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公开(公告)号：US20170179066A1
公开(公告)日：2017-06-22
申请号：US14974881
申请日：2015-12-18
申请人： Russell S. Aoki , John W. Jaeger , Michael S. Brazel , Daniel P. Carter , Anthony P. Valpiani , Michael R. Hui , Rashelle Yee , Joseph J. Jasniewski , Shelby A. Ferguson , Thomas A. Boyd , Jonathan W. Thibado , Penny K. Woodcock , Rachel G. Taylor , Laura S. Mortimer
发明人： Russell S. Aoki , John W. Jaeger , Michael S. Brazel , Daniel P. Carter , Anthony P. Valpiani , Michael R. Hui , Rashelle Yee , Joseph J. Jasniewski , Shelby A. Ferguson , Thomas A. Boyd , Jonathan W. Thibado , Penny K. Woodcock , Rachel G. Taylor , Laura S. Mortimer
CPC分类号： B23K3/029 , H01L2924/15311
摘要： Reflow Grid Array technology may be implemented on an interposer device, where the interposer is placed between a motherboard and a BGA package. The interposer may provide a controlled heat source to reflow solder between the interposer and the BGA package. A technical problem faced by an interposer using RGA technology is solder cleaning and removal when removing a BGA package. Technical solutions described herein provide processes and equipment for bulk solder removal from a BGA package that can be executed in the field.
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公开(公告)号：US20170179069A1
公开(公告)日：2017-06-22
申请号：US14974807
申请日：2015-12-18
CPC分类号： H01L24/81 , B23K1/0016 , B23K1/008 , B23K1/19 , B23K1/206 , B23K3/06 , B23K3/0638 , B23K3/082 , B23K2101/42 , H01L23/345 , H01L23/49816 , H01L24/75 , H01L2224/81007 , H01L2224/81024 , H01L2224/81035 , H01L2224/81234 , H01L2224/81815 , H01L2924/15321 , H05K3/1225 , H05K3/3436 , H05K2201/10378 , H05K2203/166
摘要： Reflow Grid Array (RGA) technology may be implemented on an interposer device, where the interposer is placed between a motherboard and a ball grid array (BGA) package. The interposer may provide a controlled heat source to reflow solder between the interposer and the BGA package. A technical problem faced by an interposer using RGA technology is application of solder to the RGA interposer. Technical solutions described herein provide processes and equipment for application of solder and formation of solder balls to connect an RGA interposer to a BGA package.
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公开(公告)号：US20140162473A1
公开(公告)日：2014-06-12
申请号：US13711345
申请日：2012-12-11
CPC分类号： H05K3/30 , H05K3/301 , H05K7/1061 , H05K2201/10325 , H05K2201/2018 , Y10T29/4913
摘要： A mobile device assembly comprising a land grid array (LGA) socket configured to couple with a board of a mobile device. The LGA socket may be configured to couple with a component of the mobile device. A mobile independent loading mechanism (ILM) may at least partially overlap the component and couple with the board of the mobile device via one or more fasteners. By coupling with the board of the mobile device, the mobile ILM may therefore apply pressure to the component, securely holding the component to the LGA socket.
摘要翻译： 一种移动设备组件，包括被配置为与移动设备的板耦合的平面栅格阵列（LGA）插座。 LGA插座可以被配置为与移动设备的组件耦合。 移动式独立装载机构（ILM）可以至少部分地与部件重叠并且经由一个或多个紧固件与移动装置的板耦合。 通过与移动设备的板耦合，移动ILM可以因此向组件施加压力，将组件牢固地保持在LGA插座上。
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4.发明申请INTEGRATED TRANSLATIONAL LAND-GRID ARRAY SOCKETS AND LOADING MECHANISMS FOR SEMICONDUCTIVE DEVICES 审中-公开集成式翻译区域阵列插座和半导体器件的加载机制公开(公告)号：US20140082915A1
公开(公告)日：2014-03-27
申请号：US14090493
申请日：2013-11-26
IPC分类号： G06F1/16
CPC分类号： G06F1/16 , H01R13/193 , H05K7/1007 , Y10T29/49826
摘要： A land-grid array die package socket is configured for low- or zero insertion-force assembly with a land-grid array die package. For zero insertion-force assembly, a motion plate applies a force on a land-grid array contact that causes a contact tip to move into protective cover while the die package is inserted into the socket. After zero insertion-force assembly, the motion plate applies a force on the land-grid array contact that causes the contact tip to deflect in a positive-Z direction until a useful contact is made at the contact tip with a land-grid array pad.
