically conductive connection between the carrier bodies of two LED modules is produced by means of the connection carrier. Furthermore, a light emitting diode arrangement is disclosed.

    Abstract translation: 一种制造发光二极管装置的方法。 提供了多个LED模块（110,120,130），其在每种情况下都包括在载体主体（1300）上的至少一个辐射发射半导体部件（1000）。 提供至少一个单独制造的连接支架（200）。 LED模块以彼此成对相邻的方式布置。 通过连接载体产生两个LED模块的载体之间的机械稳定且导电的连接。 此外，公开了一种发光二极管装置。

    Modular backlighting device
    7.
    发明申请
    Modular backlighting device 审中-公开
    模块化背光装置

    公开(公告)号：US20100085755A1

    公开(公告)日：2010-04-08

    申请号：US12311478

    申请日：2007-09-26

    Applicant: Angel Sanabra Cunill

    Inventor： Angel Sanabra Cunill

    IPC: F21S4/00

    CPC classification number: H05K1/0286 ,  F21K9/00 ,  H05K1/142 ,  H05K3/0052 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/09845 ,  H05K2201/09963 ,  H05K2201/10106

    Abstract: This device includes boards housing a large number of LEDs electrically connected with the tracks of a printed circuit, arranged in the board according to an equilateral triangular distribution and separated from one another at a fixed distance ‘a’, these light emitting diodes project beams of light interlacing from a certain distance ‘d’ of the board, giving even mass of light to the device at the above mentioned distance ‘d’, without points or appreciable zones of shadow. The boards are equipped with interlocking sections on both edges which are used as a guide for centering for the side connection of successive boards, as in a jigsaw puzzle, and the formation of a lighting panel having a larger surface.

    Abstract translation: 该装置包括容纳大量与印刷电路的轨道电连接的LED的板，其布置在根据等边三角形分布的板中并以固定距离'a'彼此分离，这些发光二极管投射光束 从板的一定距离d的光交织，在上述距离d处给设备提供均匀的光，没有点或明显的阴影区域。 这些板在两个边缘上配备有互锁部分，其用作用于连续板的侧连接的定心的引导件，如在拼图中，以及形成具有较大表面的照明面板。

    Magnetic component connector, circuit boards for use therewith, and kits for building and designing circuits
    8.
    发明授权
    Magnetic component connector, circuit boards for use therewith, and kits for building and designing circuits 有权
    磁性部件连接器，与其一起使用的电路板以及用于构建和设计电路的套件

    公开(公告)号：US07611357B2

    公开(公告)日：2009-11-03

    申请号：US11788369

    申请日：2007-04-18

    Applicant: In Suk Han ,  Dong-Kyun Lim ,  Ilsun Park

    Inventor： In Suk Han ,  Dong-Kyun Lim ,  Ilsun Park

    IPC: G09B19/00 ,  H01R11/00

    CPC classification number: H01R11/30 ,  H01R13/6205 ,  H05K1/0286 ,  H05K1/09 ,  H05K1/141 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/083 ,  H05K2201/09963 ,  H05K2201/10325

    Abstract: Printed circuit boards and breadboard devices have contact pads and magnetic component connectors where connection between the contact pads and the magnetic component connectors are made by magnetic force. Either the contact pad or the magnetic component connector will be magnetic and the other will be made of a material to which a magnet will be attracted. For example, printed circuit boards, which usually have copper traces, include contact pads made of a material to which a magnet will be attracted. Circuit components are connected to magnetic component connectors having magnetic legs which then connect the components to the contact pads of the circuit board or breadboard device. This makes the connection of components to a printed circuit board or breadboard device fast and easy and provides for easy removal and replacement of components. Magnetic component connectors can also be configured to connect magnetically to one another.

    Abstract translation: 印刷电路板和面包板装置具有接触焊盘和磁性部件连接器，其中接触焊盘和磁性部件连接器之间的连接由磁力制成。 接触焊盘或磁性部件连接器都将是磁性的，另一个将由将被吸收的磁体的材料制成。 例如，通常具有铜迹线的印刷电路板包括由吸收磁体的材料制成的接触垫。 电路部件连接到具有磁性腿的磁性部件连接器，然后将这些部件连接到电路板或面包板装置的接触垫上。 这使得组件与印刷电路板或面包板设备的连接快速简单，并且可以方便地拆卸和更换部件。 磁性部件连接器也可以被配置为彼此磁性地连接。

    PASSIVE ALTERABLE ELECTRICAL COMPONENT
    9.
    发明申请
    PASSIVE ALTERABLE ELECTRICAL COMPONENT 有权
    被动可更换电气元件

    公开(公告)号：US20080291651A1

    公开(公告)日：2008-11-27

    申请号：US11752759

    申请日：2007-05-23

    Applicant: Michael Edward Figaro ,  Scott Edward Bacom ,  Jay Gregory Sherritt

    Inventor： Michael Edward Figaro ,  Scott Edward Bacom ,  Jay Gregory Sherritt

    IPC: H05K7/00 ,  G06F17/50

    CPC classification number: H05K3/0005 ,  G06F17/5072 ,  H05K2201/09963

    Abstract: A passive electrical component is described including a substrate, at least a first, second and third electrically conductive pad, each disposed on the substrate and at least a first electrical device fixedly attached to the first pad and the second pad. The first electrical device is electrically connected to the first and second pads. The third pad is devoid of electrical connection to either the first or the second pads. The component is recognizable by both a Computer Aided Design program and an automated component assembly machine.

    Abstract translation: 描述了一种无源电气部件，其包括基板，至少第一，第二和第三导电焊盘，每个基板设置在基板上，并且至少第一电气装置固定地附接到第一焊盘和第二焊盘。 第一电气设备电连接到第一和第二焊盘。 第三垫没有与第一或第二垫的电连接。 该组件可由计算机辅助设计程序和自动化组件装配机器识别。

    Systems for and methods of circuit construction
    10.
    发明授权
    Systems for and methods of circuit construction 有权
    电路结构的系统和方法

    公开(公告)号：US07413481B2

    公开(公告)日：2008-08-19

    申请号：US10892880

    申请日：2004-07-15

    Applicant: Frank E. Redmond, III ,  Frank E. Redmond, Jr.

    Inventor： Frank E. Redmond, III ,  Frank E. Redmond, Jr.

    IPC: H01R9/22

    CPC classification number: H05K1/142 ,  H01R13/514 ,  H05K2201/09963 ,  H05K2201/10598 ,  H05K2201/2018 ,  H05K2203/167 ,  Y10S439/928

    Abstract: A circuit comprises a first circuit portion that includes an electrically insulative first body having a first connector and a first circuit element coupled to the first body. The circuit further comprises a second circuit portion that includes an electrically insulative second body having a second connector coupled to the first connector and a second circuit element coupled to the second body. The circuit further comprises a first electrical conductor coupled to the first and second circuit elements.

    Abstract translation: 电路包括第一电路部分，其包括具有第一连接器的电绝缘的第一主体和耦合到第一主体的第一电路元件。 电路还包括第二电路部分，其包括电绝缘的第二主体，其具有耦合到第一连接器的第二连接器和耦合到第二主体的第二电路元件。 电路还包括耦合到第一和第二电路元件的第一电导体。

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