公开(公告)号：US09381599B2

公开(公告)日：2016-07-05

申请号：US14279610

申请日：2014-05-16

Applicant: Quanta Computer Inc.

Inventor： Chi-Hsueh Yang ,  Ming-Chang Tsai ,  Wei-Han Chen ,  Hsiao-Fan Chang

IPC: B23P15/26 ,  F28D15/02 ,  F28D15/04 ,  H01L23/427 ,  H01L21/48

CPC classification number: B23P15/26 ,  B23P2700/09 ,  F28D15/0233 ,  F28D15/0275 ,  F28D15/04 ,  H01L21/4882 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

Abstract: A manufacturing method of a heat dissipation assembly includes the following steps: an accommodating concave portion and hollow areas are formed on a board body, and the hollow areas are through the board body located in the accommodating concave portion. The board body located in the accommodating concave portion is extended, such that the hollow areas are closed by the board body adjacent to the hollow areas. A heat pipe is placed in the accommodating concave portion, and the width of the heat pipe and the width of the accommodating concave portion are substantially the same. A stamping treatment is performed on the board body surrounding the accommodating concave portion to form positioning protruding portions, and the positioning protruding portions protrude toward the accommodating concave portion, such that the heat pipe is fixed between the positioning protruding portions and the accommodating concave portion.

Abstract translation: 散热组件的制造方法包括以下步骤：在板体上形成容纳凹部和中空区域，并且中空区域穿过位于容纳凹部中的板体。 位于容纳凹部中的板体延伸，使得中空区域被板体靠近中空区域封闭。 热管被放置在容纳凹部中，并且热管的宽度和容纳凹部的宽度基本相同。 在容纳凹部周围的板体上进行冲压处理，形成定位突出部，并且定位突出部朝向容纳凹部突出，使得热管固定在定位突出部和容纳凹部之间。