公开(公告)号：US20180050917A1

公开(公告)日：2018-02-22

申请号：US15322324

申请日：2015-06-26

Applicant: OCI COMPANY LTD.

Inventor： Byung-Chang KANG ,  Chang-Ryol KIM

IPC: C01B33/035 ,  B23K20/06 ,  B23K20/26 ,  C30B33/06

CPC classification number: C01B33/035 ,  B23K20/06 ,  B23K20/26 ,  C30B33/06

Abstract: The present invention relates to a polysilicon filament manufacturing device, and more specifically, to a polysilicon filament binding device for manufacturing a polysilicon filament having a desired length by connecting polysilicon fragments cut from damage, etc. The present invention provides a polysilicon filament binding device comprising: a body part having a barrel-shape; a guide part provided inside the body part, guiding incoming polysilicon fragments; and a main light source for heating the binding surfaces of the polysilicon fragments.