-
公开(公告)号：US12131868B2
公开(公告)日：2024-10-29
申请号：US17536710
申请日：2021-11-29
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Hyung Duk Yun , Ga Young An
Abstract: A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer and first and second internal electrodes disposed to be alternately stacked with the dielectric layer interposed therebetween; a first external electrode; and a second external electrode. The first external electrode includes a first electrode layer disposed to be in contact with the ceramic body, and a first conductive layer disposed on the first electrode layer. The second external electrode includes a second electrode layer disposed to be in contact with the ceramic body, and a second conductive layer disposed on the second electrode layer. The first conductive layer and the second conductive layer are plating layers. The first conductive layer and the second conductive layer are porous.
-
公开(公告)号：US20240312709A1
公开(公告)日：2024-09-19
申请号：US18675193
申请日：2024-05-28
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Tomohiro SASAKI
Abstract: A multilayer ceramic capacitor includes a multilayer body including first and second main surfaces, first and second side surfaces, and first and second end surfaces, first and second inner electrode layers on laminated dielectric layers and extending to the first and second end surfaces, first and second outer electrodes respectively on the first and second end surfaces, a third outer electrode on the first side surface, and a fourth outer electrode on the second side surface. The first inner electrode layers each have a first opposing portion facing the second inner electrode layers, a first extended portion extending from the first opposing portion to the first end surface, and a second extended portion extending from the first opposing portion to the second end surface. The second inner electrode layers each include first and second extension portions that are partially or entirely bent toward the second main surface.
-
公开(公告)号：US20240282529A1
公开(公告)日：2024-08-22
申请号：US18224669
申请日：2023-07-21
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Young Ah SONG , Bong Gyu CHOI , Kwang Dong SEONG , Jae Hoon BANG , Do Kyeong LEE , Wan Sik KIM
CPC classification number: H01G4/2325 , H01G4/248 , H01G4/30
Abstract: Provided is a multilayer electronic component, the multilayer electronic component including: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer; an external electrode disposed on the body and connected to the internal electrodes, wherein the external electrode includes a metal including Cu, wherein the metal included in the external electrode has crystallites having a size of 70 nm or more and 100 nm or less, measured from a peak of a plane obtained from an X-ray diffraction pattern.
-
公开(公告)号：US20240258035A1
公开(公告)日：2024-08-01
申请号：US18422495
申请日：2024-01-25
Applicant: Taiyo Yuden Co., Ltd.
Inventor： Yuji Tomizawa , Yasuhito Hagiwara
CPC classification number: H01G4/2325 , H01G4/224 , H01G4/248 , H01G4/306 , H01G4/12
Abstract: Provided is a multilayer ceramic electronic component including a ceramic element having a multilayer body in which internal electrodes are stacked with interposition of a dielectric layer and the internal electrodes are led out in a direction orthogonal to a stacking direction, and a protective part located at least on upper and lower surfaces of the multilayer body in the stacking direction, an underlying electrode layer formed at least on part of a surface of the protective part on either one or both of upper and lower sides in the stacking direction, a covering layer that covers an end part or a rim part of the underlying electrode layer, a plating layer that covers at least an upper surface of the underlying electrode layer, and at least a pair of external electrodes having the underlying electrode layer and the plating layer and being electrically connected to the internal electrodes.
-
公开(公告)号：US20240242887A1
公开(公告)日：2024-07-18
申请号：US18621196
申请日：2024-03-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kazuhiro NISHIBAYASHI , Yuko KAWASAKI
Abstract: When a multilayer ceramic capacitor is viewed as a section of a central portion in a width direction cut parallel or substantially parallel or substantially parallel or substantially parallel to a side surface, in an internal electrode layer in a central portion in a lamination direction and including an extremity spaced apart from an end surface, any one of five segments of the internal electrode layer that are horizontally and successively positioned from the extremity has a length greater than about 0.2 times of an average length of ten segments of the internal electrode layer that are horizontally and successively positioned in a central portion in a length direction.
