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公开(公告)号：US20210288683A1
公开(公告)日：2021-09-16
申请号：US17195684
申请日：2021-03-09
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kazuhito NAKAI , Satoshi GOTO , Hidetaka TAKAHASHI , Daerok OH
Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; and a first circuit component. The power amplifier includes: a first amplifying element; a second amplifying element; and an output transformer that includes a primary coil and a secondary coil. An end of the primary coil is connected to an output terminal of the first amplifying element, another end of the primary coil is connected to an output terminal of the second amplifying element, an end of the secondary coil is connected to an output terminal of the power amplifier, the first amplifying element and the second amplifying element are disposed on the first principal surface, and the first circuit component is disposed on the second principal surface.
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公开(公告)号：US20210203367A1
公开(公告)日：2021-07-01
申请号：US17123121
申请日：2020-12-16
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hidetaka TAKAHASHI
Abstract: A radio frequency module includes: a duplexer for a first communication band; a first power amplifier and a first low-noise amplifier connected to the duplexer; a second power amplifier and a second low-noise amplifier for a second communication band; and a switch that switches a connection of an antenna connection terminal between the second power amplifier and the second low-noise amplifier, wherein the first power amplifier and the second power amplifier are disposed on a first principal surface of a module substrate, the first low-noise amplifier and the second low-noise amplifier are incorporated in a semiconductor IC disposed on a second principal surface of the module substrate, and in a plan view of the module substrate, the distance between the first power amplifier and the semiconductor IC is greater than the distance between the second power amplifier and the semiconductor IC.
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公开(公告)号：US20190123888A1
公开(公告)日：2019-04-25
申请号：US16223455
申请日：2018-12-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hidetaka TAKAHASHI , Syunji YOSHIMI
Abstract: A transmit-and-receive module includes a power amplifier, a low-noise amplifier, first and second phase shifter circuits, and a correction circuit. The power amplifier amplifies power of first and second transmit signals. The low-noise amplifier amplifies first and second received signals without increasing noise. The first and second phase shifter circuits adjust impedance for the first received signal and that for the second received signal. The correction circuit supplies a canceling signal to an output node of the second phase shifter circuit. The canceling signal is used for canceling the first transmit signal passing through a receive filter.
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公开(公告)号：US20250112623A1
公开(公告)日：2025-04-03
申请号：US18960361
申请日：2024-11-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takuma KUROYANAGI , Takanori ITO , Hidetaka TAKAHASHI , Hiroyuki KANI
Abstract: In a high-frequency module, a first chip includes one of a plurality of first acoustic wave resonators of a first filter a mounting substrate. A second chip includes one of a plurality of second acoustic wave resonators of a second filter. The second chip is on a side of the first chip opposite to the mounting substrate side. The first chip has a first main surface on the second chip side and a second main surface on the mounting substrate side. The second chip includes a third main surface on the first chip side and a fourth main surface on a side opposite to the first chip side. A first circuit element related to the first filter is on the second main surface side of the first chip. A second circuit element related to the second filter is disposed on the fourth main surface side of the second chip.
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公开(公告)号：US20210288680A1
公开(公告)日：2021-09-16
申请号：US17189291
申请日：2021-03-02
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hidetaka TAKAHASHI , Satoshi GOTO , Yoshiki YASUTOMO , Daerok OH , Yuuto AOKI , Yoshihiro DAIMON , Naoya MATSUMOTO
IPC: H04B1/04
Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; a first circuit component; and a power amplifier (PA) control circuit configured to control the power amplifier. The power amplifier includes: an input terminal; an output terminal; first and second amplifying elements disposed parallel to the input terminal; and an output transformer connected between the output terminal and output terminals of the first and second amplifying elements. The PA control circuit is disposed on the second principal surface, and the first and second amplifying elements are both disposed on the first principal surface.
