公开(公告)号：US10104776B2

公开(公告)日：2018-10-16

申请号：US15341070

申请日：2016-11-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jang Seok Yun ,  Hyung Min Kim ,  Jin Man Han

IPC: H01C1/02 ,  H05K1/18 ,  H01C1/148 ,  H01C7/18 ,  H01C17/00 ,  H01C17/28 ,  H01C7/00 ,  H01C17/02 ,  H01C1/01 ,  H01C17/24 ,  H05K3/34

Abstract: A chip resistor element includes an insulating substrate, a resistor layer, first and second internal electrodes, a resistor protection layer, first and second electrode protection layers, and first and second external electrodes. The resistor layer is on the insulating substrate, the first and second internal electrodes are on respective sides of the resistor layer, and the resistor protection layer covers the resistor layer and extends onto portions of the internal electrodes. The first electrode protection layers are on the first and second internal electrodes so as to overlap with portions of the resistor protection layer and contain first conductive powder particles and resin, while the second electrode protection layers are disposed on the first electrode protection layers and contain second conductive powder particles and resin. A content of resin in the second electrode protection layer is lower than in the first electrode protection layer.

公开(公告)号：US10718672B2

公开(公告)日：2020-07-21

申请号：US15712920

申请日：2017-09-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Man Han ,  Yong Sung Kim ,  Sang Yeob Cha ,  Young Key Kim

IPC: G01K7/22 ,  H01L23/04 ,  G01K7/32 ,  H03B5/04 ,  H03H9/02 ,  H03B5/36 ,  H03H9/05 ,  H03H9/10 ,  H03H9/08 ,  G01K7/24 ,  H01L41/053

Abstract: A piezoelectric device package includes a board having a lower surface and an upper surface, a plurality of terminals disposed on the lower surface, a piezoelectric device disposed on the upper surface, a thermistor layer and a resistance layer disposed on the lower surface, and a cap lead covering an upper portion of the board.

公开(公告)号：US09691838B1

公开(公告)日：2017-06-27

申请号：US15229564

申请日：2016-08-05

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Man Han ,  Jang Seok Yun

IPC: H01C10/16 ,  H01L49/02

CPC classification number: H01L28/20

Abstract: A chip resistor includes a substrate having first and second electrodes disposed on one surface thereof to be separated from each other. A first resistor electrically connects the first electrode to the second electrode, and a second resistor electrically connects the first electrode to the second electrode. When temperatures of the first electrode and the second electrode are different from each other, thermo electromotive force generated from the first resistor is less than thermo electromotive force generated from the second resistor, and a temperature coefficient of resistivity (TCR) of the second resistor is lower than the TCR of the first resistor.