摘要翻译： 地面阵列阵列封装插座被配置为具有地平线阵列管芯封装的低或零插入力组件。 对于零插入力组件，运动板在地面栅格阵列触点上施加力，当模具封装插入插座时，导致接触尖端移动到保护盖中。 在零插入力组件之后，运动板在地面栅格阵列接触件上施加力，其使得接触尖端以正Z方向偏转，直到在接地尖端处与平台栅格阵列垫片进行有用的接触 。
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5.发明申请INTEGRATED TRANSLATIONAL LAND-GRID ARRAY SOCKETS AND LOADING MECHANISMS FOR SEMICONDUCTIVE DEVICES 有权集成式翻译区域阵列插座和半导体器件的加载机制公开(公告)号：US20120200993A1
公开(公告)日：2012-08-09
申请号：US13024032
申请日：2011-02-09
CPC分类号： G06F1/16 , H01R13/193 , H05K7/1007 , Y10T29/49826
摘要： A land-grid array die package socket is configured for low- or zero insertion-force assembly with a land-grid array die package. For zero insertion-force assembly, a motion plate applies a force on a land-grid array contact that causes a contact tip to move into protective cover while the die package is inserted into the socket. After zero insertion-force assembly, the motion plate applies a force on the land-grid array contact that causes the contact tip to deflect in a positive-Z direction until a useful contact is made at the contact tip with a land-grid array pad.
摘要翻译： 地面阵列阵列封装插座被配置为具有地平线阵列管芯封装的低或零插入力组件。 对于零插入力组件，运动板在地面栅格阵列触点上施加力，当模具封装插入插座时，导致接触尖端移动到保护盖中。 在零插入力组件之后，运动板在地面栅格阵列接触件上施加力，其使得接触尖端以正Z方向偏转，直到在接地尖端处与平台栅格阵列垫片进行有用的接触 。
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6.发明授权Integrated translational land-grid array sockets and loading mechanisms for semiconductive devices 有权用于半导体器件的集成平移式格栅阵列插座和加载机构公开(公告)号：US08622764B2
公开(公告)日：2014-01-07
申请号：US13024032
申请日：2011-02-09
IPC分类号： H01R13/625
CPC分类号： G06F1/16 , H01R13/193 , H05K7/1007 , Y10T29/49826
摘要： A land-grid array die package socket is configured for low- or zero insertion-force assembly with a land-grid array die package. For zero insertion-force assembly, a motion plate applies a force on a land-grid array contact that causes a contact tip to move into protective cover while the die package is inserted into the socket. After zero insertion-force assembly, the motion plate applies a force on the land-grid array contact that causes the contact tip to deflect in a positive-Z direction until a useful contact is made at the contact tip with a land-grid array pad.
摘要翻译： 地面阵列阵列封装插座被配置为具有地平线阵列管芯封装的低或零插入力组件。 对于零插入力组件，运动板在地面栅格阵列触点上施加力，当模具封装插入插座时，导致接触尖端移动到保护盖中。 在零插入力组件之后，运动板在地面栅格阵列接触件上施加力，其使得接触尖端以正Z方向偏转，直到在接地尖端处与平台栅格阵列垫片进行有用的接触 。
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公开(公告)号：US20080282775A1
公开(公告)日：2008-11-20
申请号：US12180733
申请日：2008-07-28
CPC分类号： H05K7/20272 , G01M3/228 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： According to some embodiments, a test fluid may be provided into a chamber associated with a cooling system for an electronic integrated circuit. Moreover, a valve may be partially inserted into an opening of the chamber to seal the chamber. The valve may include a first sealing portion to seal the chamber at the opening when the valve shaft is inserted the first distance. The valve may then be inserted an intermediate distance, between the first distance and a second distance, to unseal the chamber. Note that the valve may include a second sealing portion, offset from the first sealing portion, to seal the chamber at the opening when the valve is inserted the second distance. The valve may further define a passage, between the first and second sealing portions, to permit a flow of the test fluid when the valve is inserted the intermediate distance.
