公开(公告)号：US20240291109A1

公开(公告)日：2024-08-29

申请号：US18573492

申请日：2022-06-27

Applicant: NITTO DENKO CORPORATION

Inventor： Kyotaro YAMADA ,  Yuki TAKEDA ,  Motoki HAISHI ,  Kenji FURUTA

IPC: H01M50/457 ,  H01M50/434

CPC classification number: H01M50/457 ,  H01M50/434

Abstract: A separator for a nonaqueous electrolyte secondary battery according to the present invention includes a porous base material, a metal layer situated over either or both of opposite surfaces of the porous base material, and a metal oxide layer situated either over one of opposite surfaces of the metal layer or over both of the opposite surfaces of the metal layer, the one being a surface opposite to a surface of the metal layer on a side of the porous base material.

公开(公告)号：US20240291108A1

公开(公告)日：2024-08-29

申请号：US18573979

申请日：2022-06-27

Applicant: NITTO DENKO CORPORATION

Inventor： Kyotaro YAMADA ,  Yuki TAKEDA ,  Motoki HAISHI ,  Kenji FURUTA

IPC: H01M50/451 ,  H01M50/403 ,  H01M50/489

CPC classification number: H01M50/451 ,  H01M50/403 ,  H01M50/489

Abstract: A multilayer body for a battery according to the present invention includes: a separator including a porous base material formed in a plate shape, and an inorganic material layer situated over either or both of opposite principal surfaces of the porous base material; and an organic support over which the separator is laminated.

公开(公告)号：US20230422397A1

公开(公告)日：2023-12-28

申请号：US18339005

申请日：2023-06-21

Applicant: NITTO DENKO CORPORATION

Inventor： Takahiro IKEDA ,  Taketo ISHIKAWA ,  Yuki TAKEDA ,  Hironori KUWAYAMA ,  Kyotaro YAMADA

IPC: H05K1/03 ,  H05K3/46

CPC classification number: H05K1/036 ,  H05K3/467 ,  H05K2203/0315

Abstract: A wiring circuit board includes a metal supporting board, first and second metal thin films, an insulating layer, and a conductive layer, where the resistance between the conductive layer and metal supporting board are lowered. The first metal thin film is disposed on one surface of the metal supporting board in the thickness direction, with the insulating layer having a through hole. The second metal thin film is disposed on one surface of the insulating layer in the thickness direction with the conductive layer disposed thereon. In the through hole, the first and second metal thin films, whose surfaces contact, are disposed between the metal supporting board and the conductive layer, and the other surface of the first metal thin film is in contact with the one surface of the metal supporting board. The other surface of the second metal thin film is in contact with the conductive layer.

公开(公告)号：US20230413431A1

公开(公告)日：2023-12-21

申请号：US18330058

申请日：2023-06-06

Applicant: NITTO DENKO CORPORATION

Inventor： Takahiro IKEDA ,  Kyotaro YAMADA ,  Taketo ISHIKAWA ,  Hironori KUWAYAMA ,  Yuki TAKEDA

IPC: H05K1/02 ,  H05K1/05 ,  H05K1/09 ,  H05K3/46 ,  H05K3/40

CPC classification number: H05K1/0298 ,  H05K1/05 ,  H05K1/09 ,  H05K3/4673 ,  H05K3/4038

Abstract: A wiring circuit board includes a metal supporting layer, a first metal thin film, an insulating layer including a through hole, a second metal thin film disposed on the first metal thin film in the through hole, and a conductive pattern electrically connected to the metal supporting layer through the first metal thin film and the second metal thin film in the through hole. The first metal thin film includes an oxide coating at least on a contact surface in contact with the insulating layer. In the central part of the through hole, the oxide coating has a thickness of 0 or a thickness smaller than a thickness of the oxide coating on the contact surface.