专利检索 ap:("Russell S. Aoki" OR "John W. Jaeger" OR "Michael S. Brazel" OR "Daniel P. Carter" OR "Anthony P. Valpiani" OR "Michael R. Hui" OR "Rashelle Yee" OR "Joseph J. Jasniewski" OR "Shelby A. Ferguson" OR "Thomas A. Boyd" OR "Jonathan W. Thibado" OR "Penny K. Woodcock" OR "Rachel G. Taylor" OR "Laura S. Mortimer") AND inv:"Rachel G. Taylor" 第 1 页

1.

发明申请
BULK SOLDER REMOVAL ON PROCESSOR PACKAGING 审中-公开

公开(公告)号：US20170179066A1

公开(公告)日：2017-06-22

申请号：US14974881

申请日：2015-12-18

申请人： Russell S. Aoki , John W. Jaeger , Michael S. Brazel , Daniel P. Carter , Anthony P. Valpiani , Michael R. Hui , Rashelle Yee , Joseph J. Jasniewski , Shelby A. Ferguson , Thomas A. Boyd , Jonathan W. Thibado , Penny K. Woodcock , Rachel G. Taylor , Laura S. Mortimer

发明人： Russell S. Aoki , John W. Jaeger , Michael S. Brazel , Daniel P. Carter , Anthony P. Valpiani , Michael R. Hui , Rashelle Yee , Joseph J. Jasniewski , Shelby A. Ferguson , Thomas A. Boyd , Jonathan W. Thibado , Penny K. Woodcock , Rachel G. Taylor , Laura S. Mortimer

IPC分类号： H01L23/00 , B23K3/02

CPC分类号： B23K3/029 , H01L2924/15311

摘要： Reflow Grid Array technology may be implemented on an interposer device, where the interposer is placed between a motherboard and a BGA package. The interposer may provide a controlled heat source to reflow solder between the interposer and the BGA package. A technical problem faced by an interposer using RGA technology is solder cleaning and removal when removing a BGA package. Technical solutions described herein provide processes and equipment for bulk solder removal from a BGA package that can be executed in the field.