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公开(公告)号:US20240363816A1
公开(公告)日:2024-10-31
申请号:US18771139
申请日:2024-07-12
Applicant: SEOUL SEMICONDUCTOR CO., LTD.
Inventor: Bo Ram I JANG , Ki Yon PARK , Jae Wan SONG
CPC classification number: H01L33/60 , H01L33/44 , H01L33/502 , H01L33/54
Abstract: A light emitting package is provided to include a substrate on which a circuit pattern is formed, a first optic layer, a light controller, and a second optic layer. The first optic layer may be arranged on the substrate to be electrically connected to the circuit pattern and generate and emit light. The light controller may cover a side surface of the first optic layer and may reflect light emitted from the side surface of the first optic layer. In addition, the second optic layer may cover the first optic layer and the light controller and be disposed on the substrate. The second optic layer may include a securing region secured on the substrate and a light emitting region disposed over the securing region. Light emitted from the first optic layer may be emitted to the outside of the second optic layer through the second optic layer.
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公开(公告)号:US12132035B2
公开(公告)日:2024-10-29
申请号:US17306409
申请日:2021-05-03
Applicant: Samsung Display Co., LTD.
Inventor: Hyun Kim
CPC classification number: H01L25/167 , H01L27/1259 , H01L33/44 , H01L33/54 , H01L33/60 , H01L33/62
Abstract: A display device includes a substrate including pixels, a first electrode and a second electrode disposed on the substrate and spaced apart from each other, an inclined pattern disposed on the first electrode and the second electrode, the inclined pattern forming a space, and a first light emitting element disposed between the first electrode and the second electrode inside of the space formed by the inclined pattern.
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公开(公告)号:US12129990B2
公开(公告)日:2024-10-29
申请号:US18050366
申请日:2022-10-27
Applicant: Korrus, Inc.
Inventor: Ariel Meir , Noam Meir , Rina Meir
IPC: F21V5/08 , F21K9/68 , F21K9/69 , F21S8/04 , F21V7/00 , F21V7/04 , F21V7/28 , F21V17/04 , F21V31/04 , G02B19/00 , G02B27/30 , H01L33/50 , H01L33/58 , H01L33/60 , H05K1/02 , H05K1/18 , H05K3/28 , F21S8/00 , F21V13/04 , F21W131/10 , F21Y103/10 , F21Y115/10
CPC classification number: F21V17/04 , F21K9/68 , F21K9/69 , F21S8/04 , F21V5/08 , F21V7/0091 , F21V7/041 , F21V7/28 , F21V31/04 , G02B19/0061 , G02B27/30 , H01L33/502 , H01L33/58 , H01L33/60 , H05K1/0274 , H05K1/189 , H05K3/284 , F21S8/033 , F21V13/04 , F21W2131/10 , F21Y2103/10 , F21Y2115/10 , H01L2933/0091 , H05K2201/0133 , H05K2201/10106 , H05K2203/1316 , H05K2203/1327
Abstract: According to at least one aspect, a lighting device is provided. The lighting device comprises a circuit board, an LED mounted to the circuit board that is configured to emit light with an angular CCT deviation, a lens assembly mounted to the circuit board over the LED and configured to receive the light emitted from the LED and reduce the angular CCT deviation of the light received from the LED to make a color temperature of the light received from the LED more uniform, and an elastomer encapsulating at least part of the circuit board that is separate and distinct from the lens assembly.
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公开(公告)号:US20240355972A1
公开(公告)日:2024-10-24
申请号:US18571554
申请日:2022-06-02
Applicant: STANLEY ELECTRIC CO., LTD.
Inventor: Yusuke YAMASHITA , Kenji TABUCHI
CPC classification number: H01L33/56 , H01L33/60 , H01L2933/005 , H01L2933/0058
Abstract: A light-emitting device includes a substrate, a light-emitting element, and a resin material. The light-emitting element is disposed on the substrate. The resin material is made of a translucent thermosetting resin disposed at a peripheral area of the light-emitting element. The resin material has a plurality of closed spaces, and each of the plurality of closed spaces holds a resin body.
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公开(公告)号:US20240347516A1
公开(公告)日:2024-10-17
申请号:US18611108
申请日:2024-03-20
Applicant: Apple Inc.
Inventor: Dmitry S. Sizov , Ion Bita , Jean-Jacques P. Drolet , John T. Leonard , Jonathan S. Steckel , Nathaniel T. Lawrence , Xiaobin Xin , Ranojoy Bose
CPC classification number: H01L25/0753 , H01L24/08 , H01L24/32 , H01L24/73 , H01L25/167 , H01L25/18 , H01L33/60 , H01L33/0008 , H01L33/0093 , H01L33/38 , H01L2224/08225 , H01L2224/32225
Abstract: Light emitting structures and methods of fabrication are described. In an embodiment, LED coupons are transferred to a carrier substrate and then patterned to LED mesa structures. Patterning may be performed on heterogeneous groups of LED coupons with a common mask set. The LED mesa structure are then transferred in bulk to a display substrate. In an embodiment, a light emitting structure includes an arrangement of LEDs with different thickness, and corresponding bottom contacts with different thicknesses bonded to a display substrate.
