公开(公告)号：US10753967B2

公开(公告)日：2020-08-25

申请号：US16201806

申请日：2018-11-27

Applicant: OmniVision Technologies, Inc.

Inventor： Qianyi Zhao ,  Xiaojun Zhang ,  Pan-Xun Jiang ,  Bao-Hua Xu ,  Heng Fan

IPC: G01R31/00 ,  H05K1/18 ,  H05K7/14 ,  H05K9/00 ,  H05K1/11 ,  H05K1/02 ,  H05K3/32 ,  H04B17/345 ,  H04B17/10

Abstract: An apparatus configured to measure electromagnetic radiation coupled from an image sensor integrated circuit (IC) to a nearby cell phone antenna has an image sensor PCB with the image sensor IC on a first side and image sensor decoupling capacitors disposed on a second side, the image sensor PCB disposed within a shielding box. The apparatus also has an image processor PCB with an image processor IC on a first side and at least one image processor decoupling capacitors, the image processor IC electrically coupled to the image sensor IC. The image processor IC is located outside the shielding box, and the at least one image processor decoupling capacitor is within the shielding box. In embodiments, the decoupling capacitors are shielded with separate, additional, metal covers.

公开(公告)号：US20180020131A1

公开(公告)日：2018-01-18

申请号：US15210587

申请日：2016-07-14

Applicant: OmniVision Technologies, Inc.

Inventor： Qianyi Zhao ,  Heng Fan

IPC: H04N5/225 ,  H05K1/18 ,  H05K9/00 ,  H01R13/04 ,  H05K3/30 ,  H05K1/14

CPC classification number: H04N5/2252 ,  H01R13/04 ,  H04N5/2254 ,  H05K1/0216 ,  H05K1/181 ,  H05K3/4691 ,  H05K9/0024 ,  H05K2201/10121 ,  H05K2201/10371

Abstract: An EMI shield for a camera module subassembly includes a first conductive portion covering an optical unit and a top surface of a circuit substrate of the camera module subassembly and a second conductive portion covering a bottom surface of the circuit substrate, such that the two portions are in contact. The EMI shield can also include an extension to cover a flexible circuit substrate and its connector, as well as can include an EMI attenuator over an aperture formed in the first conductive portion above the optical unit. The EMI shield of the invention provides improved EMI shielding and EM compatibility at the camera module packaging level, especially for frequencies in the megahertz and gigahertz range, by shielding substantially all of the camera module subassembly.

公开(公告)号：US20190068927A1

公开(公告)日：2019-02-28

申请号：US15691678

申请日：2017-08-30

Applicant: OmniVision Technologies, Inc.

Inventor： Xiang-Dong Xiong ,  Tiejun Dai ,  Heng Fan

IPC: H04N7/22 ,  H04N5/369 ,  H04N5/378 ,  H04N5/376 ,  H04N7/10 ,  H04N5/225 ,  G02B23/24 ,  A61B1/00 ,  A61B1/05

Abstract: An image sensor system, comprising: an image sensor including an image sensing pixel array; a supporting module; a ground line coupling the image sensor with the supporting module; a power line coupling the image sensor with the supporting module; a data/control line coupling the image sensor with the supporting module; and a clock line coupling the image sensor with the supporting module; wherein the ground line and the power line are based on electrical conduction, and wherein the clock line is based on fiber optics.

公开(公告)号：US09930229B2

公开(公告)日：2018-03-27

申请号：US15210587

申请日：2016-07-14

Applicant: OmniVision Technologies, Inc.

Inventor： Qianyi Zhao ,  Heng Fan

IPC: H04N5/225 ,  H05K3/30 ,  H05K1/18 ,  H05K9/00 ,  H01R13/04 ,  H05K1/14

CPC classification number: H04N5/2252 ,  H01R13/04 ,  H04N5/2254 ,  H05K1/0216 ,  H05K1/181 ,  H05K3/4691 ,  H05K9/0024 ,  H05K2201/10121 ,  H05K2201/10371

Abstract: An EMI shield for a camera module subassembly includes a first conductive portion covering an optical unit and a top surface of a circuit substrate of the camera module subassembly and a second conductive portion covering a bottom surface of the circuit substrate, such that the two portions are in contact. The EMI shield can also include an extension to cover a flexible circuit substrate and its connector, as well as can include an EMI attenuator over an aperture formed in the first conductive portion above the optical unit. The EMI shield of the invention provides improved EMI shielding and EM compatibility at the camera module packaging level, especially for frequencies in the megahertz and gigahertz range, by shielding substantially all of the camera module subassembly.