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公开(公告)号：US12120815B2
公开(公告)日：2024-10-15
申请号：US18208920
申请日：2023-06-13
发明人： Tomohiro Nagai
CPC分类号： H05K1/0298 , H05K1/0284 , H01P3/00 , H05K1/0245 , H05K1/025 , H05K1/0278 , H05K1/111 , H05K1/112 , H05K1/18
摘要： A multilayer substrate includes an insulator that includes a first region and a second region that is thinner than the first region, and a first signal line and a second signal line that are structured to extend across the first region and the second region. In a region in which the first signal line and the second signal line face each other, a line width of the first signal line and a line width of the second signal line are smaller in the second region than in the first region, and a distance between the first signal line and the second signal line is smaller in the second region than in the first region.
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公开(公告)号：US20240292530A1
公开(公告)日：2024-08-29
申请号：US18572653
申请日：2022-06-17
申请人： KYOCERA Corporation
发明人： Shigenori TAKAYA , Tomoya KON , Kyosuke FUKUDA
CPC分类号： H05K1/0298 , H05K1/0245 , H05K1/115 , H05K2201/09727
摘要： A wiring board includes: a base including first and second faces and a side face between the first and second faces; a signal electrode on the first face; first and second recesses located in the side face and extending to the first face; and first and second ground conductors on an inner surface of the first and second recesses, respectively. When viewed in a first direction perpendicular to the first face, an outline of the base includes at least one circular arc; when viewed in the first direction, the signal electrode extends from a center value region on the first face toward the circular arc and is shifted from a normal line passing through a center point of the circular arc; and when viewed in the first direction, the first and second recesses overlap the circular arc, and the first recess is on one side of the signal electrode, and the second recess is on the other side of the signal electrode.
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公开(公告)号：US20240147605A1
公开(公告)日：2024-05-02
申请号：US18499044
申请日：2023-10-31
发明人： Xingyu CHENG , Shota YAMADA , Takafumi SUGAWARA , Nobuhiro TAMAI
IPC分类号： H05K1/02 , H01R13/6469
CPC分类号： H05K1/0245 , H01R13/6469 , H05K1/0366 , H05K2201/09245
摘要： The intermediate circuit board has a plate-shaped substrate and a plurality of signal transmission line pairs for differential signal transmission extending on a major face of the substrate from one end to the other end of the substrate in the direction of connection to the counterpart connect bodies; the substrate has a fiber cloth formed by braiding a plurality of fibers used to reinforce the substrate in a mesh pattern and a plate-like member made of plastic having the fiber cloth embedded therein; the plurality of signal transmission line pairs have straight pairs and cross pairs disposed in an alternating manner in the width direction of the substrate; and the straight pairs and cross pairs, when viewed in the through-thickness direction of the substrate, are formed extending inclined at an angle relative to the fibers of the fiber cloth.
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公开(公告)号：US11968775B2
公开(公告)日：2024-04-23
申请号：US17326267
申请日：2021-05-20
发明人： Yeon Sun Na , Min Soo Choi
CPC分类号： H05K1/0245 , H01L25/18 , H05K1/0225 , H05K1/148 , H05K1/189 , H05K2201/049 , H05K2201/0723 , H05K2201/09727 , H05K2201/10128
摘要： An embodiment of a printed circuit board includes a first insulating layer, a metal layer disposed above the first insulating layer, a second insulating layer disposed above the metal layer, and signal lines disposed above the second insulating layer, the signal lines extending in a first direction and having line widths in a second direction perpendicular to the first direction. The metal layer has open areas overlapping the signal lines in a third direction perpendicular to the first and second directions. In another embodiment, the open areas are replaced with metal meshes.
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公开(公告)号：US20240098886A1
公开(公告)日：2024-03-21
申请号：US17948893
申请日：2022-09-20
申请人： DELL PRODUCTS L.P.
CPC分类号： H05K1/0248 , H01P3/081 , H05K1/0245 , H05K1/05 , H05K2201/09218
摘要： A printed circuit board includes first and second insulating layers, first and second strip line circuit traces formed on a surface of the first insulating layer, and a patterned dielectric material. The first strip line circuit trace has a first length and carries a first signal. The second strip line circuit trace is adjacent to the first strip line circuit trace, has a second length longer than the first length, and carries a second signal. The patterned dielectric material is provided over a portion of the first length to delay the first signal relative to the second signal. The second insulating layer is affixed to the surface and covers the first and second strip line circuit traces and the patterned dielectric material.
