公开(公告)号：US20150085452A1

公开(公告)日：2015-03-26

申请号：US14457469

申请日：2014-08-12

Applicant: NOVATEK MICROELECTRONICS CORP.

Inventor： Chun-Yi CHOU ,  Yu-Chang PAI ,  Teng-Yang TAN ,  Shih-Wei TSENG

IPC: H01R12/79 ,  H05K3/10 ,  H05K1/02

CPC classification number: H01R12/79 ,  H01B7/0823 ,  H01P5/12 ,  H01R12/727 ,  H01R13/6471 ,  H05K1/0245 ,  H05K1/14 ,  H05K1/142 ,  H05K1/147 ,  H05K1/189 ,  H05K3/308 ,  H05K2201/10189

Abstract: A layout method applied to a connector is provided. The connector is electrically connected between a flexible printed circuit (FPC) and a printed circuit board (PCB). The FPC includes M pairs of differential lines and X shield lines. The PCB includes M pairs of differential lines and Z shield lines. The layout method includes following steps. Firstly, M pairs of conductive lines are disposed on the connector. The M conductive lines are correspondingly electrically connected to the M differential lines of the FPC and the M differential lines of the PCB. Then; Y conductive lines are disposed on the connector, wherein Y is smaller than X. Furthermore, at least one of the Y conductive lines is electrically connected to at least one of the X shield lines and at least one of the Z shield lines.

Abstract translation: 提供了应用于连接器的布局方法。 连接器电连接在柔性印刷电路（FPC）和印刷电路板（PCB）之间。 FPC包括M对差分线和X屏蔽线。 PCB包括M对差分线和Z屏蔽线。 布局方法包括以下步骤。 首先，M对导线设置在连接器上。 M导电线相应地电连接到FPC的M个差分线和PCB的M个差分线。 然后; Y导电线设置在连接器上，其中Y小于X.此外，Y导电线中的至少一个电连接到X屏蔽线和至少一个Z屏蔽线中的至少一个。

公开(公告)号：US20130175078A1

公开(公告)日：2013-07-11

申请号：US13689017

申请日：2012-11-29

Applicant: NOVATEK MICROELECTRONICS CORP.

Inventor： Yu-Chang PAI

IPC: H05K1/11

CPC classification number: H05K1/11 ,  H05K1/0222 ,  H05K1/0245 ,  H05K1/0251

Abstract: The printed circuit board comprises two first signal traces, a first grounding layer, two first signal traces, a second grounding layer, two signal conductive pillars and two grounding conductive pillars. The first signal traces are formed on a first surface of a substrate. The first grounding layer is formed on the first surface. The second signal traces are formed on a second surface of the substrate. The second grounding layer is formed on the second surface. The signal conductive pillars are extended to the second surface from the first surface and each signal conductive pillar connects the corresponding first signal trace and second signal trace. The grounding conductive pillars are extended to the second surface from the first surface and each grounding conductive pillar connects the first grounding layer and the second grounding layer. Each grounding conductive pillar and the corresponding signal conductive pillar are disposed in pairs.

Abstract translation: 印刷电路板包括两个第一信号迹线，第一接地层，两个第一信号迹线，第二接地层，两个信号导电柱和两个接地导电柱。 第一信号迹线形成在基板的第一表面上。 第一接地层形成在第一表面上。 第二信号迹线形成在基板的第二表面上。 第二接地层形成在第二表面上。 信号导电柱从第一表面延伸到第二表面，并且每个信号导电柱连接相应的第一信号迹线和第二信号迹线。 接地导电柱从第一表面延伸到第二表面，每个接地导体柱连接第一接地层和第二接地层。 每个接地导体柱和对应的信号导电柱成对设置。