-
Patent Agency Ranking
公开(公告)号：US20240222027A1
公开(公告)日：2024-07-04
申请号：US18516725
申请日：2023-11-21
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jihye Han , Hong Je Choi , Byungwoo Kang , Hyejin Park , Suyun Yun , Sangwook Lee , Jungmin Kim
CPC classification number: H01G4/2325 , H01G4/248 , H01G4/252 , H01G4/30
Abstract: Disclosed is a multilayered capacitor that includes a capacitor body including a dielectric layer and an internal electrode, and an external electrode outside the capacitor body, wherein the external electrode includes a first layer connected to the internal electrode, a second layer covering a portion of the first layer and exposing another portion, a third layer covering the second layer and including a resin and a conductive metal, and a fourth layer covering the first and third layers, and an area ratio of the resin included in the second layer is greater than an area ratio of the resin included in the third layer.
-
公开(公告)号：US20240212937A1
公开(公告)日：2024-06-27
申请号：US18143728
申请日：2023-05-05
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Kyung Sik KIM , Seung In BAIK , Jong Hwan LEE , Min Young CHOI
CPC classification number: H01G4/2325 , H01G4/248 , H01G4/30
Abstract: A multilayer electronic component includes a body including a dielectric layer and first and second internal electrodes alternately disposed in a first direction with the dielectric layer interposed therebetween, and having first and second surfaces in the first direction, third and fourth surfaces in a second direction, and fifth and sixth surfaces in a third direction; side margin portions disposed on the fifth and sixth surfaces; and external electrodes disposed on the third and fourth surfaces. Side margin portions includes BaTiO3, Zn, and Zr, an amount of Zn and an amount of Zr in the side margin portions are 0.5 mol or more and 1.0 mol or less, relative to 100 mol of Ti included in the side margin portions. The amount of Zn and the amount of Zr in the side margin portions are different from an amount of Zn and an amount of Zr in the dielectric layer.
-
公开(公告)号：US20240203643A1
公开(公告)日：2024-06-20
申请号：US18416983
申请日：2024-01-19
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Satoshi YOKOMIZO , Shinobu CHIKUMA , Yohei MUKOBATA
CPC classification number: H01G2/06 , H01G4/008 , H01G4/1227 , H01G4/2325 , H01G4/248 , H01G4/30
Abstract: An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at a pair of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. A mark portion is provided on one of the board main surfaces.
-
公开(公告)号：US20240170218A1
公开(公告)日：2024-05-23
申请号：US18422421
申请日：2024-01-25
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Taisuke KANZAKI , Kosuke ONISHI , Akitaka DOI
Abstract: A multilayer ceramic electronic component includes a multilayer body and an external electrode on each of both end surfaces of the multilayer body. The external electrode includes an underlying electrode layer and a plating layer that is disposed on the underlying electrode layer. The underlying electrode layer includes Ni as a first metal component, Sn as a second metal component, and a ceramic material, and includes an alloy portion that is provided around the ceramic material and includes an alloyed Ni defining the first metal component and an alloyed Sn defining the second metal component.
-
10.发明公开公开(公告)号：US20240170210A1
公开(公告)日：2024-05-23
申请号：US18426641
申请日：2024-01-30
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shinobu CHIKUMA
CPC classification number: H01G2/065 , H01G4/008 , H01G4/1227 , H01G4/248 , H01G4/30
Abstract: A multilayer ceramic capacitor includes a capacitor main body including a multilayer body in which dielectric layers and internal electrode layers are alternately laminated, and external electrodes respectively on two end surfaces of the multilayer body and connected to the internal electrode layers, an interposer at a board mounting surface of the capacitor main body, and an insulating resin film in a gap between the board mounting surface and a capacitor-facing surface of the interposer which is opposed to the board mounting surface.
-
-
-
-
-
-
-
-
-
Search Results
878
records
(took 0.02 seconds)
