公开(公告)号：US10993329B2

公开(公告)日：2021-04-27

申请号：US16910226

申请日：2020-06-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuniaki Yosui ,  Daisuke Tonaru ,  Hideyuki Taguchi ,  Genro Kato

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K1/14 ,  H05K3/28 ,  H05K3/34 ,  H05K3/36 ,  H05K1/18

Abstract: A first board includes a first insulating substrate including a first main surface, a first electrode pad, and a first resist film. The first electrode pad is a conductor pattern provided on the first main surface. The first resist film is provided on the first main surface and is located closer to the first electrode pad than any conductor provided on the first main surface. The first resist film is spaced away from the first electrode pad with a gap provided between the first resist film and the first electrode pad. The first resist film is thicker than the first electrode pad.

公开(公告)号：US10959327B2

公开(公告)日：2021-03-23

申请号：US16412489

申请日：2019-05-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shinichi Araki ,  Hideyuki Taguchi ,  Hayato Noma ,  Ryosuke Takada

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/28 ,  H05K3/46

Abstract: A plate-shaped multilayer wiring substrate includes at least two resin layers stacked on top of each other and each including an insulating base and a conductive pattern provided on the insulating base, and a front surface layer joined onto the resin layers stacked. The front surface layer has a higher elastic modulus than an elastic modulus of the insulating bases. A joint interface between the resin layers and the front surface layer includes projections and depressions. Also, a method for manufacturing the plate-shaped multilayer wiring substrate includes a step of stacking, on top of resin layers, a front surface layer having a higher elastic modulus than an elastic modulus of the resin layers, and a step of performing pressing under pressure from above the front surface layer by using a flat surface in a heated state to join the resin layers and the front surface layer.