公开(公告)号：US20230411175A1

公开(公告)日：2023-12-21

申请号：US18333854

申请日：2023-06-13

申请人： NEXPERIA B.V.

发明人： Wai Wai Lee ,  Ting Wei Chang ,  Jia Yunn Ting ,  Wei Leong Tan

IPC分类号： H01L21/56 ,  H01L21/52 ,  H01L21/48 ,  H01L21/67

CPC分类号： H01L21/565 ,  H01L21/52 ,  H01L21/4835 ,  H01L21/67023 ,  H01L21/67057 ,  H01L2021/60015

摘要： A method for manufacturing a semiconductor package assembly is provided. The assembly includes a semiconductor package and a molding resin case encapsulating the semiconductor package. The complete semiconductor package undergoes a surface roughening treatment, thus improving the overall adhesion with the molding resin (EMC) and reducing the risks of delamination.

公开(公告)号：US20230402355A1

公开(公告)日：2023-12-14

申请号：US18331215

申请日：2023-06-08

申请人： NEXPERIA B.V.

发明人： Wei Leong Tan ,  Wai Wai Lee ,  Hing Suan Cheam

IPC分类号： H01L23/495 ,  H01L23/367 ,  H01L23/31 ,  H01L25/065 ,  H01L21/52 ,  H01L21/56

CPC分类号： H01L23/49575 ,  H01L23/4951 ,  H01L23/3675 ,  H01L23/3121 ,  H01L25/0657 ,  H01L21/52 ,  H01L21/565 ,  H01L2225/06506 ,  H01L2021/60292

摘要： An electronic package and a method for manufacturing the same is provided. The electronic package includes a first substrate, an electronic component arranged on and/or formed in the first substrate, a thermally conductive second substrate including a first portion and a second portion integrally connected to the first portion, and at least the first portion among the first and second portion is fixedly attached to the electronic component, and a package material arranged to encapsulate the electronic component and to at least partially encapsulate the first and second substrate, and the package material includes a recess formed therein that extends up to a surface of the first portion.

公开(公告)号：US20230326835A1

公开(公告)日：2023-10-12

申请号：US18298474

申请日：2023-04-11

申请人： NEXPERIA B.V.

发明人： Hing Suan Cheam ,  Wei Leong Tan ,  Ting Wei Chang

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L23/4951 ,  H01L24/32 ,  H01L24/29 ,  H01L24/33 ,  H01L23/3107 ,  H01L21/56 ,  H01L24/83 ,  H01L2224/32245 ,  H01L2224/29111 ,  H01L2224/33181 ,  H01L2224/33183 ,  H01L2224/3303 ,  H01L2224/33055 ,  H01L2224/3226 ,  H01L2224/32013 ,  H01L23/49531 ,  H01L2224/838 ,  H01L2224/83438 ,  H01L2224/83447 ,  H01L2224/83466 ,  H01L2924/0132 ,  H01L2924/01004

摘要： Aspects of the present disclosure relate to a molded electronic package and a method for manufacturing the same. The molded electronic package includes a first substrate, a second substrate, an electronic component arranged on the first substrate, a spring member arranged between the second substrate and the electronic component, the spring member including a first contact portion being fixated relative to the second substrate, and a second contact portion physically contacting the electronic component, and a body of solidified molding compound configured to encapsulate the electronic component and the spring member and to mutually fixate the first substrate, the second substrate, the electronic component and the spring member. The second substrate and the spring member are electrically and/or thermally conductive.

公开(公告)号：US11728179B2

公开(公告)日：2023-08-15

申请号：US16111470

申请日：2018-08-24

申请人： NEXPERIA B.V.

发明人： Ricardo Yandoc ,  Adam Richard Brown ,  Haibo Fan ,  Kow Siew Ting ,  Nam Khong Then ,  Wei Leong Tan

IPC分类号： H01L23/49 ,  H01L21/48 ,  H01L21/56 ,  H01L23/495 ,  H01L23/31

CPC分类号： H01L21/4842 ,  H01L21/4825 ,  H01L21/4839 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49582

摘要： A surface mount semiconductor device and method of manufacture. A semiconductor die is mounted on a first support surface; a leadframe is attached to the semiconductor die, the leadframe comprising: an electrical lead having a first lead region connected to the semiconductor die; and a second lead region distal the first lead region, wherein the second lead region is connected to a second support surface; encapsulating the semiconductor die, first support surface and the first lead region; the second lead region is severed from the second support surface to expose a lead end; and the second lead region is electro-plated with a metallic material, such that the lead end is coated with said metallic material.