公开(公告)号：US11476209B2

公开(公告)日：2022-10-18

申请号：US16746371

申请日：2020-01-17

Applicant: NXP B.V.

Inventor： Vikas Shilimkar ,  Kevin Kim ,  Richard Emil Sweeney ,  Eric Matthew Johnson

IPC: H01L23/66 ,  H01L23/13 ,  H01L23/495 ,  H01L23/552 ,  H01L23/00 ,  H01L25/16 ,  H03F1/56 ,  H03F3/193

Abstract: Various embodiments relate to a packaged radio frequency (RF) amplifier device implementing a split bondwire where the direct ground connection of an output capacitor is replaced with a set of bondwires connecting to ground in a direction opposite to the wires connecting to the output of a transistor to an output pad. This is done in order to reduce the effects of mutual inductance between the various bondwires associated with the output of the RF amplifier device.