公开(公告)号：US20130075390A1

公开(公告)日：2013-03-28

申请号：US13627328

申请日：2012-09-26

Applicant: Mitsutoshi ASHIDA

Inventor： Mitsutoshi ASHIDA

IPC: H05B6/66

CPC classification number: H01J37/32302 ,  H01J37/32266

Abstract: A microwave processing apparatus includes a processing chamber which accommodates an object to be processed, and a microwave introducing unit which has at least one microwave source to generate a microwave used to process the object and introduces the microwave into the processing chamber. The microwave processing apparatus further includes a control unit which controls the microwave introducing unit. Furthermore, the control unit changes a frequency of the microwave during a state of processing the object.

Abstract translation: 微波处理装置包括容纳待处理物体的处理室和具有至少一个微波源的微波引入单元，以产生用于处理物体的微波，并将微波导入处理室。 微波处理装置还包括控制微波引入单元的控制单元。 此外，控制单元在处理对象的状态期间改变微波的频率。

公开(公告)号：US20130075389A1

公开(公告)日：2013-03-28

申请号：US13614328

申请日：2012-09-13

Applicant: Mitsutoshi ASHIDA

Inventor： Mitsutoshi ASHIDA

IPC: H05B6/66

CPC classification number: H01J37/32192 ,  H01J37/32311

Abstract: A microwave processing apparatus includes a processing chamber which accommodates an object; a microwave introducing unit for generating microwaves used to process the object and introducing the microwaves into the processing chamber; and a control unit for controlling the microwave introducing unit. The microwave introducing unit includes microwave sources to generate the microwaves and introduces parts of the microwaves into the processing chamber simultaneously, and the control unit controls the microwave sources such that arbitrary combinations of the microwave sources alternately repeat a simultaneous microwave generating state and a microwave non-generating state during a state of processing the object.

Abstract translation: 微波处理装置包括容纳物体的处理室; 用于产生用于处理物体并将微波引入处理室的微波的微波引入单元; 以及用于控制微波导入单元的控制单元。 微波引入单元包括微波源以产生微波并将微波部分同时引入处理室，并且控制单元控制微波源，使得微波源的任意组合交替地重复同时微波产生状态和微波非微波 在处理对象的状态下的生成状态。

公开(公告)号：US20110214811A1

公开(公告)日：2011-09-08

申请号：US13040719

申请日：2011-03-04

Applicant: Mitsutoshi ASHIDA

Inventor： Mitsutoshi ASHIDA

IPC: H03H7/38 ,  C23F1/08 ,  C23C16/50 ,  C23C16/52

CPC classification number: C23C16/50 ,  C23C16/52 ,  C23F1/08 ,  H01J37/32183 ,  H03H7/38 ,  H03H7/40

Abstract: A controller 90 of an automatic matching unit includes a first and a second matching control unit 100, 102 for respectively variably controlling the electrostatic capacitances of a first and a second variable capacitors 80, 82 through a first and a second stepping motor 86, 88 such that a measured absolute value ZMm and a measured phase Zθm of a load impedance obtained by an impedance measuring unit 84 become close to a predetermined reference absolute value ZMs and a predetermined reference phase Zθs, respectively; and a gain control unit 112. The gain control unit 112 variably controls a proportional gain of at lease one of the first and the second matching unit based on current electrostatic capacitances NC1 and NC2 of the first and the second variable capacitors 80, 82 obtained by a first and a second electrostatic capacitance monitoring unit 108, 110, respectively.

Abstract translation: 自动匹配单元的控制器90包括第一和第二匹配控制单元100,102，用于通过第一和第二步进电机86,88分别可变地控制第一和第二可变电容器80,82的静电电容， 测量的绝对值ZMm和由阻抗测量单元84获得的负载阻抗的测量相位Z＆amp; t; m分别变得接近于预定参考绝对值ZMs和预定参考相位Z＆amp; s; s; 和增益控制单元112.增益控制单元112基于第一和第二可变电容器80,82的当前静电电容NC1和NC2，可变地控制第一和第二匹配单元中的至少一个的比例增益，该静态电容NC1和NC2由 第一和第二静电电容监测单元108,110。

公开(公告)号：US20110209827A1

公开(公告)日：2011-09-01

申请号：US13034331

申请日：2011-02-24

Applicant: Mitsutoshi ASHIDA

Inventor： Mitsutoshi ASHIDA

IPC: H01L21/3065 ,  H03H7/38 ,  B05C11/00 ,  C23C14/34

CPC classification number: H01J37/32082 ,  H01J37/32174 ,  H01J37/32183

Abstract: In an automatic matching unit, a controller includes a first and a second matching algorithm. The operating point Zp is moved stepwise toward the matching point Zs with a relatively large pitch by using the first matching algorithm. Further, when the operating point Zp is within the outer proximity range, the operating point Zp is moved stepwise toward the matching point Zs with a relatively small pitch by using the second matching algorithm. In the second matching algorithm, the operating point Zp is moved close to the third reference line TC1S or TC2S perpendicular to the first or second reference line C1S or C2S along, e.g., the route Zp(7)->Zp(8)->Zp(9) on the impedance coordinates. The coordinates of the operating point Zp(9) reaches an available quasi-matching point ZB extremely close to the origin O (the matching point Zs).

Abstract translation: 在自动匹配单元中，控制器包括第一和第二匹配算法。 通过使用第一匹配算法，操作点Zp以相对大的间距逐步向着匹配点Zs移动。 此外，当操作点Zp处于外部接近范围内时，通过使用第二匹配算法，操作点Zp以相对较小的间距朝着匹配点Zs逐步移动。 在第二匹配算法中，工作点Zp沿着例如路径Zp（7）→Zp（8）→第（k）→（→））移动到垂直于第一或第二参考线C1S或C2S的第三参考线TC1S或TC2S Zp（9）上的阻抗坐标。 工作点Zp（9）的坐标到达非常接近原点O的可用准匹配点ZB（匹配点Zs）。