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公开(公告)号：US10856447B2
公开(公告)日：2020-12-01
申请号：US16246050
申请日：2019-01-11
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung Chen , Yu-Nien Huang , Ching-Yu Chen , Kuo-Wei Lee
Abstract: A server includes an inner housing disposed within an outer housing such that a channel is defined between them. The inner housing includes a low-power electronic component and a high-power electronic component, and is sealed to protect the components. A first heat sink extends through the inner housing. Heat generated by the low-power electronic component is transferred through an inner portion of the first heat sink to an outer portion of the first heat sink. A second heat sink disposed in the channel is coupled to the high-power electronic component via heat pipes that extend through the inner housing. Heat generated by the high-power electronic component is transferred through the heat pipes to the second heat sink. A fan positioned in the channel causes air to enter the channel through a first vent, flow through the channel, and exit the channel via a second vent to remove the generated heat.
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公开(公告)号：US10651598B2
公开(公告)日：2020-05-12
申请号：US16058408
申请日：2018-08-08
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung Chen , Yu-Nien Huang , Kuen-Hsien Wu , Kuo-Wei Lee
IPC: H01R13/631 , H01R13/502 , H05K7/20 , G02B6/42 , H04B5/02
Abstract: A heat transfer system between a heat source and a heat sink, wherein the heat transfer contact surfaces comprise a metal which forms numerous voids when placed adjacent one another. A thermal pad comprising a polymer filled with ceramic particles is placed between these heat transfer surfaces to intimately contact each of the metal surfaces without void formation, thereby increasing thermal conductivity. The heat source and heat sink are joined by relative sliding motion. This sliding motion might damage the thermal pad. Thus, a hot swap structure is provided for controlling the movement of the thermal pad into contact with the heat source as the sliding motion is completed.
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公开(公告)号：US11729944B2
公开(公告)日：2023-08-15
申请号：US17445374
申请日：2021-08-18
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung Chen , Yu-Nien Huang , Kuo-Wei Lee
IPC: H05K7/20
CPC classification number: H05K7/20254 , H05K7/20272 , H05K7/20409 , H05K7/20509
Abstract: A cold plate for cooling a heat-generating component in a computer system is disclosed. The cold plate includes a lid member with a lower supply manifold housing and a lower collection manifold housing. The cold plate includes a base member having coolant channels defined by fins. Each of the fins have a top section and a bottom section attached to the base member. An interior cavity is defined by an arc-shaped section of the fins, the interior surface of the base, and the lower supply manifold housing. An interior corner is formed by the lower supply manifold housing of the lower manifold housing at the top of the fins to trap debris. An upper inlet manifold has a connector to receive coolant. An upper outlet manifold has a connector to circulate coolant. The upper manifolds are in fluid communication with the collection manifold housings.
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公开(公告)号：US11625079B2
公开(公告)日：2023-04-11
申请号：US17237018
申请日：2021-04-21
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung Chen , Yu-Nien Huang , Kuo-Wei Lee
Abstract: A cooling device for a computing system is disclosed. The device includes a heat sink, a base, and a cover. The heat sink includes a plurality of fins extending from a first section of the heat sink. The base includes a plurality of grooves on a first side. The plurality of grooves is configured to mate with at least a portion of the plurality of fins of the heat sink. The cover is configured to be coupled to the base and encapsulate the heat sink. The cover further includes two apertures, each aperture configured to be connected to a tube. A width of the plurality of fins of the heat sink is less than a width of the plurality of grooves of the base. A height of the heat sink is less than a height of an interior portion of the cover.
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Patent Agency Ranking
公开(公告)号：US11129296B2
公开(公告)日：2021-09-21
申请号：US16743958
申请日：2020-01-15
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung Chen , Yu-Nien Huang , Tsung-Ta Li , Kuo-Wei Lee
Abstract: A fan arrangement to generate increased airflow in a chassis is disclosed. The chassis includes one area having electronic components. A first row of fan modules is located in the chassis relative to the electronic components to generate airflow in a direction of the length of the chassis through the electronic components. The first row of fan modules includes at least one gap between the fan modules. A second row of fan modules is located a predetermined distance from the first row. The second row of fan modules includes at least one gap between the fan modules. Each of the fan modules in the second row is staggered from one of the fan modules of the first row. A first panel connects one of fan modules in the first row with one of the fan modules of the second row to create a channel.
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公开(公告)号：US10952354B1
公开(公告)日：2021-03-16
申请号：US16752100
申请日：2020-01-24
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung Chen , Yu-Nien Huang , Tsung-Ta Li , Kuo-Wei Lee
Abstract: A cold plate assembly for cooling heat-generating electrical component on a circuit board is disclosed. The cold plate assembly includes a cold plate with a bottom contact surface to thermally contact the heat-generating electrical component. The cold plate has an inlet coupler on an opposite top surface to receive coolant; an internal conduit to circulate the received coolant; and an outlet coupler on the opposite top surface to return the coolant. A flexible metal inlet tube is fluidly connected to the inlet coupler to supply coolant. A flexible metal outlet tube is fluidly connected to the outlet coupler to return coolant.
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公开(公告)号：US10295767B2
公开(公告)日：2019-05-21
申请号：US15876572
申请日：2018-01-22
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung Chen , Yu-Nien Huang , Kuen-Hsien Wu , Kuo-Wei Lee
IPC: G02B6/42
Abstract: A transceiver cage and heat sink assembly for an optical switch is disclosed. A transceiver cage has an open front end to receive an optical transceiver and an opposite rear end. A front heat sink is mounted over the transceiver cage that includes a thermal interface material to contact a contact surface of an optical transceiver. A printed circuit board has a connector electronic circuit to receive a connector on the optical transceiver. A rear heat sink has a beveled surface facing the rear end of the transceiver cage. A cam structure in the front heat sink forces the transceiver into contact with the front heat sink. A metal foil layer is coated on the thermal interface material.
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公开(公告)号：US11197396B2
公开(公告)日：2021-12-07
申请号：US16752367
申请日：2020-01-24
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung Chen , Yu-Nien Huang , Tsung-Ta Li , Kuo-Wei Lee
Abstract: An equipment assembly for cooling heat-generating electrical components is disclosed. The assembly includes a housing for containing a heat-generating electrical component. The housing includes an open end having a planar area. A closed-loop liquid cooling system includes a liquid coolant conduit in proximity to the heat-generating electrical component. The conduit allows circulation of a liquid coolant to extract heat from the heat-generating electrical component. A heat exchanger is fluidly coupled to the liquid coolant conduit to extract heat from circulated liquid coolant within the heat exchanger. The heat exchanger includes a shaped front facing the open end of the housing. The surface area of the shaped front is greater than the planar area of the open end. An air flow system propels ambient air through the shaped front of the heat exchanger.
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公开(公告)号：US10368464B2
公开(公告)日：2019-07-30
申请号：US15783043
申请日：2017-10-13
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung Chen , Yu-Nien Huang , Kuen-Hsien Wu , Kuo-Wei Lee
Abstract: A heat dissipating apparatus for cooling a transceiver is provided. The apparatus includes a cooling jacket configured to receive the transceiver. The transceiver is secured within the cooling jacket via a connecting structure. The apparatus also includes cooling devices secured to an exterior surface of the cooling jacket, the plurality of cooling devices comprising a highly thermal conductivity material. The apparatus also includes a heat dissipation device connected to a distal end of each of the plurality of cooling devices.
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