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Patent Agency Ranking
公开(公告)号：US20250038773A1
公开(公告)日：2025-01-30
申请号：US18910105
申请日：2024-10-09
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiroyuki KANI , Yoshihiro YOSHIMURA , Kiyoshi AIKAWA , Takahiro YAMASHITA , Yuusuke SUZUKI , Hidetaka TAKAHASHI , Takanori ITO , Takuma KUROYANAGI
Abstract: A radio frequency module includes a mounting board, a first acoustic wave filter including a first support disposed at a first main surface of the mounting board, a second acoustic wave filter including a second support disposed on the first acoustic wave filter, and a shield electrode. The shield electrode covers at least a part of the resin layer. The first acoustic wave filter and the second acoustic wave filter pass signals to perform simultaneous communication. A main surface of the second acoustic wave filter on an opposite side from a first acoustic wave filter side is in contact with the shield electrode. A ground electrode of the mounting board is connected to a functional electrode of the first acoustic wave filter.
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公开(公告)号：US20250015782A1
公开(公告)日：2025-01-09
申请号：US18888185
申请日：2024-09-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hidetaka TAKAHASHI , Takanori ITO
Abstract: A radio frequency module including a mounting board, a first acoustic wave filter, a second acoustic wave filter, and a shield electrode. The second acoustic wave filter is disposed on the first acoustic wave filter. The first acoustic wave filter supports a first communication band, and the second acoustic wave filter supports a second communication band. The first acoustic wave filter includes a first support member and a first functional electrode. The second acoustic wave filter includes a second support member and a second functional electrode. The first functional electrode and the second functional electrode are located in a hollow space formed between the first support member and the second support member in a thickness direction of the mounting board, and face each other. The shield electrode is located in the hollow space and covers at least one of the first functional electrode and the second functional electrode.
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8.发明公开公开(公告)号：US20240178868A1
公开(公告)日：2024-05-30
申请号：US18432115
申请日：2024-02-05
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kenji TAHARA , Hidetaka TAKAHASHI , Kae YAMAMOTO
CPC classification number: H04B1/04 , H03F3/24 , H03F3/68 , H04B2001/0408
Abstract: A radio frequency circuit including power amplifiers, a transformer having an input-side coil and an output-side coil, a bias circuit connected to the power amplifiers, an output terminal connected to one end of the output-side coil, an output terminal connected to another end of the output-side coil, a switch connected between the output terminal and a ground, a switch connected between the output terminal and a ground, a phase shift line having an input end connected to an output terminal of the power amplifier and an output end connected to one end of the input-side coil, and a phase shift line having an input end connected to an output terminal of the power amplifier and an output end connected to another end of the input-side coil.
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公开(公告)号：US20240039490A1
公开(公告)日：2024-02-01
申请号：US18482035
申请日：2023-10-06
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hidetaka TAKAHASHI
IPC: H03F3/24
CPC classification number: H03F3/245 , H03F2200/451 , H03F2200/372 , H04B1/38
Abstract: Deterioration of characteristics is reduced. A radio-frequency module includes a first power amplifier circuit, a second power amplifier circuit, and a substrate. The first power amplifier circuit includes a first amplifier component and a first transformer. The second power amplifier circuit includes a second amplifier component and a second transformer. The radio-frequency module further includes a long bump disposed on one main surface of the substrate. The first amplifier component is disposed on the one main surface of the substrate with the long bump interposed between the first amplifier component and the one main surface of the substrate. The long bump is located between the first transformer and the second transformer when viewed in plan in a thickness direction of the substrate.
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公开(公告)号：US20220116061A1
公开(公告)日：2022-04-14
申请号：US17645087
申请日：2021-12-20
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hidetaka TAKAHASHI
Abstract: A radio-frequency module includes a mounting substrate, a power amplifier, a low-noise amplifier, at least one first transmission filter, and at least one first reception filter. The mounting substrate has a first main surface and a second main surface. The power amplifier is disposed on a side where the first main surface of the mounting substrate is located. The low-noise amplifier is disposed on a side where the second main surface of the mounting substrate is located. The first transmission filter allows a TDD transmission signal to pass therethrough. The first reception filter allows a TDD reception signal to pass therethrough. The first transmission filter is disposed on the side where the first main surface of the mounting substrate is located. The first reception filter is disposed on the side where the second main surface of the mounting substrate is located.
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