公开(公告)号：US20150317554A1

公开(公告)日：2015-11-05

申请号：US14438886

申请日：2013-10-29

Applicant: OBERTHUR TECHNOLOGIES

Inventor： Loic LE GARREC ,  Philippe GAC

IPC: G06K19/077

CPC classification number: G06K19/072 ,  G06K19/07701 ,  G06K19/07707 ,  G06K19/07747 ,  G06K19/07749 ,  H01L2224/48095

Abstract: A method for producing a smart card including at least one chip and at least one other electronic component having a face that must be accessible from the outside, includes: forming a card body having two opposing faces and in which at least two recesses are formed, one of which is a through-recess extending from one of the faces to the other, forming a first module including the chip and forming a second module separate from the first module and including the other electronic component, the second module including a support to which the component is secured opposite the face that must be accessible, securing the second module in the through-recess from the face of the body that is opposite the face through which the face of the component must be accessible from the outside, via a shoulder in the through-recess, and securing the first module in the other recess.

Abstract translation: 一种用于制造包括至少一个芯片和至少一个其他电子部件的智能卡的方法，所述至少一个电子部件具有必须从外部可接近的面部，包括：形成具有两个相对面并且至少形成有至少两个凹部的卡体， 其中一个是从一个表面延伸到另一个的通孔，形成包括该芯片的第一模块，并形成与该第一模块分离并且包括另一个电子元件的第二模块，该第二模块包括支撑件， 该部件固定在与必须可接近的面相对的面上，将第二模块从与该面部相对的身体的面部的通孔中固定，该面的表面必须能够通过肩部从外部从外部接近 通孔，并将第一模块固定在另一个凹部中。

公开(公告)号：US20180108595A1

公开(公告)日：2018-04-19

申请号：US15562239

申请日：2016-04-01

Applicant: OBERTHUR TECHNOLOGIES

Inventor： Philippe GAC ,  Mickael HUET ,  Jean-Michel FONTAINE

IPC: H01L23/48 ,  G06K19/077

CPC classification number: H01L23/48 ,  G06K19/07739 ,  G06K19/07747 ,  G06K19/0775 ,  G06K19/07754 ,  H01L2224/45144 ,  H01L2224/49171 ,  H01L2924/00

Abstract: A dual module for a dual chip card includes a supporting film supporting on an outer surface, a plurality of connecting pads including two series of connecting pads extending in a given direction and, on an inner surface, two inner connection areas for connection to an antenna of the dual card and a chip, the chip including contact terminals connected by wires to the inner connection areas or electric connecting pads by holes passing through the supporting film while being coated, together with the wires, by coating resin. The electric connecting pads of the outer surface include only three pads. Each of the two inner connection areas forms a comb including a body extending under each of the pads of one of the two series of connecting pads separated from the coating mass, respectively. Blades extend separately from one another from the body until ends covered by the coating mass.