公开(公告)号：US20040253804A1

公开(公告)日：2004-12-16

申请号：US10816627

申请日：2004-04-02

Applicant: Rohm and Haas Electronic Materials, L.L.C.

Inventor： Rozalia Beica ,  Neil D. Brown ,  Kai Wang

IPC: H01L021/00 ,  H01L021/44 ,  C25D013/00 ,  G01L001/20

CPC classification number: C25D3/60 ,  H01L2224/11

Abstract: Disclosed are electrolyte compositions for depositing a tin alloy on a substrate. The electrolyte compositions include tin ions, ions of one or more alloying metals, an acid, a thiourea derivative, and an additive selected from alkanol amines, polyethylene imines, alkoxylated aromatic alcohols, and combinations thereof. Also disclosed are methods of depositing a tin alloy on a substrate and methods of forming an interconnect bump on a semiconductor device.

Abstract translation: 公开了用于在基材上沉积锡合金的电解质组合物。 电解质组合物包括锡离子，一种或多种合金金属的离子，酸，硫脲衍生物和选自烷醇胺，聚乙烯亚胺，烷氧基化芳族醇及其组合的添加剂。 还公开了在基板上沉积锡合金的方法以及在半导体器件上形成互连凸点的方法。