公开(公告)号：US20240282529A1

公开(公告)日：2024-08-22

申请号：US18224669

申请日：2023-07-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Ah SONG ,  Bong Gyu CHOI ,  Kwang Dong SEONG ,  Jae Hoon BANG ,  Do Kyeong LEE ,  Wan Sik KIM

IPC: H01G4/232 ,  H01G4/248 ,  H01G4/30

CPC classification number: H01G4/2325 ,  H01G4/248 ,  H01G4/30

Abstract: Provided is a multilayer electronic component, the multilayer electronic component including: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer; an external electrode disposed on the body and connected to the internal electrodes, wherein the external electrode includes a metal including Cu, wherein the metal included in the external electrode has crystallites having a size of 70 nm or more and 100 nm or less, measured from a peak of a plane obtained from an X-ray diffraction pattern.

公开(公告)号：US20230207215A1

公开(公告)日：2023-06-29

申请号：US17980880

申请日：2022-11-04

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Ah SONG ,  Bong Gyu CHOI ,  Kwang Dong SEONG

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01G4/012 ,  H01G4/1227 ,  H01B1/22

Abstract: A multilayer electronic component includes a body including a plurality of dielectric layers and internal electrodes disposed to oppose each other with the dielectric layers interposed therebetween; and external electrodes connected to the internal electrodes and including a plurality of conductive particles, wherein the plurality of conductive particles include first conductive particles, wherein the first conductive particles are plate-shaped conductive particles having a coating layer formed on a surface thereof, and wherein the coating layer includes Si, and an Si content is 0.3 at % or more and 2.0 at % or less, as compared to the plate-shaped conductive particles.