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公开(公告)号:US11968771B2
公开(公告)日:2024-04-23
申请号:US17291976
申请日:2019-11-06
CPC classification number: H05H1/4652 , H01J37/32146 , H01J37/32183 , H01J2237/332 , H01J2237/334
Abstract: A plasma processing apparatus may include a mechanism for generating a plasma, a processing platform for supporting a substrate to be processed, and a voltage waveform generator having an output electrically coupled to the processing platform. The voltage waveform generator includes a plurality of first buck converters arranged in parallel and coupled to the output. The first buck converters include actively switchable semiconductor switches. A control unit is configured to operate the actively switchable semiconductor switches through pulse width modulation signals, and the control unit is configured to operate the plurality of first buck converters in an interleaved manner.