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公开(公告)号：US20220250334A1
公开(公告)日：2022-08-11
申请号：US17172523
申请日：2021-02-10
Applicant: Raytheon Company
Inventor： Wenping Zhao , Lei Xing , Danielle Grolman , Orlando Mijares , Mary K. Herndon , Sridhar Siddhamalli
Abstract: A joint between dissimilar thermoplastic materials comprising a first thermoplastic material layer; a second thermoplastic material layer having a melting point temperature different from a melting point temperature of the first thermoplastic material layer; and an interface layer coupled between the first thermoplastic material layer and the second thermoplastic material layer; wherein the interface layer is configured to join the first thermoplastic material layer and the second thermoplastic material layer together to form the joint, wherein the interface layer comprises a melting point temperature having a value selected from the group consisting of between the melting point temperature of the first thermoplastic material layer and the melting point temperature of the second thermoplastic material layer; or lower than the melting point temperature of the first thermoplastic material layer and the melting point temperature of the second thermoplastic material layer.
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公开(公告)号：US20240351295A1
公开(公告)日：2024-10-24
申请号：US18645597
申请日：2024-04-25
Applicant: Raytheon Company
Inventor： Wenping Zhao , Lei Xing , Danielle Grolman , Orlando Mijares , Mary K. Herndon , Sridhar Siddhamalli
CPC classification number: B29C66/73116 , B29C65/02 , B29C66/712 , B29C66/721 , B29C66/7311 , B32B27/08 , B32B27/288 , B32B27/365 , B29C66/70 , B32B2250/03 , B32B2250/24 , B32B2307/30
Abstract: A joint between dissimilar thermoplastic materials comprising a first thermoplastic material layer; a second thermoplastic material layer having a melting point temperature different from a melting point temperature of the first thermoplastic material layer; and an interface layer coupled between the first thermoplastic material layer and the second thermoplastic material layer; wherein the interface layer is configured to join the first thermoplastic material layer and the second thermoplastic material layer together to form the joint, wherein the interface layer comprises a melting point temperature having a value selected from the group consisting of between the melting point temperature of the first thermoplastic material layer and the melting point temperature of the second thermoplastic material layer; or lower than the melting point temperature of the first thermoplastic material layer and the melting point temperature of the second thermoplastic material layer.
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公开(公告)号：US11993026B2
公开(公告)日：2024-05-28
申请号：US17172523
申请日：2021-02-10
Applicant: Raytheon Company
Inventor： Wenping Zhao , Lei Xing , Danielle Grolman , Orlando Mijares , Mary K. Herndon , Sridhar Siddhamalli
CPC classification number: B29C66/73116 , B29C65/02 , B29C66/712 , B29C66/721 , B29C66/7311 , B32B27/08 , B32B27/288 , B32B27/365 , B29C66/70 , B32B2250/03 , B32B2250/24 , B32B2307/30
Abstract: A joint between dissimilar thermoplastic materials comprising a first thermoplastic material layer; a second thermoplastic material layer having a melting point temperature different from a melting point temperature of the first thermoplastic material layer; and an interface layer coupled between the first thermoplastic material layer and the second thermoplastic material layer; wherein the interface layer is configured to join the first thermoplastic material layer and the second thermoplastic material layer together to form the joint, wherein the interface layer comprises a melting point temperature having a value selected from the group consisting of between the melting point temperature of the first thermoplastic material layer and the melting point temperature of the second thermoplastic material layer; or lower than the melting point temperature of the first thermoplastic material layer and the melting point temperature of the second thermoplastic material layer.
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