中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

4 records (took 0.022 seconds)

    POLYISOINDOLINONES, METHODS OF MANUFACTURE, AND COMPOSITIONS AND ARTICLES FORMED THEREFROM
    2.
    发明申请
    POLYISOINDOLINONES, METHODS OF MANUFACTURE, AND COMPOSITIONS AND ARTICLES FORMED THEREFROM 有权

    公开(公告)号：US20210189064A1

    公开(公告)日：2021-06-24

    申请号：US16093225

    申请日：2017-04-11

    Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

    Inventor： Dadasaheb V. PATIL ,  Prakash SISTA ,  Paul Dean SYBERT

    IPC: C08G65/40

    Abstract: A polyisoindolinone includes 1-100 mole percent of isoindolinone ether ketone units of the formula A; and 0-99 mole percent of arylene ether ketone units of the formula B wherein the variables are as defined herein; and wherein when the polyisoindolinone is a poly(isoindolinone ether ether ketone), it has a least one, preferably at least two, preferably all of the following properties: a glass transition temperature greater than 150° C., or 150-270° C. as determined by differential scanning calorimetry, less than 25 weight percent solubility at 23° C. in dichloromethane, orthodichlorobenzene, or chloroform, or substantially no blue phosphorescence in response to irradiation with ultraviolet light of 320-400 nm.

    HOMOGENEOUS AMORPHOUS HIGH HEAT EPOXY BLEND COMPOSITE COMPOSITIONS, ARTICLES, AND USES THEREOF
    3.
    发明申请
    HOMOGENEOUS AMORPHOUS HIGH HEAT EPOXY BLEND COMPOSITE COMPOSITIONS, ARTICLES, AND USES THEREOF 审中-公开

    公开(公告)号：US20190270844A1

    公开(公告)日：2019-09-05

    申请号：US16333099

    申请日：2017-03-13

    Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

    Inventor： Edward Norman PETERS ,  Prakash SISTA

    IPC: C08G59/24 ,  C08G59/26 ,  C08J5/04 ,  C08J5/24 ,  C08L63/10

    Abstract: A high heat epoxy prepreg, comprising a substrate; a high heat epoxy composition comprising: a hardener; a high heat epoxy mixture comprising: a high heat epoxy compound and an auxiliary epoxy compound different from the high heat epoxy compound; wherein the high heat epoxy mixture has a glass transition temperature between −10 C and 62 C, wherein the prepreg comprises 40 to 80 volume % substrate, and 60 to 20 volume % of the high heat epoxy composition, wherein the prepreg comprises 12 to 45 volume % of the high heat epoxy compound; wherein the high heat epoxy composition comprises 50 to 75 wt % of the high heat epoxy compound; and a cured, laminated sample of the prepreg has a maximum tensile stress of 800 MPa or greater, measured as per ASTM D 3039, and a modulus of 70 GPa or greater measured as per ASTM D 3039; and a cured sample of the high heat epoxy composition has a glass transition temperature greater than 200 C.

Patent Agency Ranking