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Patent Agency Ranking
公开(公告)号：US10141088B2
公开(公告)日：2018-11-27
申请号：US15527319
申请日：2016-12-19
Inventor： Naohiro Mikamoto , Fuyuki Abe , Yuji Yasuoka , Akimitsu Fujii , Shogo Nakayama , Takeshi Iseki
Abstract: A resistor includes a resistive element, a first resin substrate on an upper surface of the resistive element and having a high thermal conductivity, a first heat radiator plate made of metal provided on an upper surface of the first resin substrate, a second heat radiator plate made of metal provided on the upper surface of the first resin substrate, a first edge-surface electrode provided on the first edge surface of the resistive element and connected to the first heat radiator plate, and a second edge-surface electrode provided on the second edge surface of the resistive element and connected to the second heat radiator plate.
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公开(公告)号：US10373744B2
公开(公告)日：2019-08-06
申请号：US15935326
申请日：2018-03-26
Inventor： Seiji Tsuda , Shogo Nakayama , Takeshi Iseki , Kazutoshi Matsumura
Abstract: A resistor includes a resistive element, a protective film, and a pair of electrodes. The resistive element is made of a metal plate. The protective film is formed on the upper surface of the resistive element. The plated layers are formed to cover the electrodes. The electrodes are separated from each other with the protective film therebetween and are formed at both ends of the upper surface of the resistive element. The electrodes are formed by printing metal-containing paste.
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公开(公告)号：US10134510B2
公开(公告)日：2018-11-20
申请号：US15303731
申请日：2015-03-30
Inventor： Shogo Nakayama
Abstract: A chip resistor includes an insulating substrate, a resistive element provided on an upper surface of the insulating substrate, a pair of upper-surface electrodes provided on respective ones of both end portions of an upper surface of the resistive element so as to expose a part of the upper surface of the resistive element from the upper-surface electrodes, and a protective layer that covers the part of the resistive element and that does not cover the pair of upper-surface electrodes. The pair of upper-surface electrodes have exposed upper surfaces and exposed edge surfaces, respectively. Each of the edge surfaces of the pair of upper-surface electrodes does not project outward from respective one of the edge surfaces of the insulating substrate. The chip resistor can reduce a temperature coefficient of resistance to improve the temperature coefficient of resistance.
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公开(公告)号：US09959957B2
公开(公告)日：2018-05-01
申请号：US14997459
申请日：2016-01-15
Inventor： Seiji Tsuda , Shogo Nakayama , Takeshi Iseki , Kazutoshi Matsumura
CPC classification number: H01C1/14 , G03F7/40 , H01C7/003 , H01C17/003 , H01C17/06 , H01C17/065 , H01C17/24 , H01C17/28 , H01C17/281
Abstract: A resistor includes a resistive element, a protective film, and a pair of electrodes. The resistive element is made of a metal plate. The protective film is formed on the upper surface of the resistive element. The plated layers are formed to cover the electrodes. The electrodes are separated from each other with the protective film therebetween and are formed at both ends of the upper surface of the resistive element. The electrodes are formed by printing metal-containing paste.
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公开(公告)号：US11189402B2
公开(公告)日：2021-11-30
申请号：US16335600
申请日：2018-11-16
Inventor： Shogo Nakayama
Abstract: In a metal plate resistor according to the present disclosure, each of a pair of electrodes includes a first portion and a second portion. The first portion protrudes from one surface of a resistive element to be in contact with an end of a protection film. The second portion is disposed in a corresponding recess of a pair of recesses. In a direction in which the pair of electrodes is arranged, the second portion has a length longer than a length of the first portion.
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