公开(公告)号：US10790220B2

公开(公告)日：2020-09-29

申请号：US16164776

申请日：2018-10-18

Applicant: NXP B.V.

Inventor： Chayathorn Saklang ,  Stephen Ryan Hooper ,  Chanon Suwankasab ,  Amornthep Saiyajitara ,  Bernd Offermann ,  James Lee Grothe ,  Russell Joseph Lynch

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/56 ,  H01R12/58

Abstract: A press-fit semiconductor device includes a lead frame having a die pad, leads with inner and outer lead ends, and a press-fit lead. The press-fit lead has a circular section between an outer lead end and an inner lead end, and the circular section has a central hole that is sized and shaped to receive a press-fit connection pin. A die is attached to the die pad and electrically connected to the inner lead ends of the leads and the inner lead end of the press-fit lead. The die, electrical connections and inner lead ends are covered with an encapsulant that forms a housing. The outer lead ends of the leads extend beyond the housing. The housing has a hole extending therethrough that is aligned with the center hole of the press-fit lead, so that a press-fit connection pin can be pushed through the hole to connect the device to a circuit board.

公开(公告)号：US10340211B1

公开(公告)日：2019-07-02

申请号：US15922873

申请日：2018-03-15

Applicant: NXP B.V.

Inventor： Chanon Suwankasab ,  Amornthep Saiyajitara ,  Chayathorn Saklang ,  Stephen Ryan Hooper

IPC: H01L23/495 ,  H01L21/56 ,  G01P1/02 ,  H01L25/16 ,  H01L23/31 ,  H01L23/00 ,  H01L25/00 ,  H01L23/02 ,  H01L21/52 ,  G01P15/00

Abstract: A sensor module, such as an acceleration sensor module, includes a leaded socket assembly covered by a housing. The leaded socket assembly includes a dual gauge lead frame, a sensor die, and various passive devices. The sensor die and the passive devices are mounted on the lead frame, and then the lead frame, sensor die, and passive devices are over-molded to form the leaded socket assembly. Neither the sensor module nor the socket assembly includes a printed circuit board, so many conventional sensor module assembly steps are bypassed.

公开(公告)号：US11482478B2

公开(公告)日：2022-10-25

申请号：US16936480

申请日：2020-07-23

Applicant: NXP B.V.

Inventor： Crispulo Estira Lictao, Jr. ,  Chayathorn Saklang ,  Amornthep Saiyajitara ,  Chanon Suwankasab ,  Stephen Ryan Hooper ,  Bernd Offermann

IPC: H01L23/552 ,  H01L23/495 ,  H01L23/00 ,  H01L25/00

Abstract: An electronic device package includes a first die coupled to a substrate, a second die coupled with the first die, and a spacer element coupled to the second die to form a stacked structure that includes the first die, the second die, and the spacer element. An electrically conductive shield overlies the stacked structure. The shield has a first end coupled to the spacer element and a second end coupled to the substrate. Inter-chip bond wires may electrically interconnect the first and second dies, and the shield may additionally overlie the bond wires. The spacer element may extend above a surface of the second die at a height that is sufficient to prevent the shield from touching the inter-chip bond wires.

公开(公告)号：US20220028766A1

公开(公告)日：2022-01-27

申请号：US16936480

申请日：2020-07-23

Applicant: NXP B.V.

Inventor： Crispulo Estira Lictao, JR. ,  Chayathorn Saklang ,  Amornthep Saiyajitara ,  Chanon Suwankasab ,  Stephen Ryan Hooper ,  Bernd Offermann

IPC: H01L23/495 ,  H01L23/552 ,  H01L23/00 ,  H01L25/00

Abstract: An electronic device package includes a first die coupled to a substrate, a second die coupled with the first die, and a spacer element coupled to the second die to form a stacked structure that includes the first die, the second die, and the spacer element. An electrically conductive shield overlies the stacked structure. The shield has a first end coupled to the spacer element and a second end coupled to the substrate. Inter-chip bond wires may electrically interconnect the first and second dies, and the shield may additionally overlie the bond wires. The spacer element may extend above a surface of the second die at a height that is sufficient to prevent the shield from touching the inter-chip bond wires.

公开(公告)号：US20200126895A1

公开(公告)日：2020-04-23

申请号：US16164776

申请日：2018-10-18

Applicant: NXP B.V.

Inventor： Chayathorn Saklang ,  Stephen Ryan Hooper ,  Chanon Suwankasab ,  Amornthep Saiyajitara ,  Bernd Offermann ,  James Lee Grothe ,  Russell Joseph Lynch

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/56

Abstract: A press-fit semiconductor device includes a lead frame having a die pad, leads with inner and outer lead ends, and a press-fit lead. The press-fit lead has a circular section between an outer lead end and an inner lead end, and the circular section has a central hole that is sized and shaped to receive a press-fit connection pin. A die is attached to the die pad and electrically connected to the inner lead ends of the leads and the inner lead end of the press-fit lead. The die, electrical connections and inner lead ends are covered with an encapsulant that forms a housing. The outer lead ends of the leads extend beyond the housing. The housing has a hole extending therethrough that is aligned with the center hole of the press-fit lead, so that a press-fit connection pin can be pushed through the hole to connect the device to a circuit board.