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公开(公告)号：US11930588B2
公开(公告)日：2024-03-12
申请号：US17435642
申请日：2020-01-30
发明人： Sota Hatano
CPC分类号： H05K1/0245 , H01R12/7076 , H01R12/79 , H05K1/0277 , H05K1/115 , H05K1/14 , H04N25/70 , H05K2201/10189
摘要： There are provided a signal transmission apparatus and a signal transmission method for use therewith, the apparatus using a small-sized connector configuration and a flexible printed circuit board to prevent a decrease in the quality of a differential signal. The flexible printed circuit board has signal transmission paths for transmitting the differential signal. At least one of connector connection parts of the flexible printed circuit board has a first connection part column and a second connection part column obtained by arranging a plurality of signal line connection parts, the signal line connection parts being connection parts between the signal transmission paths and intra-connector wiring. Each of the signal line connection parts in the connection part columns is configured to be connected with the signal transmission path formed on the back side of the flexible printed circuit board by way of a VIA (through-hole) formed between the first connection part column and the second connection part column. For example, the first connection part column includes a GND signal line connection part and a positive signal line connection part, and the second connection part column includes a GND signal line connection part and a negative signal line connection part.
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公开(公告)号：US11844173B2
公开(公告)日：2023-12-12
申请号：US17478987
申请日：2021-09-20
申请人： GigaLane Co., Ltd.
发明人： Byung-hoon Jo , Ik-soo Kim , Byung-yeol Kim , Hee-seok Jung
CPC分类号： H05K1/0219 , H05K1/028 , H05K1/115 , H05K1/024 , H05K1/0224 , H05K1/0245 , H05K1/0393
摘要： The present disclosure provides a flexible circuit board for multiple signal transmission including a first dielectric layer; a plurality of first side grounds formed on one surface of the first dielectric layer to be parallel; first signal lines formed between the plurality of first side grounds; and a plurality of through holes which is formed in each of the plurality of first side grounds with an interval, along a length direction of the first side grounds.
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公开(公告)号：US20230389174A1
公开(公告)日：2023-11-30
申请号：US18448598
申请日：2023-08-11
申请人： Dell Products L.P.
发明人： Arun Reddy Chada , Bhyrav Mutnury
CPC分类号： H05K1/0245 , H05K1/0353 , H01P3/085
摘要： An inhomogeneous dielectric medium high-speed signal trace system includes a first and second ground layer. A first dielectric layer is located adjacent the first ground layer. A second dielectric layer has a different dielectric constant and a greater thickness than the first dielectric layer, and is located between the first dielectric layer and the second ground layer. A first differential trace pair is located between the first dielectric layer and the second dielectric layer, and includes a trace spacing that is less than or equal to a thickness of the first dielectric layer. The first different trace pair transmit signals and, in response, produces a magnetic field, and the trace spacing prevents a magnetic field strength of the magnetic field from exceeding a magnetic field strength threshold at a second differential trace pair that is located adjacent the first differential trace pair.
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公开(公告)号：US11805595B2
公开(公告)日：2023-10-31
申请号：US17872082
申请日：2022-07-25
申请人： Amphenol Corporation
IPC分类号： H05K1/02 , H05K1/03 , H05K1/09 , H05K1/11 , H05K1/18 , H05K3/04 , H05K3/30 , H05K3/32 , H05K3/40 , H05K3/42 , H05K3/46 , H01R12/51 , H01R12/70 , H01R12/73 , H01R12/71
CPC分类号： H05K1/0245 , H01R12/7082 , H01R12/716 , H05K1/0219 , H05K1/0251 , H05K1/115 , H05K3/429 , H05K1/0225 , H05K2201/096 , H05K2201/09727 , H05K2201/09845
摘要： A printed circuit board includes a plurality of layers including attachment layers and routing layers; and columns of via patterns formed in the plurality of layers, wherein via patterns in adjacent columns are offset in a direction of the columns, each of the via patterns comprising: first and second signal vias forming a differential signal pair, the first and second signal vias extending through at least the attachment layers; and at least one conductive shadow via located between the first and second signal vias of the differential pair. In some embodiments, at least one conductive shadow via is electrically connected to a conductive surface film.
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公开(公告)号：US20230345625A1
公开(公告)日：2023-10-26
申请号：US17746135
申请日：2022-05-17
申请人： Dell Products L.P.
发明人： Lingyu Kong
IPC分类号： H05K1/02
CPC分类号： H05K1/0245 , H05K1/025 , H05K2201/09236
摘要： An information handling system includes first and second differential pairs on a printed circuit board. The first differential pair includes first and second traces, and first and second sets of impedance compensation traces. The first impedance compensation traces are routed only on an inner-side of the first trace. The second impedance compensation traces are routed only on an inner-side of the second trace, and the first and second impedance compensation traces are substantially aligned. The second differential pair includes third and fourth traces and third and fourth sets of impedance compensation traces. The third set of impedance compensation traces are routed only on an inner-side of the third trace. The fourth impedance compensation traces are routed only on an inner-side of the fourth trace, and the third and fourth impedance compensation traces are substantially aligned.
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