公开(公告)号：US20240120250A1

公开(公告)日：2024-04-11

申请号：US18482176

申请日：2023-10-06

申请人： NEXPERIA B.V.

发明人： Sönke Habenicht ,  Nam Khong Then ,  Hans-Juergen Funke

IPC分类号： H01L23/31 ,  H01L21/56 ,  H01L23/495

CPC分类号： H01L23/3142 ,  H01L21/56 ,  H01L23/49586

摘要： A semiconductor device is provided, including: a lead frame, a semiconductor chip, a mold, and an adhesion promoter. The lead frame includes a first surface and a second frame surface opposite the first surface, and the chip includes a first and a second surface opposite the first surface, the first frame surface is an outer surface of the device, with the second frame surface attached to the first chip surface so that the second frame surface is partially covered by the first chip surface. An uncovered surface part of the second frame surface and the second chip side are in contact with the mold by the adhesion promoter, that is on the uncovered surface part of the second frame surface and/or on the second chip surface. The adhesion promoter enhances adhesion between the mold, and either the second frame surface or the second chip surface of the chip.

公开(公告)号：US11728179B2

公开(公告)日：2023-08-15

申请号：US16111470

申请日：2018-08-24

申请人： NEXPERIA B.V.

发明人： Ricardo Yandoc ,  Adam Richard Brown ,  Haibo Fan ,  Kow Siew Ting ,  Nam Khong Then ,  Wei Leong Tan

IPC分类号： H01L23/49 ,  H01L21/48 ,  H01L21/56 ,  H01L23/495 ,  H01L23/31

CPC分类号： H01L21/4842 ,  H01L21/4825 ,  H01L21/4839 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49582

摘要： A surface mount semiconductor device and method of manufacture. A semiconductor die is mounted on a first support surface; a leadframe is attached to the semiconductor die, the leadframe comprising: an electrical lead having a first lead region connected to the semiconductor die; and a second lead region distal the first lead region, wherein the second lead region is connected to a second support surface; encapsulating the semiconductor die, first support surface and the first lead region; the second lead region is severed from the second support surface to expose a lead end; and the second lead region is electro-plated with a metallic material, such that the lead end is coated with said metallic material.