Package structure of multi-chip light emitting diode
    1.
    发明授权
    Package structure of multi-chip light emitting diode 失效
    多芯片发光二极管的封装结构

    公开(公告)号:US5266817A

    公开(公告)日:1993-11-30

    申请号:US884195

    申请日:1992-05-18

    申请人: Paul Y. S. Lin

    发明人: Paul Y. S. Lin

    摘要: A light emitting diode includes a base with a recess and a housing mounted above the base. A conductive plate is mounted in the recess with a red chip, a green chip, and two blue chips disposed thereon, all of which being enclosed by the housing. A first pin has a first contact electrically connected to the red chip and a second contact extending downward and out of the base. A second pin has a first contact electrically connected to the green chip and a second contact extending downward and out of the base. A third pin has a first contact electrically connected to the blue chips and a second contact extending downward and out of the base. A common cathode pin has a first contact electrically connected to the conductive plate and a second contact extending downward and out of the base. Different intensities of light of the three primary colors emitted by the chips result in any desired colored light. A bottom surface and a peripheral wall of the recess are covered by a scattering agent, providing a complete mixing of light emitted by the chips.

    摘要翻译: 发光二极管包括具有凹部的基座和安装在基座上方的壳体。 导电板安装在凹槽中,其上设置有红色芯片,绿色芯片和两个蓝色芯片,所有蓝色芯片都被外壳封闭。 第一销具有电连接到红色芯片的第一触点和向下延伸并离开基座的第二触点。 第二销具有电连接到绿色芯片的第一触点和向下延伸并离开基座的第二触点。 第三引脚具有电连接到蓝色芯片的第一触点和向下延伸出基极的第二触点。 公共阴极销具有电连接到导电板的第一触点和向下延伸出基极的第二触点。 由芯片发射的三原色的不同强度的光导致任何期望的彩色光。 凹陷的底面和周壁被散射剂覆盖,从而提供由芯片发出的光的完全混合。