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    FLUORINE-CONTAINING MODIFIED BISMALEIMIDE RESIN
    1.
    发明申请
    FLUORINE-CONTAINING MODIFIED BISMALEIMIDE RESIN 有权
    含氟的改性双马来酰亚胺树脂

    公开(公告)号：US20160168330A1

    公开(公告)日：2016-06-16

    申请号：US14958065

    申请日：2015-12-03

    Applicant: NAN YA PLASTICS CORPORATION

    Inventor： Te-Chao LIAO ,  Dein-Run FUNG ,  Cheng-Li CHAO ,  Hao-Sheng CHEN ,  Yung-Sheng WANG

    IPC: C08G73/12

    CPC classification number: C08G73/128 ,  C08G73/121 ,  C08G73/123 ,  C08G73/126 ,  C08G73/127

    Abstract: A modified bismaleimide resin is made by modify bismaleimide with aromatic diamine that contains fluoro substituents through chain-growth polymerization; and modified bismaleimide resin is excellent in physical properties including a low dielectric constant Dk (3 GHz) less than 3.0, a dissipation factors (3 GHz) less than 0.02, a low resin water absorptivity ranging from 0.21% to 0.33% and an excellent processability, and is particularly suited for producing a copper clad laminate that is required to have dielectric constant Dk (3 GHz) less than 3.

    Abstract translation: 改性双马来酰亚胺树脂是通过双链双马来酰亚胺与通过链增长聚合含有氟取代基的芳族二胺来制备的; 改性双马来酰亚胺树脂的物理性能优异，包括低于3.0的低介电常数Dk（3GHz），小于0.02的耗散因数（3GHz），低的树脂吸水率为0.21％〜0.33％，加工性优异 ，特别适用于制造介电常数Dk（3GHz）小于3的覆铜层压板。

    INORGANIC FILLER COATED WITH MOLYBDENUM COMPOUND AND USAGE THEREOF
    2.
    发明申请
    INORGANIC FILLER COATED WITH MOLYBDENUM COMPOUND AND USAGE THEREOF 审中-公开
    无机填料，其中含有莫来石化合物及其用途

    公开(公告)号：US20150105497A1

    公开(公告)日：2015-04-16

    申请号：US14503536

    申请日：2014-10-01

    Applicant: NAN YA PLASTICS CORPORATION

    Inventor： Dein-Run FUNG ,  Te-Chao LIAO ,  Hao-Sheng CHEN ,  Chun-Lai CHEN

    IPC: C08K3/22 ,  C08K3/36

    CPC classification number: C08K9/02 ,  C08J5/24

    Abstract: An inorganic filler coated with molybdenum compound used as an additive is added into a resin mixture in an amount of 20 to 80 wt % of the resin mixture, resulted in that printed circuit boards if made from a laminate or a prepreg containing the resin mixture have properties of a low coefficient of thermal expansion, good heat tolerance and excellent drilling processability.

    Abstract translation: 将用作添加剂的钼化合物涂覆的无机填料以树脂混合物的20〜80重量％的量添加到树脂混合物中，导致印刷电路板如果由层压制品或含有树脂混合物的预浸料制成 性能低的热膨胀系数，良好的耐热性和优异的钻孔加工性能。

    COMPOSITE MATERIAL MADE OF THERMOSETTING RESIN COMPOSITION
    3.
    发明申请
    COMPOSITE MATERIAL MADE OF THERMOSETTING RESIN COMPOSITION 审中-公开

    公开(公告)号：US20200165446A1

    公开(公告)日：2020-05-28

    申请号：US16202156

    申请日：2018-11-28

    Applicant: NAN YA PLASTICS CORPORATION

    Inventor： Te-Chao LIAO ,  Ying-Te HUANG ,  Hao-Sheng CHEN ,  Hung-Yi CHANG ,  Chia-Lin LIU

    IPC: C08L71/12 ,  C08L47/00 ,  C08L53/02 ,  H05K1/03

    Abstract: A thermosetting resin composition comprises a thermosetting polybutadiene resin, a thermosetting polyphenylene ether resin that is ended with styrene and acrylate in a weight ratio of 0.5-1.5 as reactive functional groups, a thermoplastic resin that serves to set desired heat resistance, flowability and filling performance, a compound cross-linking initiator composed of peroxides of different half-life temperatures to effectively improve its crosslink density during its thermal curing process; particularly the composition after cured has a low dielectric constant, a low dielectric dissipation factor, a high Tg, and high rigidity, and the prepreg made thereof is easy to cut.

