公开(公告)号：US20140296452A1

公开(公告)日：2014-10-02

申请号：US14223300

申请日：2014-03-24

Applicant: NAN YA PLASTICS CORPORATION

Inventor： Dein-Run FUNG ,  Te-Chao LIAO ,  Chia-Cheng CHAO ,  Hao-Sheng CHEN

IPC: C08G61/00 ,  C08G8/28

CPC classification number: C08G8/28 ,  C08G8/04 ,  C08G8/08 ,  C08G59/621

Abstract: A phenolic-type phosphorous curing agent works by grafting a phosphorous compound onto a benzene ring to substitute hydrogen atoms and is halogen-free and nonflammable; when acting with and curing an epoxy resin, the curing agent helps to form a higher crosslink density and excellent heat tolerance to let the epoxy resin suitable for use in making PCB's insulating layer or semiconductor packaging as well as to endow the PCB's insulating layer or semiconductor packaging provided with excellent flame retardance and high glass transition temperature (Tg).

Abstract translation: 酚类磷固化剂通过将磷化合物接枝到苯环上以代替氢原子而工作，并且是无卤素且不可燃的; 当与环氧树脂一起作用和固化时，固化剂有助于形成更高的交联密度和优异的耐热性，以使环氧树脂适合用于制造PCB绝缘层或半导体封装以及赋予PCB绝缘层或半导体 包装具有优异的阻燃性和高玻璃化转变温度（Tg）。