公开(公告)号：US09515484B2

公开(公告)日：2016-12-06

申请号：US13910656

申请日：2013-06-05

Applicant: Rockwell Automation Technologies, Inc.

Inventor： Rongjun Huang ,  Craig Winterhalter ,  Mark Gries ,  Ye Li

IPC: H02J1/08 ,  H02J1/06 ,  H02M1/14 ,  H02M7/493 ,  H02M1/00

CPC classification number: H02J1/06 ,  H02M1/14 ,  H02M7/493 ,  H02M2001/008 ,  Y10T307/258

Abstract: A system configured to reduce the amplitude of reactive current present on a DC bus shared by multiple inverters is disclosed. The start of the switching period for the modulation routines of each inverter is synchronized, and a carrier phase angle is determined for a carrier signal within each of the inverters. The modulation routine of each inverter generates a reactive current on the shared DC bus. By controlling the carrier phase angle for each inverter, the reactive current of a first inverter may be generated at a phase angle that is offset from the phase angle of the reactive current generated by a second inverter. As a result, the reactive current from the first inverter cancels at least a portion of the reactive current from the second inverter, reducing the total reactive current present on the DC bus.

Abstract translation: 公开了一种被配置为减小由多个逆变器共享的DC总线上存在的无功电流的幅度的系统。 每个逆变器的调制程序的开关周期的开始同步，并且确定每个逆变器内的载波信号的载波相位角。 每个逆变器的调制程序在共享的直流总线上产生无功电流。 通过控制每个逆变器的载波相位角，可以以与由第二反相器产生的无功电流的相位角偏离的相位角产生第一反相器的无功电流。 因此，来自第一反相器的无功电流抵消来自第二反相器的无功电流的至少一部分，从而减小DC总线上存在的总无功电流。

公开(公告)号：US20140354206A1

公开(公告)日：2014-12-04

申请号：US14459542

申请日：2014-08-14

Applicant: Rockwell Automation Technologies, Inc.

Inventor： Zoran Vrankovic ,  Rongjun Huang ,  Mark Cooper ,  David M. Brod

IPC: H02K11/00

CPC classification number: H02K11/0094 ,  H02K11/25 ,  H02K11/33

Abstract: A system to monitor the temperature of power electronic devices in a motor drive includes a base plate defining a planar surface on which the electronic devices and/or circuit boards within the motor drive may be mounted. The power electronic devices are mounted to the base plate through the direct bond copper (DBC). A circuit board is mounted to the base plate which includes a temperature sensor mounted on the circuit board proximate to the power electronic devices. The temperature sensor generates a digital signal corresponding to the temperature measured by the sensor. A copper pad is included between each layer of the circuit board and between the first layer of the circuit board and the sensor. The circuit board also includes vias extending through each layer of the board. The copper pads and vias establish a thermally conductive path between the temperature sensor and the base plate.

公开(公告)号：US20140361613A1

公开(公告)日：2014-12-11

申请号：US13910656

申请日：2013-06-05

Applicant: Rockwell Automation Technologies, Inc.

Inventor： Rongjun Huang ,  Craig Winterhalter ,  Mark Gries ,  Ye Li

IPC: H02J1/06

CPC classification number: H02J1/06 ,  H02M1/14 ,  H02M7/493 ,  H02M2001/008 ,  Y10T307/258

Abstract: A system configured to reduce the amplitude of reactive current present on a DC bus shared by multiple inverters is disclosed. The start of the switching period for the modulation routines of each inverter is synchronized, and a carrier phase angle is determined for a carrier signal within each of the inverters. The modulation routine of each inverter generates a reactive current on the shared DC bus. By controlling the carrier phase angle for each inverter, the reactive current of a first inverter may be generated at a phase angle that is offset from the phase angle of the reactive current generated by a second inverter. As a result, the reactive current from the first inverter cancels at least a portion of the reactive current from the second inverter, reducing the total reactive current present on the DC bus.

Abstract translation: 公开了一种被配置为减小由多个逆变器共享的DC总线上存在的无功电流的幅度的系统。 每个逆变器的调制程序的开关周期的开始同步，并且确定每个逆变器内的载波信号的载波相位角。 每个逆变器的调制程序在共享的直流总线上产生无功电流。 通过控制每个逆变器的载波相位角，可以以与由第二反相器产生的无功电流的相位角偏离的相位角产生第一反相器的无功电流。 因此，来自第一反相器的无功电流抵消来自第二反相器的无功电流的至少一部分，从而减小DC总线上存在的总无功电流。

公开(公告)号：US20140265741A1

公开(公告)日：2014-09-18

申请号：US13795594

申请日：2013-03-12

Applicant: ROCKWELL AUTOMATION TECHNOLOGIES, INC.

Inventor： Zoran Vrankovic ,  Rongjun Huang ,  Mark Cooper ,  David M. Brod

IPC: H02K11/00

CPC classification number: H02K11/0094 ,  H02K11/25 ,  H02K11/33

Abstract: A system to monitor the temperature of power electronic devices in a motor drive includes a base plate defining a planar surface on which the electronic devices and/or circuit boards within the motor drive may be mounted. The power electronic devices are mounted to the base plate through the direct bond copper (DBC). A circuit board is mounted to the base plate which includes a temperature sensor mounted on the circuit board proximate to the power electronic devices. The temperature sensor generates a digital signal corresponding to the temperature measured by the sensor. A copper pad is included between each layer of the circuit board and between the first layer of the circuit board and the sensor. The circuit board also includes vias extending through each layer of the board. The copper pads and vias establish a thermally conductive path between the temperature sensor and the base plate.

