公开(公告)号：US11728179B2

公开(公告)日：2023-08-15

申请号：US16111470

申请日：2018-08-24

申请人： NEXPERIA B.V.

发明人： Ricardo Yandoc ,  Adam Richard Brown ,  Haibo Fan ,  Kow Siew Ting ,  Nam Khong Then ,  Wei Leong Tan

IPC分类号： H01L23/49 ,  H01L21/48 ,  H01L21/56 ,  H01L23/495 ,  H01L23/31

CPC分类号： H01L21/4842 ,  H01L21/4825 ,  H01L21/4839 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49582

摘要： A surface mount semiconductor device and method of manufacture. A semiconductor die is mounted on a first support surface; a leadframe is attached to the semiconductor die, the leadframe comprising: an electrical lead having a first lead region connected to the semiconductor die; and a second lead region distal the first lead region, wherein the second lead region is connected to a second support surface; encapsulating the semiconductor die, first support surface and the first lead region; the second lead region is severed from the second support surface to expose a lead end; and the second lead region is electro-plated with a metallic material, such that the lead end is coated with said metallic material.