公开(公告)号：US20240123632A1

公开(公告)日：2024-04-18

申请号：US18393927

申请日：2023-12-22

Applicant: Neil Buttermore

Inventor： Neil Buttermore

IPC: B25J15/06 ,  B60R9/04 ,  B64C39/02 ,  B64D1/02 ,  B66C1/02 ,  F16B47/00

CPC classification number: B25J15/0625 ,  B60R9/04 ,  B64C39/024 ,  B64D1/02 ,  B66C1/0256 ,  F16B47/00 ,  B64U2101/60

Abstract: Embodiments of an active object mounting system secure an object of interest to a surface of a secured-to object using one or more vacuum mounting modules, wherein each vacuum mounting module comprises at least one vacuum pump controllably coupled to a microcontroller, a vacuum cup fluidly coupled to the at least one vacuum pump, and a transceiver that receives an instruction corresponding to one of a vacuum cup actuation signal or a vacuum cup release signal.

公开(公告)号：US11850735B1

公开(公告)日：2023-12-26

申请号：US18093272

申请日：2023-01-04

Applicant: Neil Buttermore

Inventor： Neil Buttermore

IPC: B25J15/06 ,  B60R9/04 ,  F16B47/00 ,  B64D1/02 ,  B64C39/02 ,  B66C1/02 ,  B64U101/60

CPC classification number: B25J15/0625 ,  B60R9/04 ,  B64C39/024 ,  B64D1/02 ,  B66C1/0256 ,  F16B47/00 ,  B64U2101/60

Abstract: Embodiments of an active object mounting system secure an object of interest to a surface of a secured-to object using one or more vacuum mounting modules, wherein each vacuum mounting module comprises at least one vacuum pump controllably coupled to a microcontroller, a vacuum cup fluidly coupled to the at least one vacuum pump, and a transceiver that receives an instruction corresponding to one of a vacuum cup actuation signal or a vacuum cup release signal.

公开(公告)号：US20230405839A1

公开(公告)日：2023-12-21

申请号：US18093272

申请日：2023-01-04

Applicant: Neil Buttermore

Inventor： Neil Buttermore

IPC: B25J15/06 ,  B64D1/02 ,  B64C39/02 ,  B60R9/04 ,  B66C1/02 ,  F16B47/00

CPC classification number: B25J15/0625 ,  B64D1/02 ,  B64C39/024 ,  B64U2101/60 ,  B66C1/0256 ,  F16B47/00 ,  B60R9/04

Abstract: Embodiments of an active object mounting system secure an object of interest to a surface of a secured-to object using one or more vacuum mounting modules, wherein each vacuum mounting module comprises at least one vacuum pump controllably coupled to a microcontroller, a vacuum cup fluidly coupled to the at least one vacuum pump, and a transceiver that receives an instruction corresponding to one of a vacuum cup actuation signal or a vacuum cup release signal.

公开(公告)号：US11559906B1

公开(公告)日：2023-01-24

申请号：US17824090

申请日：2022-05-25

Applicant: Neil Buttermore

Inventor： Neil Buttermore

IPC: B25J15/06 ,  B60R9/04 ,  F16B47/00 ,  B64D1/02 ,  B64C39/02 ,  B66C1/02

Abstract: Embodiments of an active object mounting system secure an object of interest to a surface of a secured-to object using one or more vacuum mounting modules, wherein each vacuum mounting module comprises at least one vacuum pump controllably coupled to a microcontroller, a vacuum cup fluidly coupled to the at least one vacuum pump, and a transceiver that receives an instruction corresponding to one of a vacuum cup actuation signal or a vacuum cup release signal.

公开(公告)号：US20240158080A1

公开(公告)日：2024-05-16

申请号：US18544151

申请日：2023-12-18

Applicant: Neil Buttermore

Inventor： Neil Buttermore

IPC: B64D1/04 ,  B64C39/02 ,  B64D5/00

CPC classification number: B64D1/04 ,  B64C39/024 ,  B64D5/00 ,  B64U2101/15

Abstract: Embodiments of a payload attachment system secure a payload to a wing or fuselage of the drone (or another type of aircraft) using one or more vacuum mounting modules, wherein each vacuum mounting module comprises at least one vacuum pump controllably coupled to a microcontroller, a vacuum cup fluidly coupled to the at least one vacuum pump, and a transceiver that receives an instruction corresponding to one of a vacuum cup actuation signal or a vacuum cup release signal.

公开(公告)号：US11845553B1

公开(公告)日：2023-12-19

申请号：US17824592

申请日：2022-05-25

Applicant: Neil Buttermore

Inventor： Neil Buttermore

IPC: B64D1/04 ,  B64D5/00 ,  B64C39/02 ,  B64U101/05

CPC classification number: B64D1/04 ,  B64C39/024 ,  B64D5/00 ,  B64U2101/05

Abstract: Embodiments of a payload attachment system secure a payload to a wing or fuselage of the drone 102 (or another type of aircraft) using one or more vacuum mounting modules, wherein each vacuum mounting module comprises at least one vacuum pump controllably coupled to a microcontroller, a vacuum cup fluidly coupled to the at least one vacuum pump, and a transceiver that receives an instruction corresponding to one of a vacuum cup actuation signal or a vacuum cup release signal.

公开(公告)号：US20230382527A1

公开(公告)日：2023-11-30

申请号：US17824592

申请日：2022-05-25

Applicant: Neil Buttermore

Inventor： Neil Buttermore

IPC: B64D1/04 ,  B64C39/02 ,  B64D5/00

CPC classification number: B64D1/04 ,  B64C39/024 ,  B64D5/00 ,  B64C2201/121

Abstract: Embodiments of a payload attachment system secure a payload to a wing or fuselage of the drone 102 (or another type of aircraft) using one or more vacuum mounting modules, wherein each vacuum mounting module comprises at least one vacuum pump controllably coupled to a microcontroller, a vacuum cup fluidly coupled to the at least one vacuum pump, and a transceiver that receives an instruction corresponding to one of a vacuum cup actuation signal or a vacuum cup release signal.