公开(公告)号：US20230223362A1

公开(公告)日：2023-07-13

申请号：US17575492

申请日：2022-01-13

Applicant: QUALCOMM Incorporated

Inventor： FNU SURAJ PRAKASH ,  Paragkumar Ajaybhai THADESAR ,  John Jong-Hoon LEE ,  Nikhil RAMAN ,  Peng SONG ,  Francesco CARRARA

IPC: H01L23/64 ,  H01L23/528 ,  H01L49/02

CPC classification number: H01L23/645 ,  H01L23/528 ,  H01L28/10

Abstract: A package comprising a substrate, a first integrated device coupled to a first surface of the substrate, and a second integrated device coupled to a second surface of the substrate. The substrate includes a dielectric layer and a plurality of interconnects. The plurality of interconnects includes a first plurality of interconnects configured as a first inductor and a second plurality of interconnects configured as a second inductor. The first integrated device is configured to be coupled to the first inductor. The second integrated device is configured to be coupled to the second inductor. The second integrated device is configured to tune the first inductor through the second inductor.