公开(公告)号：US20220214223A1

公开(公告)日：2022-07-07

申请号：US17613222

申请日：2020-05-21

Applicant: NEXTINPUT, INC.

Inventor： Ali FOUGHI ,  Julius Minglin TSAI ,  Christopher EDWARDS

IPC: G01J5/20 ,  G01J5/00 ,  G01J5/02 ,  G01J5/58

Abstract: Described herein is a sensor in chip scale package form factor. For example, a non-vacuum packaged sensor chip described herein includes a substrate, and a sensing element arranged on the substrate. The sensing element is configured to change resistance with temperature. Additionally, the non-vacuum packaged sensor chip includes an absorbing layer configured to absorb middle infrared (“MIR”) radiation.

公开(公告)号：US20200278748A1

公开(公告)日：2020-09-03

申请号：US16645650

申请日：2018-09-07

Applicant: NEXTINPUT, INC.

Inventor： Julius Minglin TSAI ,  Albert BERGEMONT ,  Christopher EDWARDS ,  Ali FOUGHI

IPC: G06F3/01 ,  H01L41/09 ,  H01L41/187 ,  G01L5/1627

Abstract: Integrated systems for force or strain sensing and haptic feedback are described herein. An example force-haptic system can include a sensor chip configured to receive an applied force, where the sensor chip includes at least one sensing element and an integrated circuit. The force-haptic system can also include a haptic actuator configured to convert an electrical excitation signal into mechanical vibration. Further, the force-haptic system can include a circuit board, where the sensor chip and the haptic actuator are electrically and mechanically coupled to the circuit board. The integrated circuit can be configured to process an electrical signal received from the at least one sensing element and to output the electrical excitation signal.