Abstract translation: 用于监测电动机驱动器中的电力电子设备的温度的系统包括限定平面的基板，电机驱动器内的电子设备和/或电路板可以安装在该平面上。 功率电子器件通过直接接合铜（DBC）安装到基板上。 电路板安装在基板上，该基板包括安装在靠近电力电子设备的电路板上的温度传感器。 温度传感器产生对应于由传感器测量的温度的数字信号。 电路板的各层之间以及电路板的第一层和传感器之间包括铜焊盘。 电路板还包括延伸穿过板的每一层的通孔。 铜焊盘和通孔在温度传感器和基板之间建立导热路径。

公开(公告)号：US09263928B2

公开(公告)日：2016-02-16

申请号：US14459542

申请日：2014-08-14

Applicant: Rockwell Automation Technologies, Inc.

Inventor： Zoran Vrankovic ,  Rongjun Huang ,  Mark Cooper ,  David M Brod

IPC: H02P31/00 ,  H02P7/00 ,  H02K11/00

CPC classification number: H02K11/0094 ,  H02K11/25 ,  H02K11/33

Abstract: A system to monitor the temperature of power electronic devices in a motor drive includes a base plate defining a planar surface on which the electronic devices and/or circuit boards within the motor drive may be mounted. The power electronic devices are mounted to the base plate through the direct bond copper (DBC). A circuit board is mounted to the base plate which includes a temperature sensor mounted on the circuit board proximate to the power electronic devices. The temperature sensor generates a digital signal corresponding to the temperature measured by the sensor. A copper pad is included between each layer of the circuit board and between the first layer of the circuit board and the sensor. The circuit board also includes vias extending through each layer of the board. The copper pads and vias establish a thermally conductive path between the temperature sensor and the base plate.

Abstract translation: 用于监测电动机驱动器中的电力电子设备的温度的系统包括限定平面的基板，电机驱动器内的电子设备和/或电路板可以安装在该平面上。 功率电子器件通过直接接合铜（DBC）安装到基板上。 电路板安装在基板上，该基板包括安装在靠近电力电子设备的电路板上的温度传感器。 温度传感器产生对应于由传感器测量的温度的数字信号。 电路板的各层之间以及电路板的第一层和传感器之间包括铜焊盘。 电路板还包括延伸穿过板的每一层的通孔。 铜焊盘和通孔在温度传感器和基板之间建立导热路径。

公开(公告)号：US20140320048A1

公开(公告)日：2014-10-30

申请号：US13870550

申请日：2013-04-25

Applicant: ROCKWELL AUTOMATION TECHNOLOGIES, INC.

Inventor： Zoran Vrankovic ,  Rongjun Huang ,  Mark Cooper

IPC: H02K11/02 ,  H02P6/14

CPC classification number: H02K11/02 ,  H02K11/33 ,  H02P29/50

Abstract: A motor drive, configured to be mounted to a motor, includes improvements to input circuits configured to receive and/or transfer power within the motor drive to reduce emissions over prior art motor drives. According to a first embodiment of the invention, the motor drive includes a voltage balancing circuit which utilizes surface mount capacitors having a voltage rating of at least 2772 VDC and, preferably, of at least 5000 VDC. According to another embodiment of the invention, the power supply includes a planar transformer wherein the primary and the secondary coils are uniformly formed by traces on the circuit board.

Abstract translation: 配置为安装到电动机的电动机驱动器包括对配置成在电动机驱动器内接收和/或传递动力以减少超过现有技术的电动机驱动器的排放的输入电路的改进。 根据本发明的第一实施例，电机驱动器包括电压平衡电路，该电压平衡电路利用具有至少2772VDC的电压额定值，并且优选地至少为5000VDC的表面贴装电容器。 根据本发明的另一实施例，电源包括平面变压器，其中初级线圈和次级线圈由电路板上的迹线均匀地形成。

公开(公告)号：US08829839B1

公开(公告)日：2014-09-09

申请号：US13795594

申请日：2013-03-12

Applicant: Rockwell Automation Technologies, Inc.

Inventor： Zoran Vrankovic ,  Rongjun Huang ,  Mark Cooper ,  David M. Brod

IPC: H02P31/00 ,  H02P7/00 ,  H02K11/00

CPC classification number: H02K11/0094 ,  H02K11/25 ,  H02K11/33

Abstract: A system to monitor the temperature of power electronic devices in a motor drive includes a base plate defining a planar surface on which the electronic devices and/or circuit boards within the motor drive may be mounted. The power electronic devices are mounted to the base plate through the direct bond copper (DBC). A circuit board is mounted to the base plate which includes a temperature sensor mounted on the circuit board proximate to the power electronic devices. The temperature sensor generates a digital signal corresponding to the temperature measured by the sensor. A copper pad is included between each layer of the circuit board and between the first layer of the circuit board and the sensor. The circuit board also includes vias extending through each layer of the board. The copper pads and vias establish a thermally conductive path between the temperature sensor and the base plate.

Abstract translation: 用于监测电动机驱动器中的电力电子设备的温度的系统包括限定平面的基板，电机驱动器内的电子设备和/或电路板可以安装在该平面上。 功率电子器件通过直接接合铜（DBC）安装到基板上。 电路板安装在基板上，该基板包括安装在靠近电力电子设备的电路板上的温度传感器。 温度传感器产生对应于由传感器测量的温度的数字信号。 电路板的各层之间以及电路板的第一层和传感器之间包括铜焊盘。 电路板还包括延伸穿过板的每一层的通孔。 铜焊盘和通孔在温度传感器和基板之间建立导热路径。