摘要翻译： 根据一些实施例，可以将测试流体提供到与用于电子集成电路的冷却系统相关联的室中。 此外，阀可以部分地插入到腔室的开口中以密封腔室。 阀可以包括第一密封部分，以在阀轴插入第一距离时将腔室密封在开口处。 然后，阀可以在第一距离和第二距离之间插入中间距离以开启腔室。 注意，阀可以包括从第一密封部分偏移的第二密封部分，以在阀插入第二距离时将腔室密封在开口处。 阀可以进一步限定在第一和第二密封部分之间的通道，以允许当阀插入中间距离时测试流体的流动。
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公开(公告)号：US07836748B2
公开(公告)日：2010-11-23
申请号：US12180733
申请日：2008-07-28
IPC分类号： G01P21/00
CPC分类号： H05K7/20272 , G01M3/228 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： According to some embodiments, a test fluid may be provided into a chamber associated with a cooling system for an electronic integrated circuit. Moreover, a valve may be partially inserted into an opening of the chamber to seal the chamber. The valve may include a first sealing portion to seal the chamber at the opening when the valve shaft is inserted the first distance. The valve may then be inserted an intermediate distance, between the first distance and a second distance, to unseal the chamber. Note that the valve may include a second sealing portion, offset from the first sealing portion, to seal the chamber at the opening when the valve is inserted the second distance. The valve may further define a passage, between the first and second sealing portions, to permit a flow of the test fluid when the valve is inserted the intermediate distance.
摘要翻译： 根据一些实施例，可以将测试流体提供到与用于电子集成电路的冷却系统相关联的室中。 此外，阀可以部分地插入到腔室的开口中以密封腔室。 阀可以包括第一密封部分，以在阀轴插入第一距离时将腔室密封在开口处。 然后，阀可以在第一距离和第二距离之间插入中间距离以开启腔室。 注意，阀可以包括从第一密封部分偏移的第二密封部分，以在阀插入第二距离时将腔室密封在开口处。 阀可以进一步限定在第一和第二密封部分之间的通道，以允许当阀插入中间距离时测试流体的流动。
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公开(公告)号：US07418998B2
公开(公告)日：2008-09-02
申请号：US11171607
申请日：2005-06-30
IPC分类号： F16K1/34
CPC分类号： H05K7/20272 , G01M3/228 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： According to some embodiments, a first sealing portion is provided on a valve shaft to seal a chamber. The first sealing portion may, for example, seal the chamber when the valve shaft is inserted a first distance into an opening of the chamber. A second sealing portion may also be provided on the valve shaft to seal the chamber when the valve shaft is inserted a second distance into the opening.
摘要翻译： 根据一些实施例，第一密封部分设置在阀轴上以密封腔室。 例如，当阀轴将第一距离插入腔室的开口时，第一密封部分可以例如密封腔室。 当阀轴在开口中插入第二距离时，也可以在阀轴上设置第二密封部分以密封腔室。
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公开(公告)号：US06934155B2
公开(公告)日：2005-08-23
申请号：US10460619
申请日：2003-06-11
CPC分类号： G06F1/20 , H01L23/4093 , H01L2924/0002 , Y10T24/42 , H01L2924/00
摘要： A fastener assembly including a base consisting of a pair of motherboard snaps on a first end and a hollow shaft on a second end, the motherboard snaps to be inserted through an aperture of a motherboard. The hollow shaft is inserted through an aperture of a heat sink clip. The base further includes a pair of grooves on an exterior of the shaft. The assembly further including a cap consisting of a hollow interior, an integrated post attached to a base of the interior, and a pair of cantilever snaps. The cap is fitted over the exterior surface of the hollow shaft of the base to secure the clip between the base and the cap. The integrated post of the cap to be inserted into the hollow shaft of the base to deflect the motherboard snaps outward on an opposite side of the motherboard aperture to secure the assembly with the motherboard. The cantilever snaps to be positioned in the grooves of the shaft of the base to secure the cap with the base.
摘要翻译： 一种紧固件组件，包括由第一端上的一对母板卡扣和第二端上的空心轴构成的基座，所述主板卡扣以插入通过主板的孔。 空心轴穿过散热片的孔插入。 基座还包括在轴的外部上的一对凹槽。 组件还包括由中空内部组成的盖，附接到内部的基部的一体式柱和一对悬臂卡扣。 盖子安装在基座的中空轴的外表面上，以将夹子固定在基座和盖子之间。 要插入基座的中空轴以使主板偏转的盖的整体柱在主板孔的相对侧向外卡扣，以将组件固定在主板上。 悬臂卡扣定位在基座的轴的槽中，以将盖与基座固定。
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