公开(公告)号：US20190252113A1

公开(公告)日：2019-08-15

申请号：US16041314

申请日：2018-07-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jin Ho KU ,  Kwi Jong LEE ,  Yoon Soo LEE ,  Won Joong KIM

IPC: H01F27/29 ,  H01F17/00 ,  H01F41/04

CPC classification number: H01F27/292 ,  H01F17/0013 ,  H01F17/0033 ,  H01F41/042 ,  H01F2017/048

Abstract: An electronic component includes a magnetic body including a resin and first magnetic powder and having a recess on a lower surface of the magnetic body, an internal coil portion embedded in the magnetic body, and external electrodes disposed on opposing ends of the magnetic body in a length direction of the magnetic body and connected to ends of the internal coil portion, wherein the first magnetic powder disposed on a surface of the recess may have a cut surface.