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公开(公告)号:US20240339564A1
公开(公告)日:2024-10-10
申请号:US18625617
申请日:2024-04-03
Applicant: EPISTAR CORPORATION
Inventor: Wei-Che WU , Chih-Hao CHEN , Yu-Ling LIN , Chao-Hsing CHEN , Yong-Yang CHEN
CPC classification number: H01L33/22 , H01L33/005 , H01L33/60
Abstract: A semiconductor device includes a semiconductor stack; a substrate formed on the semiconductor stack, including a lower surface connected to the semiconductor stack, an upper surface opposite to the lower surface, and a side surface between the lower surface and the upper surface, wherein the side surface includes a mirror area, a first scribing area, and a first crack area, the mirror area is closer to the lower surface than the first scribing area to the lower surface, and the first scribing area is located between the mirror area and the first crack area; an optical structure on the upper surface of the substrate; and a reflective structure on a side surface of the first scribing area and the first crack area, wherein the first scribing area is arranged below the upper surface of the substrate with a distance less than or equal to ¼ of a thickness of the substrate.
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公开(公告)号:US20240332263A1
公开(公告)日:2024-10-03
申请号:US18613234
申请日:2024-03-22
Applicant: NICHIA CORPORATION
Inventor: Kenji OZEKI , Midori HAYASHI
IPC: H01L25/075 , H01L33/54 , H01L33/60
CPC classification number: H01L25/0753 , H01L33/54 , H01L33/60 , H01L2933/005 , H01L2933/0058
Abstract: A light emitting device includes: a plurality of light emitting elements; a plurality of light transmissive members disposed on the respective light emitting elements; a covering member covering lateral surfaces of the light transmissive members and lateral surfaces of the light emitting elements, wherein upper surfaces of the light transmissive members are exposed from the covering member, and wherein the covering member defines a first groove that opens at an upper surface of the covering member and is located between adjacent ones of the light transmissive members; a light shielding member covering a surface of the covering member that defines the first groove; and an air layer disposed on the light shielding member in the first groove.
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公开(公告)号:US12104755B2
公开(公告)日:2024-10-01
申请号:US17217922
申请日:2021-03-30
Applicant: Lumileds LLC
Inventor: Isaac Wildeson , Hossein Lotfi , Toni Lopez , Oleg Borisovich Shchekin
CPC classification number: F21K9/68 , F21K9/90 , H01L25/0753 , H01L33/0095 , H01L33/50 , H01L33/60 , G06F1/1686 , H01L2933/0041 , H01L2933/0058 , H01L2933/0091
Abstract: LED arrays comprise patterned reflective grids that enhance the contrast ratio between adjacent pixels or adjacent groups of pixels in the array. The pattern on the reflective grid may also improve adhesion between the reflective grid and one or more layers of material disposed on and attached to the reflective grid. The reflective grid may be formed, for example, as a reflective metal grid, a grid of dielectric reflectors, or a grid of distributed Bragg reflectors (DBRs). If formed as a metal grid, the reflective grid may provide electrical contact to one side of the LED diode junctions. This specification also discloses fabrication processes for such LED arrays.
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公开(公告)号:US20240322096A1
公开(公告)日:2024-09-26
申请号:US18735833
申请日:2024-06-06
Applicant: FUJIFILM Corporation
Inventor: Wakahiko KANEKO , Wataru MAJIMA , Tatsuya OBA
CPC classification number: H01L33/60 , H01L25/167 , H01L33/505
Abstract: Provided is an LED display device that can improve utilization efficiency of light with a simple configuration having a small number of components. The LED display device includes an LED array formed by arranging a plurality of light emitting diodes that emit excitation light having a wavelength of less than 420 nm, on a substrate; a color conversion layer; a wavelength-selective reflection layer disposed on a side opposite to the LED array; and an RGB reflection layer disposed on an LED array side with respect to the color conversion layer, in which the color conversion layer is disposed at each of positions corresponding to the light emitting diodes of the LED array, and includes a red color conversion region emitting red light, a green color conversion region emitting green light, and a blue color conversion region emitting blue light, which are excited by the excitation light, and a partition wall that divides each region, a height h of the partition wall is 20 μm or less and a ratio w/h of a width w between partition walls to the height h is 2 or more, the wavelength-selective reflection layer selectively reflects light having a wavelength of the excitation light and is integrally formed at positions corresponding the respective regions, and the RGB reflection layer reflects at least light having a wavelength of 450 nm to 650 nm.
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公开(公告)号:US12100691B2
公开(公告)日:2024-09-24
申请号:US17438776
申请日:2020-05-13
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Siegfried Herrmann
IPC: H01L25/075 , H01L25/16 , H01L33/52 , H01L33/60 , H01L33/62
CPC classification number: H01L25/0753 , H01L25/167 , H01L33/52 , H01L33/60 , H01L33/62
Abstract: The invention relates to a light-emitting component comprising a light-emitting semiconductor chip, a transparent conductive layer, and at least two electrical connection points, wherein the transparent conductive layer covers the light-emitting semiconductor chip at least in places, and the electrical connection points are arranged on a side of the light-emitting semiconductor chip facing away from the transparent conductive layer.
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