公开(公告)号：US20180108595A1

公开(公告)日：2018-04-19

申请号：US15562239

申请日：2016-04-01

Applicant: OBERTHUR TECHNOLOGIES

Inventor： Philippe GAC ,  Mickael HUET ,  Jean-Michel FONTAINE

IPC: H01L23/48 ,  G06K19/077

CPC classification number: H01L23/48 ,  G06K19/07739 ,  G06K19/07747 ,  G06K19/0775 ,  G06K19/07754 ,  H01L2224/45144 ,  H01L2224/49171 ,  H01L2924/00

Abstract: A dual module for a dual chip card includes a supporting film supporting on an outer surface, a plurality of connecting pads including two series of connecting pads extending in a given direction and, on an inner surface, two inner connection areas for connection to an antenna of the dual card and a chip, the chip including contact terminals connected by wires to the inner connection areas or electric connecting pads by holes passing through the supporting film while being coated, together with the wires, by coating resin. The electric connecting pads of the outer surface include only three pads. Each of the two inner connection areas forms a comb including a body extending under each of the pads of one of the two series of connecting pads separated from the coating mass, respectively. Blades extend separately from one another from the body until ends covered by the coating mass.