公开(公告)号：US09299613B2

公开(公告)日：2016-03-29

申请号：US14324825

申请日：2014-07-07

Applicant: Samsung Display Co., Ltd. ,  Philoptics Co., Ltd.

Inventor： Il Young Jeong ,  Tae Yong Kim ,  Cheol Lae Roh ,  Je Kil Ryu ,  Jeong Hun Woo ,  Gyoo Wan Han ,  Ki Su Han ,  Tae Hyoung Cho ,  Jong Nam Moon

IPC: H01L21/78 ,  C03B33/09 ,  C03B33/02 ,  C03B33/07 ,  C03B33/08 ,  B23K26/06 ,  B23K26/38

CPC classification number: B44C1/228 ,  B23K26/0626 ,  B23K26/38 ,  C03B33/0222 ,  C03B33/07 ,  C03B33/082 ,  C03B33/091 ,  H01L21/78

Abstract: A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.

Abstract translation: 一种用于切割衬底的方法包括：作为第一激光辐射处理的一部分，朝向衬底的表面辐射激光，以在衬底中形成第一凹槽。 朝向表面辐射激光包括依次将激光朝向第一外部点（FOP），第二外部点（SOP），第一中间点（FIP），第二中间点（SIP）和第一外部点 切割点（FCP），每个点彼此间隔开一个或多个距离。 FCP对应于基板的切割线。 FOP和SOP分别设置在FCP的侧面。 FIP位于FCP和FOP之间。 SIP位于FCP和SOP之间。 相同种类和强度的激光辐射到每个点。

公开(公告)号：US09688094B2

公开(公告)日：2017-06-27

申请号：US14986973

申请日：2016-01-04

Applicant: Samsung Display Co., Ltd. ,  Philoptics Co., Ltd.

Inventor： Il Young Jeong ,  Tae Yong Kim ,  Cheol Lae Roh ,  Je Kil Ryu ,  Jeong Hun Woo ,  Gyoo Wan Han ,  Ki Su Han ,  Tae Hyoung Cho ,  Jong Nam Moon

IPC: B44C1/22 ,  C03B33/09 ,  C03B33/02 ,  C03B33/07 ,  C03B33/08 ,  H01L21/78 ,  B23K26/06 ,  B23K26/38

CPC classification number: B44C1/228 ,  B23K26/0626 ,  B23K26/38 ,  C03B33/0222 ,  C03B33/07 ,  C03B33/082 ,  C03B33/091 ,  H01L21/78

Abstract: A method for cutting a substrate includes: radiating, as part of a first laser radiating process, a laser towards a surface of the substrate to form a first groove in a substrate. Radiating the laser towards the surface includes radiating, in sequence, the laser towards a first outer point (FOP), a second outer point (SOP), a first intermediate point (FIP), a second intermediate point (SIP), and a first cut point (FCP) of the surface, each of the points being spaced apart from one another by one or more distances. The FCP corresponds to a cut line of the substrate. The FOP and the SOP are respectively disposed at lateral sides of the FCP. The FIP is disposed between the FCP and the FOP. The SIP is disposed between the FCP and the SOP. The same kind and intensity of laser is radiated towards each of the points.

公开(公告)号：US10726780B2

公开(公告)日：2020-07-28

申请号：US15945866

申请日：2018-04-05

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Chan Wook Shim ,  Wan Bae Park ,  Eun Chul Shin ,  Il Ho Lee ,  Cheol Gon Choi ,  Tae Yong Kim ,  Hyung Chul Kim

IPC: G09G3/3225

Abstract: An aging system includes panel groups each including display panels, an auxiliary board including the panel groups disposed thereon, and an aging device for supplying aging signals to the display panels through line boards to perform aging on the display panels, where the aging device supplies switch signals respectively to the display panels through the line boards, where each of the display panels includes a switch unit for supplying the aging signal to a pixel unit according to the switch signal.

公开(公告)号：US10600173B2

公开(公告)日：2020-03-24

申请号：US15290868

申请日：2016-10-11

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Yong-Hee Park ,  Noh Joong Park ,  Hyeon Suk Guak ,  Ki Hun Kim ,  Tae Yong Kim ,  Hye Jin Lee ,  Byung Jun Jeon ,  Young Il Jung

IPC: G01N21/958 ,  G06T7/00 ,  G01N21/88 ,  G06K9/46 ,  G06T7/60 ,  H04N5/225

Abstract: A multi-optic vision device includes a dark-vision lighting apparatus illuminating a defect on a subject and leaving regions that surround the defect dark. A bright-vision lighting apparatus illuminates the subject and the regions that surround the defect and leaving the defect dark. A differential-vision lighting apparatus illuminates the subject so as to stereoscopically show the defect on the subject. An area scan camera continuously imaging the subject as the dark-vision lighting apparatus, the bright-vision lighting apparatus, and the differential-vision lighting apparatus simultaneously and respectively provide light. A controller processes the image to respectively obtain a dark-vision image, a bright-vision image, and a differential-vision image of the subject.