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公开(公告)号：US20220250334A1
公开(公告)日：2022-08-11
申请号：US17172523
申请日：2021-02-10
申请人： Raytheon Company
发明人： Wenping Zhao , Lei Xing , Danielle Grolman , Orlando Mijares , Mary K. Herndon , Sridhar Siddhamalli
摘要： A joint between dissimilar thermoplastic materials comprising a first thermoplastic material layer; a second thermoplastic material layer having a melting point temperature different from a melting point temperature of the first thermoplastic material layer; and an interface layer coupled between the first thermoplastic material layer and the second thermoplastic material layer; wherein the interface layer is configured to join the first thermoplastic material layer and the second thermoplastic material layer together to form the joint, wherein the interface layer comprises a melting point temperature having a value selected from the group consisting of between the melting point temperature of the first thermoplastic material layer and the melting point temperature of the second thermoplastic material layer; or lower than the melting point temperature of the first thermoplastic material layer and the melting point temperature of the second thermoplastic material layer.
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公开(公告)号：US20240327648A1
公开(公告)日：2024-10-03
申请号：US18129506
申请日：2023-03-31
申请人： Raytheon Company
发明人： Danielle L. Grolman , Wenping Zhao , Laura A. Cuthbert , Derrick J. Rockosi , Mary K. Herndon , Peter J. Walsh
IPC分类号： C09D5/00 , C09D7/40 , C09D7/61 , C09D163/00 , C09D175/04 , H01Q1/42
CPC分类号： C09D5/002 , C09D7/61 , C09D7/67 , C09D7/68 , C09D163/00 , C09D175/04 , H01Q1/422
摘要： An article transparent to radiofrequency (RF) signals includes a substrate and a coating arrangement on the substrate. The coating arrangement includes a primer applied to and in physical contact with the substrate, a topcoat applied to and in physical contact with the primer layer, the topcoat including an organic polymer material, and nanoparticles dispersed throughout one of the primer and the topcoat. A content of the nanoparticles ranges from 0.1 wt % to 10 wt %.
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公开(公告)号：US20240351295A1
公开(公告)日：2024-10-24
申请号：US18645597
申请日：2024-04-25
申请人： Raytheon Company
发明人： Wenping Zhao , Lei Xing , Danielle Grolman , Orlando Mijares , Mary K. Herndon , Sridhar Siddhamalli
CPC分类号： B29C66/73116 , B29C65/02 , B29C66/712 , B29C66/721 , B29C66/7311 , B32B27/08 , B32B27/288 , B32B27/365 , B29C66/70 , B32B2250/03 , B32B2250/24 , B32B2307/30
摘要： A joint between dissimilar thermoplastic materials comprising a first thermoplastic material layer; a second thermoplastic material layer having a melting point temperature different from a melting point temperature of the first thermoplastic material layer; and an interface layer coupled between the first thermoplastic material layer and the second thermoplastic material layer; wherein the interface layer is configured to join the first thermoplastic material layer and the second thermoplastic material layer together to form the joint, wherein the interface layer comprises a melting point temperature having a value selected from the group consisting of between the melting point temperature of the first thermoplastic material layer and the melting point temperature of the second thermoplastic material layer; or lower than the melting point temperature of the first thermoplastic material layer and the melting point temperature of the second thermoplastic material layer.
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公开(公告)号：US11993026B2
公开(公告)日：2024-05-28
申请号：US17172523
申请日：2021-02-10
申请人： Raytheon Company
发明人： Wenping Zhao , Lei Xing , Danielle Grolman , Orlando Mijares , Mary K. Herndon , Sridhar Siddhamalli
CPC分类号： B29C66/73116 , B29C65/02 , B29C66/712 , B29C66/721 , B29C66/7311 , B32B27/08 , B32B27/288 , B32B27/365 , B29C66/70 , B32B2250/03 , B32B2250/24 , B32B2307/30
摘要： A joint between dissimilar thermoplastic materials comprising a first thermoplastic material layer; a second thermoplastic material layer having a melting point temperature different from a melting point temperature of the first thermoplastic material layer; and an interface layer coupled between the first thermoplastic material layer and the second thermoplastic material layer; wherein the interface layer is configured to join the first thermoplastic material layer and the second thermoplastic material layer together to form the joint, wherein the interface layer comprises a melting point temperature having a value selected from the group consisting of between the melting point temperature of the first thermoplastic material layer and the melting point temperature of the second thermoplastic material layer; or lower than the melting point temperature of the first thermoplastic material layer and the melting point temperature of the second thermoplastic material layer.
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