    PROCESS FOR PREPARING POLYPHENYLENE ETHER MICROSPORE DISPERSION
    5.
    发明申请
    PROCESS FOR PREPARING POLYPHENYLENE ETHER MICROSPORE DISPERSION 有权
    制备聚苯乙烯微孔分散体的方法

    公开(公告)号：US20160340546A1

    公开(公告)日：2016-11-24

    申请号：US15148050

    申请日：2016-05-06

    Applicant: NAN YA PLASTICS CORPORATION

    Inventor： Te-Chao LIAO ,  Jung-Jen CHUANG ,  Hao-Sheng CHEN ,  Yi-Cheng LI ,  Zhang-Jian HUANG

    IPC: C09D171/12

    CPC classification number: C09D171/12 ,  C08G65/46 ,  C08G65/485 ,  C08L71/12

    Abstract: A process for preparing PPE microspore dispersion includes steps of: dissolving a high-molecular polyphenylene ether in a first solvent at 45-110° C. to form a dissolution liquid; adding processing aids and well mixing the dissolution liquid into a dispersed phase; cooling the dissolution liquid to 42-80° C., and adding a second solvent to generate PPE microspores via PPE to wrap around the processing aids; cooling the dissolution liquid to 0-40° C. to obtain PPE microspore dispersions for use in application for impregnation processes performed below 40° C., thereby high-temperature impregnation equipment are no longer needed, and copper clad laminates made of using the PPE microspore dispersion enjoy excellent physical properties including high Tg, low Dk, low Df and high copper foil's peel strength.

    Abstract translation: 制备PPE小球分散体的方法包括以下步骤：在45-110℃下将高分子量聚苯醚溶解在第一溶剂中以形成溶解液; 加入加工助剂并将溶解液充分混合成分散相; 将溶解液冷却至42-80℃，并加入第二溶剂以通过PPE生成PPE小孢子以包裹加工助剂; 将溶解液冷却至0-40℃，得到用于40℃以下进行浸渍处理的PPE小分散体，由此不再需要高温浸渍设备，使用PPE制成的覆铜层压板 小分散体具有高Tg，低Dk，低Df和高铜箔剥离强度等优良的物理性能。

    THERMOSETTING RESIN COMPOSITION
    9.
    发明申请
    THERMOSETTING RESIN COMPOSITION 审中-公开

    公开(公告)号：US20180163023A1

    公开(公告)日：2018-06-14

    申请号：US15834259

    申请日：2017-12-07

    Applicant: NAN YA PLASTICS CORPORATION

    Inventor： Te-Chao LIAO ,  Ying-Te HUANG ,  Hao-Sheng CHEN ,  Hung-Yi CHANG ,  Chia-Lin LIU

    IPC: C08K5/5333 ,  C08J5/24 ,  C08K3/36 ,  H05K1/09

    Abstract: A thermosetting resin composition contains a primary resin formed from mixing a styrene-type polyphenylene ether resin thermally modified with styrene with an acrylic-type polyphenylene ether resin thermally modified with acrylic at a weight ratio ranging between 0.5 and 1.5, consequently having excellent heat resistance, flowability, and filling ability; and when cured, having a dielectric constant smaller than 3.0 and a dielectric dissipation factor smaller less than 0.0020 at the frequency of 1 GHz as well as a glass transition temperature higher than 210° C.; in application, the composition is suitable to impregnate reinforcement to form prepregs with excellent cutability.

    HALOGEN-FREE, NONFLAMMABLE AND HIGH GLASS TRANSITION TEMPERATURE PHENOLIC RESIN-BASED CURING AGENT AND PROCESS FOR PRODUCING THE SAME
    10.
    发明申请
    HALOGEN-FREE, NONFLAMMABLE AND HIGH GLASS TRANSITION TEMPERATURE PHENOLIC RESIN-BASED CURING AGENT AND PROCESS FOR PRODUCING THE SAME 有权
    无卤素，不可熔和高透光度温度酚醛树脂固化剂及其制造方法

    公开(公告)号：US20140296452A1

    公开(公告)日：2014-10-02

    申请号：US14223300

    申请日：2014-03-24

    Applicant: NAN YA PLASTICS CORPORATION

    Inventor： Dein-Run FUNG ,  Te-Chao LIAO ,  Chia-Cheng CHAO ,  Hao-Sheng CHEN

    IPC: C08G61/00 ,  C08G8/28

    CPC classification number: C08G8/28 ,  C08G8/04 ,  C08G8/08 ,  C08G59/621

    Abstract: A phenolic-type phosphorous curing agent works by grafting a phosphorous compound onto a benzene ring to substitute hydrogen atoms and is halogen-free and nonflammable; when acting with and curing an epoxy resin, the curing agent helps to form a higher crosslink density and excellent heat tolerance to let the epoxy resin suitable for use in making PCB's insulating layer or semiconductor packaging as well as to endow the PCB's insulating layer or semiconductor packaging provided with excellent flame retardance and high glass transition temperature (Tg).

    Abstract translation: 酚类磷固化剂通过将磷化合物接枝到苯环上以代替氢原子而工作，并且是无卤素且不可燃的; 当与环氧树脂一起作用和固化时，固化剂有助于形成更高的交联密度和优异的耐热性，以使环氧树脂适合用于制造PCB绝缘层或半导体封装以及赋予PCB绝缘层或半导体 包装具有优异的阻燃性和高玻璃化转变温度（Tg）。

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