公开(公告)号：US20210288677A1

公开(公告)日：2021-09-16

申请号：US17184614

申请日：2021-02-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takahiro YAMASHITA

IPC: H04B1/00

Abstract: A module board including a first principal surface and a second principal surface on opposite sides of the module board, the first principal surface and the second principal surface each having at least one circuit component mounted thereon; a plurality of external-connection terminals; a first switching integrated circuit (IC) connected to an antenna connection terminal that is one of the plurality of external-connection terminals; and a second switching IC connected to the antenna connection terminal, the second switching IC being different from the first switching IC. In the above-described module board, the plurality of external-connection terminals are disposed on the second principal surface, and at least one of the first switching IC or the second switching IC is disposed on the second principal surface.

公开(公告)号：US20230298959A1

公开(公告)日：2023-09-21

申请号：US18324314

申请日：2023-05-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiroyuki KANI ,  Yoshihiro YOSHIMURA ,  Takahiro YAMASHITA ,  Ryo WAKABAYASHI ,  Takashi HIROSE ,  Kiyoshi AIKAWA

IPC: H01L23/367 ,  H04B1/036 ,  H01L23/552 ,  H01L23/66 ,  H01L23/00 ,  H01L23/498 ,  H04B1/04

CPC classification number: H01L23/367 ,  H04B1/036 ,  H01L23/552 ,  H01L23/66 ,  H01L24/09 ,  H01L24/16 ,  H01L23/49827 ,  H01L23/49816 ,  H04B1/04 ,  H04B2001/0408 ,  H01L2223/6611 ,  H01L2223/6661 ,  H01L2224/16227 ,  H01L2224/09515 ,  H01L2924/1421 ,  H01L2924/3025 ,  H01L2223/6616

Abstract: A possible benefit of the present disclosure is to further improve a heat dissipation property of an electronic component. A high-frequency module includes a mounting substrate, a filter (for example, a transmission filter), a resin layer, a shielding layer, and a metal member. The resin layer covers at least a portion of an outer peripheral surface (for example, an outer peripheral surface) of the filter. The shielding layer covers at least a portion of the resin layer. The metal member is disposed at a first principal surface of the mounting substrate. The metal member is connected to a surface of the filter on the opposite side from the mounting substrate, the shielding layer, and the first principal surface of the mounting substrate.

公开(公告)号：US20250038773A1

公开(公告)日：2025-01-30

申请号：US18910105

申请日：2024-10-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Hiroyuki KANI ,  Yoshihiro YOSHIMURA ,  Kiyoshi AIKAWA ,  Takahiro YAMASHITA ,  Yuusuke SUZUKI ,  Hidetaka TAKAHASHI ,  Takanori ITO ,  Takuma KUROYANAGI

IPC: H04B1/00 ,  H03H9/64 ,  H04B1/16

Abstract: A radio frequency module includes a mounting board, a first acoustic wave filter including a first support disposed at a first main surface of the mounting board, a second acoustic wave filter including a second support disposed on the first acoustic wave filter, and a shield electrode. The shield electrode covers at least a part of the resin layer. The first acoustic wave filter and the second acoustic wave filter pass signals to perform simultaneous communication. A main surface of the second acoustic wave filter on an opposite side from a first acoustic wave filter side is in contact with the shield electrode. A ground electrode of the mounting board is connected to a functional electrode of the first acoustic wave filter.

公开(公告)号：US20250007496A1

公开(公告)日：2025-01-02

申请号：US18826217

申请日：2024-09-06

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takuma KUROYANAGI ,  Yoshihiro YOSHIMURA ,  Kiyoshi AIKAWA ,  Takahiro YAMASHITA ,  Yuusuke SUZUKI

IPC: H03H9/64 ,  H03H9/13 ,  H03H9/145 ,  H03H9/22 ,  H03H9/25 ,  H03H9/56

Abstract: An acoustic wave device includes a first transmission filter; and a second transmission filter stacked on the first transmission filter so that a first functional surface of the first transmission filter and a second functional surface of the second transmission filter face each other at a predetermined distance. The first transmission filter includes a first input terminal and a first acoustic wave resonator. The second transmission filter includes a second input terminal and a second acoustic wave resonator. The first acoustic wave resonator includes a first functional electrode formed on the first functional surface. The second acoustic wave resonator includes a second functional electrode formed on the second functional surface. In a plan view along a thickness direction of the first and second transmission filters, a first formation region of the first functional electrode and a second formation region of the second functional electrode do not overlap each other.

公开(公告)号：US20230344460A1

公开(公告)日：2023-10-26

申请号：US18342743

申请日：2023-06-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Masanari MIURA ,  Kiyoshi AIKAWA ,  Hiroyuki NAGAMORI ,  Takanori UEJIMA ,  Yuji TAKEMATSU ,  Takahiro YAMASHITA ,  Ryo WAKABAYASHI ,  Yoshihiro YOSHIMURA ,  Takashi HIROSE

IPC: H04B1/40 ,  H05K1/18 ,  H05K9/00 ,  H01L25/16 ,  H01L23/552

CPC classification number: H04B1/40 ,  H05K1/181 ,  H05K9/0022 ,  H01L25/16 ,  H01L23/552 ,  H05K2201/1006 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10053 ,  H05K2201/10371

Abstract: A high-frequency module is capable of two-uplink of a transmission signal in Band A and transmission of Band C, and includes a module substrate, a metal shield plate arranged on a principal surface, power amplifiers, a transmission filter of Band A, and a transmission filter of Band C. In a plan view, the metal shield plate is arranged between a first transmission component and a second transmission component. The first transmission component is one of the power amplifier, the transmission filter, a switch circuit, and a first inductor and a first capacitor arranged in a first transmission path, and the second transmission component is one of the power amplifier, the transmission filter, a switch circuit, and a second inductor and a second capacitor arranged in a second transmission path.

公开(公告)号：US20230179157A1

公开(公告)日：2023-06-08

申请号：US18162875

申请日：2023-02-01

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takahiro YAMASHITA ,  Masakazu HIROBE

IPC: H03F3/60 ,  H03F3/24 ,  H03F3/45

CPC classification number: H03F3/60 ,  H03F3/24 ,  H03F3/45

Abstract: To provide a high-frequency circuit and a communication device by which a harmonic component in differential amplification can be attenuated. The high-frequency circuit includes a differential amplifier circuit. The differential amplifier circuit includes a first amplifying element, a second amplifying element, first wiring, second wiring, and a series circuit. The first amplifying element includes a first input terminal and a first output terminal. The second amplifying element includes a second input terminal and a second output terminal. The first wiring is connected to the first output terminal. The second wiring is connected to the second output terminal. The series circuit is connected between the first wiring and the second wiring. The series circuit includes a first inductor, a second inductor, and a capacitor.