公开(公告)号：US11522506B2

公开(公告)日：2022-12-06

申请号：US16778547

申请日：2020-01-31

Applicant: NXP B.V.

Inventor： Vikas Shilimkar ,  Kevin Kim ,  Joseph Gerard Schultz

IPC: H03F3/14 ,  H03F3/213 ,  H01L27/06 ,  H01L49/02 ,  H03F3/68

Abstract: Various embodiments relate to an integrated circuit including a transistor device having input and output terminals, and an inductor-capacitor (LC) circuit coupled to one of the terminals of the transistor device. The LC circuit includes a capacitor having a top plate and a bottom plate, a inductor having a coil structure, and a connector configured to couple the inductor and an interior portion the top plate of the capacitor. The inductor at least partially overlaps the capacitor.

公开(公告)号：US11476209B2

公开(公告)日：2022-10-18

申请号：US16746371

申请日：2020-01-17

Applicant: NXP B.V.

Inventor： Vikas Shilimkar ,  Kevin Kim ,  Richard Emil Sweeney ,  Eric Matthew Johnson

IPC: H01L23/66 ,  H01L23/13 ,  H01L23/495 ,  H01L23/552 ,  H01L23/00 ,  H01L25/16 ,  H03F1/56 ,  H03F3/193

Abstract: Various embodiments relate to a packaged radio frequency (RF) amplifier device implementing a split bondwire where the direct ground connection of an output capacitor is replaced with a set of bondwires connecting to ground in a direction opposite to the wires connecting to the output of a transistor to an output pad. This is done in order to reduce the effects of mutual inductance between the various bondwires associated with the output of the RF amplifier device.