公开(公告)号：US20240282529A1

公开(公告)日：2024-08-22

申请号：US18224669

申请日：2023-07-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Ah SONG ,  Bong Gyu CHOI ,  Kwang Dong SEONG ,  Jae Hoon BANG ,  Do Kyeong LEE ,  Wan Sik KIM

IPC: H01G4/232 ,  H01G4/248 ,  H01G4/30

CPC classification number: H01G4/2325 ,  H01G4/248 ,  H01G4/30

Abstract: Provided is a multilayer electronic component, the multilayer electronic component including: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer; an external electrode disposed on the body and connected to the internal electrodes, wherein the external electrode includes a metal including Cu, wherein the metal included in the external electrode has crystallites having a size of 70 nm or more and 100 nm or less, measured from a peak of a plane obtained from an X-ray diffraction pattern.